三模導(dǎo)航用倒裝焊聲表面波濾波器的研制
發(fā)布時(shí)間：2018-10-30 11:09
【摘要】：聲表面波濾波器是用來(lái)做信號(hào)處理用的電子器件,和其它濾波器功能一樣,去除干擾信號(hào),讓有用的信號(hào)傳輸通過(guò)。其工作原理是在器件的輸入端輸入電信號(hào),電信號(hào)激勵(lì)聲波,聲波在器件內(nèi)部處理后再還原為電信號(hào)。近年來(lái),隨著通訊事業(yè)的快速發(fā)展,對(duì)濾波器的需求越來(lái)越多。聲表面波濾波器具有很好的高頻性能、一致性好、尺寸小、適合量產(chǎn)等優(yōu)點(diǎn),使其發(fā)展越來(lái)越快,應(yīng)用領(lǐng)域也不斷擴(kuò)大,使得聲表面波器件越來(lái)越得到重視。第三代和第四代移動(dòng)通訊技術(shù)要求通訊系統(tǒng)向高頻、多模式方向發(fā)展,這給聲表面波濾波器帶來(lái)了更高的要求。高頻、寬帶、較低的插入損耗、較小的封裝尺寸成為近年來(lái)聲表面波濾波器研制的難點(diǎn)和熱點(diǎn)。目前移動(dòng)通訊市場(chǎng)上需求一款能滿足三種模式(CAMPASS,GPS,GLONASS)的手機(jī)導(dǎo)航用聲表面波濾波器,中心頻率為1575MHz,帶寬為40MHz,插入損耗小于1.8dB,封裝尺寸為1.1mm×0.9mm×0.5mm,采用FLIP CHIP封裝形式。目前我們具備該產(chǎn)品的研制條件,如能量產(chǎn),可帶來(lái)一定的經(jīng)濟(jì)價(jià)值,同時(shí)在封裝工藝上實(shí)現(xiàn)新的突破,打破日本和歐美國(guó)家在手機(jī)用聲表面波器件供應(yīng)上的壟斷地位。本文以研制上述濾波器為目的,介紹了聲表面波器件的研制流程和生產(chǎn)工藝過(guò)程。對(duì)具體的工藝原理和細(xì)節(jié)進(jìn)行了分析,重點(diǎn)闡述了小尺寸封裝的實(shí)現(xiàn)方法。針對(duì)封裝過(guò)程中遇到的實(shí)際問(wèn)題,分析了影響封裝質(zhì)量的因素,給出解決方案。器件的芯片設(shè)計(jì)上采用DMS結(jié)構(gòu),芯片工藝采用電子束蒸發(fā)鋁膜、S1805光刻膠、UV光步進(jìn)投影光刻、濕法腐蝕工藝;器件封裝上使用FLIP CHIP工藝,置球、超聲倒裝焊接和注塑成型。封裝后濾波器的性能參數(shù)、穩(wěn)定性和可靠性等指標(biāo)均達(dá)到設(shè)計(jì)要求,封裝尺寸符合設(shè)計(jì)要求,可以量產(chǎn)。器件的封裝尺寸由1.4mm×1.1mm×0.6mm縮小到l.lmm×0.9mm×0.5mm,達(dá)到國(guó)際先進(jìn)國(guó)內(nèi)領(lǐng)先水平。
[Abstract]:Saw filter is an electronic device used for signal processing. As with other filter functions, the interference signal is removed and the useful signal is transmitted through. Its working principle is to input the electric signal at the input end of the device, the electric signal excites the sound wave, and the sound wave is processed inside the device and then reduced to the electric signal. In recent years, with the rapid development of communications, the demand for filters is increasing. Saw filters have many advantages such as good high frequency performance, good consistency, small size, suitable for mass production, etc., which make the development of saw filters faster and faster, and its application field is expanding constantly, which makes saw devices get more and more attention. The third and fourth generation mobile communication technology requires the communication system to develop in the direction of high frequency and multi-mode, which brings higher requirements to saw filters. High frequency, wide band, low insertion loss and small package size have become the difficulties and hot spots in the research of saw filters in recent years. At present, the mobile communication market needs a saw filter for mobile phone navigation which can satisfy three modes (CAMPASS,GPS,GLONASS). The center frequency is 1575MHz, the bandwidth is 40MHz, the insertion loss is less than 1.8 dB, and the package size is 1.1mm 脳 0.9mm 脳 0.5mm. FLIP CHIP package is adopted. At present, we have the conditions for the development of this product, such as mass production, which can bring certain economic value. At the same time, we can achieve a new breakthrough in packaging technology and break the monopoly position of Japan, Europe and the United States in the supply of saw devices for mobile phones. In this paper, the development process and production process of saw devices are introduced. The process principle and detail are analyzed, and the realization method of small-size package is expounded. In view of the practical problems encountered in the process of packaging, the factors affecting the quality of packaging are analyzed, and the solutions are given. DMS structure is used in chip design, electron beam evaporative aluminum film, S1805 photoresist, UV photostep projection lithography, wet etching process are used in chip design, and FLIP CHIP process, ball setting, ultrasonic inversion welding and injection molding are used in device package. The performance parameters, stability and reliability of the encapsulated filter meet the design requirements, and the package size meets the design requirements and can be mass-produced. The package size of the device is reduced from 1.4mm 脳 1.1mm 脳 0.6mm to l.lmm 脳 0.9mm 脳 0.5mm, which reaches the international advanced and domestic leading level.
