可延展柔性互連結(jié)構(gòu)仿真研究
發(fā)布時(shí)間：2018-10-25 19:40
【摘要】：為滿足物聯(lián)網(wǎng)和生物醫(yī)療技術(shù)的發(fā)展要求,電子產(chǎn)品不僅要具有優(yōu)異的人體適用性,攜帶輕便,還要具有形狀可變等特性,傳統(tǒng)柔性互連僅能滿足可彎曲的要求,不具有延展性,而基于無機(jī)電子材料的可延展柔性互連技術(shù)則非常適合上述應(yīng)用。可延展柔性互連不僅具備傳統(tǒng)無機(jī)電子的高性能和高可靠性,還具有優(yōu)異的可伸縮和可彎曲的柔性特性,鑒于可延展柔性互連具有的眾多優(yōu)點(diǎn),對(duì)其各項(xiàng)特性進(jìn)行研究很有必要。目前對(duì)于可延展柔性互連的研究主要集中在制造工藝和增加其延展性上面,而對(duì)于其電學(xué)特性的研究也僅僅只是簡單電路的實(shí)驗(yàn)結(jié)果,高頻特性和延展形變對(duì)可延展柔性互連電學(xué)性能的影響研究還是一片空白,因此本文選取可延展柔性互連結(jié)構(gòu)中典型的蛇形互連結(jié)構(gòu)進(jìn)行了仿真研究,具體研究內(nèi)容如下所示:1.首先對(duì)傳統(tǒng)互連、柔性互連、可延展柔性互連結(jié)構(gòu)和工藝進(jìn)行簡單介紹,了解其區(qū)別,然后使用ANSYS對(duì)具有可延展性的蛇形互連結(jié)構(gòu)進(jìn)行建模,經(jīng)過拉伸處理后得到不同拉伸位移下的形變模型。2.使用Q3D Extractor對(duì)形變后的模型進(jìn)行寄生參數(shù)提取,主要包括直流電阻/直流電感、交流電阻/交流電感、耦合電感/電容等參數(shù),分別仿真研究了上述參數(shù)隨頻率和延展過程形變位移的變化關(guān)系,并在此基礎(chǔ)上,仿真分析了導(dǎo)線間距對(duì)耦合電感和耦合電容的影響。3.使用HFSS對(duì)形變后的模型進(jìn)行S參數(shù)提取,分別對(duì)蛇形互連結(jié)構(gòu)中回波損耗和插入損耗隨形變位移和頻率的變化情況進(jìn)行仿真研究,還以U形、V形和本文所使用的蛇形互連結(jié)構(gòu)為例,研究了互連線形狀對(duì)回波損耗和插入損耗的影響。除此之外,還對(duì)耦合蛇形互連結(jié)構(gòu)的近端串?dāng)_和遠(yuǎn)端串?dāng)_進(jìn)行仿真,研究和分析了不同間距和不同形變情況下近端串?dāng)_和遠(yuǎn)端串?dāng)_隨信號(hào)頻率的變化關(guān)系。4.利用HFSS產(chǎn)生的S參數(shù)模型,導(dǎo)入Ansoft Designer中進(jìn)行耦合蛇形互連結(jié)構(gòu)的時(shí)域仿真分析,研究了兩種典型情況即1GHz和10GHz信號(hào)頻率下入射端口反射情況和耦合蛇形互連結(jié)構(gòu)的傳輸性能,同時(shí)還還仿真研究了拉伸形變對(duì)時(shí)域特性的影響,最終對(duì)結(jié)果進(jìn)行對(duì)比和匯總。本文通過仿真蛇形互連結(jié)構(gòu)的電學(xué)參數(shù),研究了延展過程中蛇形互連結(jié)構(gòu)電學(xué)特性隨頻率的變化關(guān)系,分析了各電學(xué)參數(shù)受延展形變影響的大小,初步形成了可延展柔性互連結(jié)構(gòu)電學(xué)特性仿真驗(yàn)證方法體系,為可延展柔性互連等效電路的理論建模提供重要支撐,對(duì)可延展柔性互連的設(shè)計(jì)和制造具有指導(dǎo)意義。
[Abstract]:In order to meet the requirements of the development of the Internet of things and biomedical technology, electronic products should not only have excellent applicability of human body, portable, but also have the characteristics of variable shape. Traditional flexible interconnection can only meet the requirements of bending. It has no ductility, and the flexible interconnection technology based on inorganic electronic materials is suitable for these applications. Extensible flexible interconnection not only has the high performance and high reliability of traditional inorganic electronics, but also has excellent flexible characteristics of scalability and bending. In view of the many advantages of extensible flexible interconnection, It is necessary to study its characteristics. At present, the research on extensible flexible interconnection is mainly focused on manufacturing process and increasing its ductility, and the study of its electrical properties is only the experimental result of simple circuit. There is still a blank in the study of the influence of high frequency characteristics and extended deformation on the electrical properties of extensible flexible interconnection, so the typical snake-shaped interconnection structure in the extensible flexible interconnection structure is selected for simulation study in this paper. The specific contents of the study are as follows: 1. Firstly, the traditional interconnection, flexible interconnection, extensible flexible interconnection structure and process are briefly introduced, and the differences between them are understood. Then the snake-like interconnection structure with ductility is modeled by ANSYS. After tensile treatment, the deformation model of different tensile displacement was obtained. 2. The parasitic parameters of the deformed model are extracted by Q3D Extractor, including DC resistance / DC inductance, AC resistance / AC inductance, coupling inductance / capacitance and so on. The variation of the above parameters with the frequency and the deformation and displacement during the extension process is studied by simulation, and the influence of the wire spacing on the coupling inductance and the coupling capacitance is analyzed. 3. The S parameters of the deformed model are extracted by HFSS, and the variation of echo loss and insertion loss with deformation displacement and frequency in snake-shaped interconnection structures are simulated respectively. The influence of the shape of the interconnect line on the echo loss and insertion loss is studied for the V-shape and the snake-shaped interconnection structure used in this paper. In addition, the near end crosstalk and far end crosstalk of the coupled snake-like interconnection are simulated. The relationship between the near end crosstalk and the far end crosstalk with the signal frequency under different spacing and different deformation is studied and analyzed. 4. Using the S parameter model generated by HFSS, the coupled snake-like interconnection structure is simulated and analyzed in time domain in Ansoft Designer. The reflection of incident ports at the frequency of 1GHz and 10GHz signals and the transmission performance of coupled snake-shaped interconnection structures are studied. At the same time, the effect of tensile deformation on time domain characteristics is simulated, and the results are compared and summarized. In this paper, by simulating the electrical parameters of snake-shaped interconnection structures, the relationship between the electrical characteristics of snake-shaped interconnection structures and frequency during the extension process is studied, and the magnitude of the effects of the extended deformation on the electrical parameters of the snake-shaped interconnection structures is analyzed. A simulation verification method system for electrical characteristics of extensible flexible interconnection structures is formed, which provides important support for theoretical modeling of equivalent circuits of extensible flexible interconnection, and has guiding significance for the design and manufacture of extensible flexible interconnection.
