碳化硅功率器件非線性建模及應用研究
[Abstract]:Silicon carbide (SiC) materials have attracted wide attention due to their wide band gap, high critical electric field and high thermal conductivity. In recent years, commercial SiC power devices have been introduced, but reliability is one of the bottlenecks to its development. It is well known that the reliability of power devices is mainly affected by transient nonlinear behavior such as high temperature and high electric field, which results in the degradation of internal parameters and external electrical characteristics of the devices, thus reducing the reliability and service life of the devices. In order to reveal the relationship between the transient nonlinear behavior of SiC power devices and their physical parameters, it is necessary to describe them by means of precise device models. However, most of the existing SiC power device models are linear models. The real time effect of junction temperature on its physical parameters is not considered, which leads to the limitation of simulation precision. Therefore, it is important to develop nonlinear modeling of SiC power device to improve its reliability and service life. Based on the working mechanism of SiC power devices, the nonlinear modeling of SiC BJT and SiC MOSFET power devices is presented in this paper. Firstly, a numerical analysis method of Si C BJT physical model based on Haar wavelet is constructed. At the same time, a modeling method of SiC MOSFET electrothermal coupling model based on time-varying temperature feedback is proposed. On this basis, the transient nonlinear behavior of SiC power devices is studied. The effectiveness of the above method is verified by the comparison of simulation and experimental results. The main work of this paper is as follows: (1) aiming at the accuracy of solving bipolar diffusion equation (Ambipolar Diffusion Equation,ADE) in SiC BJT modeling, a SiC BJT physical modeling method based on Haar wavelet method is proposed. Based on the working mechanism of SiC BJT, the dynamic behavior of the model and the relation between the excitation and response of each interval are analyzed by using the semiconductor physics theory. The Haar wavelet method is applied to the solution of ADE. The simulation results are compared with the Fourier series method. The results show that Haar wavelet method can effectively improve the accuracy of the device physical model. (2) A SiC MOSFET electrothermal coupling model modeling method based on time-varying temperature feedback is proposed. Based on the working mechanism of Si C MOSFET, the relationship among SiC MOSFET module, thermal network module and power loss module is analyzed synthetically. The power loss and thermal network module are introduced into the model, and the real-time feedback device junction and temperature parameters are updated. This method can better reflect the performance characteristics of SiC MOSFET in the process of conduction and switching. The simulation results verify the feasibility of the model. (3) the application and experimental verification of the electrothermal coupling model of) SiC MOSFET. The SiC MOSFET power device is applied to the class E inverter, and the driving circuit of the SiC MOSFET device is designed. The experimental prototype of the class E inverter. Sic MOSFET uses C2M0160120D of CREE Company. The experimental results prove the validity of the model.
【學位授予單位】:湘潭大學
【學位級別】:碩士
【學位授予年份】:2017
【分類號】:TN386
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