【學(xué)位授予單位】：東南大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN713
本文編號(hào)：2299836
[Abstract]:Saw filter is an electronic device used for signal processing. As with other filter functions, the interference signal is removed and the useful signal is transmitted through. Its working principle is to input the electric signal at the input end of the device, the electric signal excites the sound wave, and the sound wave is processed inside the device and then reduced to the electric signal. In recent years, with the rapid development of communications, the demand for filters is increasing. Saw filters have many advantages such as good high frequency performance, good consistency, small size, suitable for mass production, etc., which make the development of saw filters faster and faster, and its application field is expanding constantly, which makes saw devices get more and more attention. The third and fourth generation mobile communication technology requires the communication system to develop in the direction of high frequency and multi-mode, which brings higher requirements to saw filters. High frequency, wide band, low insertion loss and small package size have become the difficulties and hot spots in the research of saw filters in recent years. At present, the mobile communication market needs a saw filter for mobile phone navigation which can satisfy three modes (CAMPASS,GPS,GLONASS). The center frequency is 1575MHz, the bandwidth is 40MHz, the insertion loss is less than 1.8 dB, and the package size is 1.1mm 脳 0.9mm 脳 0.5mm. FLIP CHIP package is adopted. At present, we have the conditions for the development of this product, such as mass production, which can bring certain economic value. At the same time, we can achieve a new breakthrough in packaging technology and break the monopoly position of Japan, Europe and the United States in the supply of saw devices for mobile phones. In this paper, the development process and production process of saw devices are introduced. The process principle and detail are analyzed, and the realization method of small-size package is expounded. In view of the practical problems encountered in the process of packaging, the factors affecting the quality of packaging are analyzed, and the solutions are given. DMS structure is used in chip design, electron beam evaporative aluminum film, S1805 photoresist, UV photostep projection lithography, wet etching process are used in chip design, and FLIP CHIP process, ball setting, ultrasonic inversion welding and injection molding are used in device package. The performance parameters, stability and reliability of the encapsulated filter meet the design requirements, and the package size meets the design requirements and can be mass-produced. The package size of the device is reduced from 1.4mm 脳 1.1mm 脳 0.6mm to l.lmm 脳 0.9mm 脳 0.5mm, which reaches the international advanced and domestic leading level.
【學(xué)位授予單位】：東南大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN713
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