【摘要】：隨著電子技術(shù)和大規(guī)模集成電路的發(fā)展,自動光學(xué)檢測設(shè)備在表面封裝技術(shù)領(lǐng)域得到了快速的發(fā)展。而PCB焊點(diǎn)的質(zhì)量是影響產(chǎn)品質(zhì)量的最關(guān)鍵因素之一,其質(zhì)量的檢測顯得異常重要。所以,本文針對PCB焊點(diǎn)檢測的關(guān)鍵技術(shù)進(jìn)行研究分析與設(shè)計(jì)。通過分析RGB環(huán)形層次光的反射理論與色彩高亮度傾斜圖理論,針對焊點(diǎn)基本特征與表面特征描述方法,總結(jié)出了常見缺陷的焊點(diǎn)特征,以及對現(xiàn)有的光源入射形式與常見結(jié)構(gòu)的分析,提出了符合焊點(diǎn)檢測需要的RGB環(huán)形層次正面直射光源結(jié)構(gòu),完成了RGB環(huán)形層次正面直射光源設(shè)計(jì)。并基于實(shí)際檢測的需求,FOV的大小和分辨率的要求,對工業(yè)CCD相機(jī)以及工業(yè)鏡頭進(jìn)行功能上的選擇,找到符合CCD傳感器對RGB三色最佳靈敏度的LED光源,并通過光譜測試儀進(jìn)行了相關(guān)測試,最終確定了光源的相關(guān)部件與成像系統(tǒng)的部件。根據(jù)LED發(fā)光二極管的特性,提出了相數(shù)的方法,即將每環(huán)LED分成若干相和每相由8或12個(gè)LED組成額定電壓為+24V,來降低電路的發(fā)熱提高了LED的發(fā)光均勻性和整個(gè)LED環(huán)的穩(wěn)定性。并在設(shè)計(jì)時(shí),預(yù)留了一個(gè)閑置通道,對以后的維修和增加光路做準(zhǔn)備。建立了雙絲杠模型的簡化與數(shù)學(xué)模型,并采用軟件對其進(jìn)行仿真分析,最終通過實(shí)驗(yàn)來證明設(shè)計(jì)的合理性,提高載物臺傳動系統(tǒng)的穩(wěn)定性和定位精度�；赗GB的高亮度傾斜圖理論和色彩的三原色理論,以及焊點(diǎn)表面的成型特點(diǎn),提出了通過RGB三種顏色的提取及顏色所占檢測區(qū)域的多少來判斷焊點(diǎn)質(zhì)量和元件的定位方法。
[Abstract]:With the development of electronic technology and large scale integrated circuit, automatic optical inspection equipment has been developed rapidly in the field of surface packaging technology. The quality of PCB solder joint is one of the most important factors affecting product quality. Therefore, this paper studies and designs the key technology of PCB solder joint detection. By analyzing the reflection theory of RGB annular layer light and the theory of color high brightness tilt diagram, the solder joint characteristics of common defects are summarized according to the basic characteristics of solder joints and the description method of surface features. Based on the analysis of the existing incident mode and common structure of the light source, the RGB ring level direct light source structure which meets the needs of solder joint detection is put forward, and the design of the RGB ring level front direct light source is completed. Based on the requirement of the actual detection, the industrial CCD camera and the industrial lens are selected on the basis of the requirement of the size and resolution of the RGB, and the LED light source which accords with the best sensitivity of the CCD sensor to the RGB is found. The related components of the light source and the imaging system are finally determined by the spectrometer. According to the characteristics of LED light-emitting diodes, a method of phase number is proposed, that is, each LED is divided into several phases and each phase is composed of 8 or 12 LED, the rated voltage is 24V, which can reduce the heating of the circuit and improve the uniformity of LED and the stability of the whole LED loop. At the time of design, an idle channel is reserved to prepare for future maintenance and increase of optical path. The simplified and mathematical model of double lead screw model is established, and the software is used to simulate and analyze it. Finally, the rationality of the design is proved by experiment, and the stability and positioning accuracy of the load platform transmission system are improved. Based on the theory of high brightness tilt diagram of RGB and the theory of three primary colors of color, as well as the forming characteristics of solder joint surface, this paper puts forward a method to judge the quality of solder joint and the location of components through the extraction of three colors of RGB and the amount of detecting area occupied by the color.
【學(xué)位授予單位】：哈爾濱工業(yè)大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN41

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相關(guān)期刊論文 前1條

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本文編號：2166674