【摘要】：該文介紹了梁式封裝二極管(BED)的微組裝技術(shù)(MPT)的現(xiàn)狀及其問題,重點(diǎn)對(duì)超聲熱壓倒裝焊與粘膠互聯(lián)進(jìn)行了實(shí)驗(yàn)與仿真,分析了不同電極與基板鍍層等因素對(duì)裝配方案的影響,并通過受力實(shí)驗(yàn)進(jìn)行驗(yàn)證。提出了有效規(guī)范的裝配方案和可靠、易行的工程結(jié)論,解決了梁式封裝二極管裝配方案混亂,批量一致性差,調(diào)試難度大,成本高等問題。
[Abstract]:This paper introduces the status quo and problems of microassembly technology (MPT) for beam type packaging diode (BED). The experiment and simulation of ultrasonic heat overwhelm welding and viscose interconnection are carried out, and the influence of different electrode and substrate coating on assembly scheme is analyzed. And through the force experiment to verify. The effective and standard assembly scheme and the reliable and easy engineering conclusion are put forward. The problems such as chaotic assembly scheme of beam packaging diode, poor batch consistency, high debugging difficulty and high cost are solved.
【作者單位】： 中國(guó)電子科技集團(tuán)公司第二十六研究所;
【分類號(hào)】：TN31

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本文編號(hào)：2204026