【學(xué)位授予單位】：西安電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405.97
本文編號(hào)：2294637
[Abstract]:In order to meet the requirements of the development of the Internet of things and biomedical technology, electronic products should not only have excellent applicability of human body, portable, but also have the characteristics of variable shape. Traditional flexible interconnection can only meet the requirements of bending. It has no ductility, and the flexible interconnection technology based on inorganic electronic materials is suitable for these applications. Extensible flexible interconnection not only has the high performance and high reliability of traditional inorganic electronics, but also has excellent flexible characteristics of scalability and bending. In view of the many advantages of extensible flexible interconnection, It is necessary to study its characteristics. At present, the research on extensible flexible interconnection is mainly focused on manufacturing process and increasing its ductility, and the study of its electrical properties is only the experimental result of simple circuit. There is still a blank in the study of the influence of high frequency characteristics and extended deformation on the electrical properties of extensible flexible interconnection, so the typical snake-shaped interconnection structure in the extensible flexible interconnection structure is selected for simulation study in this paper. The specific contents of the study are as follows: 1. Firstly, the traditional interconnection, flexible interconnection, extensible flexible interconnection structure and process are briefly introduced, and the differences between them are understood. Then the snake-like interconnection structure with ductility is modeled by ANSYS. After tensile treatment, the deformation model of different tensile displacement was obtained. 2. The parasitic parameters of the deformed model are extracted by Q3D Extractor, including DC resistance / DC inductance, AC resistance / AC inductance, coupling inductance / capacitance and so on. The variation of the above parameters with the frequency and the deformation and displacement during the extension process is studied by simulation, and the influence of the wire spacing on the coupling inductance and the coupling capacitance is analyzed. 3. The S parameters of the deformed model are extracted by HFSS, and the variation of echo loss and insertion loss with deformation displacement and frequency in snake-shaped interconnection structures are simulated respectively. The influence of the shape of the interconnect line on the echo loss and insertion loss is studied for the V-shape and the snake-shaped interconnection structure used in this paper. In addition, the near end crosstalk and far end crosstalk of the coupled snake-like interconnection are simulated. The relationship between the near end crosstalk and the far end crosstalk with the signal frequency under different spacing and different deformation is studied and analyzed. 4. Using the S parameter model generated by HFSS, the coupled snake-like interconnection structure is simulated and analyzed in time domain in Ansoft Designer. The reflection of incident ports at the frequency of 1GHz and 10GHz signals and the transmission performance of coupled snake-shaped interconnection structures are studied. At the same time, the effect of tensile deformation on time domain characteristics is simulated, and the results are compared and summarized. In this paper, by simulating the electrical parameters of snake-shaped interconnection structures, the relationship between the electrical characteristics of snake-shaped interconnection structures and frequency during the extension process is studied, and the magnitude of the effects of the extended deformation on the electrical parameters of the snake-shaped interconnection structures is analyzed. A simulation verification method system for electrical characteristics of extensible flexible interconnection structures is formed, which provides important support for theoretical modeling of equivalent circuits of extensible flexible interconnection, and has guiding significance for the design and manufacture of extensible flexible interconnection.
【學(xué)位授予單位】：西安電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405.97
【參考文獻(xiàn)】
相關(guān)期刊論文 前5條
1 劉旭;呂延軍;王龍飛;趙銀燕;;可延展柔性電子技術(shù)研究進(jìn)展[J];半導(dǎo)體技術(shù);2015年03期
2 馮雪;陸炳衛(wèi);吳堅(jiān);林媛;宋吉舟;宋國鋒;黃永剛;;可延展柔性無機(jī)微納電子器件原理與研究進(jìn)展[J];物理學(xué)報(bào);2014年01期
3 孫露;;PCB抗干擾設(shè)計(jì)中的合理分層[J];寧波教育學(xué)院學(xué)報(bào);2012年05期
4 張磊;唐繼勇;楊峰;;高速電路中的信號(hào)完整性及仿真[J];中國測(cè)試技術(shù);2008年01期
5 李小蘭,王金龍,嚴(yán)小雄;聚酰亞胺薄膜/超薄銅箔撓性覆銅板的研制[J];絕緣材料;2004年01期
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