【摘要】：劃片機(jī)是IC生產(chǎn)在線的關(guān)鍵設(shè)備之一,是一種精密切割專用設(shè)備,主要用于將半導(dǎo)體集成電路硅片、砷化鎵、磷化鎵等芯片切割成單個(gè)集成電路或管芯的專用精密切割設(shè)備。目前國(guó)內(nèi)IC生產(chǎn)在線使用的劃片機(jī)基本上是全部依賴于進(jìn)口,其價(jià)格昂貴、維修不方便、配件價(jià)格高、供貨時(shí)間長(zhǎng),制約了我國(guó)微電子行業(yè)的發(fā)展。為了我國(guó)微電子行業(yè)的發(fā)展,也為了滿足國(guó)內(nèi)半導(dǎo)體廠家對(duì)該設(shè)備的需求,我們瞄準(zhǔn)國(guó)際先進(jìn)技術(shù),自主設(shè)計(jì)開發(fā)自動(dòng)劃片機(jī)。本文的主要內(nèi)容有：首先,介紹了自動(dòng)砂輪劃片機(jī)的工作原理和結(jié)構(gòu)組成,通過(guò)整機(jī)各關(guān)鍵部件多個(gè)方案的對(duì)比,綜合考慮先進(jìn)性、經(jīng)濟(jì)性、可實(shí)現(xiàn)性、周期性等因素,確認(rèn)了最終的整機(jī)設(shè)計(jì)方案。同時(shí),對(duì)主機(jī)各軸向關(guān)鍵件的設(shè)計(jì)和選取原則進(jìn)行了介紹。其次,根據(jù)對(duì)整個(gè)系統(tǒng)允許的總誤差以及已定誤差、隨機(jī)誤差、系統(tǒng)誤差的分析和理論計(jì)算,逐一算出各個(gè)軸向的精度設(shè)計(jì)要求,并據(jù)此完成了對(duì)整機(jī)各部件精度的確認(rèn)。隨后,詳細(xì)介紹了各個(gè)軸向和關(guān)鍵零部件的設(shè)計(jì)方法和過(guò)程。本文還介紹了圖像對(duì)準(zhǔn)系統(tǒng)、液路系統(tǒng)、氣路系統(tǒng)等輔助裝置的原理和設(shè)計(jì),該部分輔助裝置從根本上確保了整機(jī)的可靠運(yùn)行,是整機(jī)技術(shù)指標(biāo)實(shí)現(xiàn)的有力保證。此外,還簡(jiǎn)要介紹了整機(jī)的電氣設(shè)計(jì)。最后,整機(jī)技術(shù)指標(biāo)的測(cè)試結(jié)果和實(shí)際使用效果表明,該設(shè)備的性能達(dá)到了預(yù)期設(shè)計(jì)要求。通過(guò)該設(shè)備切割的芯片,尺寸符合生產(chǎn)要求、外形規(guī)整、一致性好,整機(jī)性能處于國(guó)內(nèi)同類產(chǎn)品的領(lǐng)先水平,有力的確保了國(guó)內(nèi)半導(dǎo)體生產(chǎn)商的需求。同時(shí),也對(duì)自動(dòng)砂輪劃片機(jī)的后續(xù)發(fā)展進(jìn)行了展望和建議。自動(dòng)砂輪劃片機(jī)的研制成功,提高了IC芯片切割的效率和質(zhì)量,極大地提高了成品率,降低了生產(chǎn)成本。能夠滿足半導(dǎo)體用戶方便、高效、可靠的生產(chǎn)要求,有著極高的性價(jià)比。同時(shí),本設(shè)備也可用于對(duì)玻璃、石英、陶瓷、藍(lán)寶石等脆硬材料的切割、分離,應(yīng)用領(lǐng)域廣,市場(chǎng)需求量大。
[Abstract]:Slicing machine is one of the key equipment in IC production, and it is a kind of special precision cutting equipment, which is mainly used to cut silicon chip, gallium arsenide and gallium phosphide chip into a single integrated circuit or tube core. At present, domestic IC production and online use of slicing machines are basically all rely on imports, its price is expensive, maintenance is not convenient, spare parts high price, long supply time, which restricts the development of China's microelectronics industry. For the development of microelectronics industry in our country, and to meet the demand of semiconductor manufacturers in China, we aim at the international advanced technology and design and develop the automatic slicing machine independently. The main contents of this paper are as follows: firstly, the working principle and structure of automatic grinding wheel slicing machine are introduced. Through the comparison of several schemes of key parts of the whole machine, the advanced nature, economy, realizability, periodicity and other factors are comprehensively considered. The final design of the machine is confirmed. At the same time, the design and selection principle of each axial key part of the host are introduced. Secondly, according to the analysis and theoretical calculation of the total error, fixed error, random error and system error of the whole system, the precision design requirements of each axial direction are calculated one by one, and the accuracy of each component of the whole machine is confirmed accordingly. Then, the design method and process of each axis and key parts are introduced in detail. This paper also introduces the principle and design of image alignment system, liquid circuit system, gas path system and other auxiliary devices. This part of auxiliary device basically ensures the reliable operation of the whole machine and is a powerful guarantee for the realization of the whole machine's technical index. In addition, the electrical design of the whole machine is briefly introduced. Finally, the test results and practical application results show that the performance of the equipment meets the expected design requirements. The chip cut by this equipment meets the requirements of production, the shape is regular, the consistency is good, the performance of the whole machine is in the leading level of the domestic similar products, and the demand of the domestic semiconductor manufacturers is ensured. At the same time, the future development of automatic grinding wheel slicing machine is prospected and suggested. The development of automatic grinding wheel slicing machine improves the efficiency and quality of IC chip cutting, greatly improves the finished product rate and reduces the production cost. Can meet the semiconductor user convenient, efficient, reliable production requirements, has a very high cost-performance ratio. At the same time, the equipment can also be used to cut, separate and apply to brittle hard materials such as glass, quartz, ceramics, sapphire and so on.
【學(xué)位授予單位】：西安電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405

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