【摘要】：為檢測倒裝焊芯片在生產(chǎn)和服役過程中產(chǎn)生的焊球缺陷,提出了基于電、磁、熱多物理場的脈沖渦流熱成像檢測方法.該方法利用有限元COMSOL軟件建立焊球電磁感應(yīng)熱模型,并引入常見的焊球缺陷(空洞和裂紋)進(jìn)行仿真;提取焊球頂端的溫度分布,分析不同缺陷焊球的傳熱性能并進(jìn)行缺陷識別;仿真分析裂紋和空洞尺寸變化對溫度分布的影響,定量分析焊球缺陷.結(jié)果表明:在加熱結(jié)束時,裂紋(長200μm,高20μm)焊球、空洞(直徑150μm)焊球與正常焊球的頂端溫度差為一負(fù)一正,根據(jù)焊球頂端溫度的分布特征可以區(qū)別不同缺陷焊球,對于裂紋焊球,當(dāng)裂紋位置越靠近焊球頂端,溫度值越高;對于空洞焊球,空洞半徑從35μm增大到75μm時,焊球頂端溫度呈線性增加.
[Abstract]:In order to detect the defects of welding ball produced in the process of production and service, a method of pulsed eddy current thermal imaging based on electric, magnetic and thermal multi-physical fields is proposed. In this method, the electromagnetic induction heat model of solder ball is established by finite element COMSOL software, and the common defects (cavity and crack) are introduced to simulate. The temperature distribution at the top of the ball is extracted, the heat transfer performance of the ball with different defects is analyzed and the defect identification is carried out. The effect of the change of crack and cavity size on the temperature distribution is analyzed by simulation, and the defects of the ball are quantitatively analyzed. The results show that at the end of heating, the crack (200 渭 m long, 20 渭 m high) welding ball, the hole (150 渭 m diameter) welding ball and the normal ball tip temperature difference is negative and one positive. According to the distribution characteristics of the top temperature of the ball, different defect solder balls can be distinguished. For the crack soldering ball, the higher the temperature is, the closer the crack position is to the top of the weld ball. When the radius of cavity is increased from 35 渭 m to 75 渭 m, the temperature at the top of the ball increases linearly.
【作者單位】： 電子科技大學(xué)自動化工程學(xué)院;
【基金】：國家自然科學(xué)基金資助項目(61271035) 中央高校青年基金資助項目(ZYGX2013J090)
【分類號】：TN405

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本文編號：2312960