【摘要】：硅材料因其良好的熱電性能、穩(wěn)定的化學(xué)性質(zhì)、相對成熟的微機(jī)械加工技術(shù)被用來作為新型微通道板基體材料。與傳統(tǒng)微通道板相比,硅微通道板無論是在器件的增益性能,還是在使用壽命上都有著無法比擬的巨大優(yōu)勢。本文主要針對硅微通道板高溫形變特性進(jìn)行了深入研究,通過觀察經(jīng)高溫氧化后的硅微通道板的形貌變化,分析其產(chǎn)生不規(guī)則形變的原因是高溫環(huán)境下熱應(yīng)力所致,并通過ABAQUS有限元模擬軟件對硅微通道陣列高溫形變特性進(jìn)行模擬仿真。仿真結(jié)果直接反應(yīng)出了硅微通道陣列所受熱應(yīng)力的分布以及應(yīng)變情況,在1100℃時(shí),外角的最大熱應(yīng)力達(dá)到了307N/m~2,內(nèi)角的最大熱應(yīng)力為33.7N/m~2,內(nèi)壁中心點(diǎn)熱應(yīng)力為50.5N/m~2。外交應(yīng)力大于內(nèi)角應(yīng)力,孔道夾角凸起,孔道壁凹陷,將仿真結(jié)果與實(shí)驗(yàn)結(jié)果做對比分析出了硅微通道陣列高溫形變特性。通過高溫整形實(shí)驗(yàn)使硅微通道板恢復(fù)平整,在溫度1250℃,重量達(dá)到200g,高溫整形4h時(shí)平整度達(dá)到0.1,整形效果最佳。本文對硅微通道陣列的燒結(jié)現(xiàn)象的進(jìn)行了研究,并說明了硅微通道陣列燒結(jié)現(xiàn)象的存在,以及提出了硅微通道陣列在高溫整形中減小燒結(jié)現(xiàn)象影響的實(shí)驗(yàn)優(yōu)化方案。
[Abstract]:Because of its good thermoelectric properties, stable chemical properties and relatively mature micromachining technology, silicon material is used as a new type of microchannel substrate material. Compared with traditional microchannel plate, silicon microchannel board has unparalleled advantages in gain performance and service life. In this paper, the deformation characteristics of silicon microchannel plates at high temperature are studied in depth. By observing the morphologies of silicon microchannel plates after high temperature oxidation, the causes of irregular deformation are analyzed, which are caused by thermal stress in high temperature environment. The high temperature deformation characteristics of silicon microchannel array are simulated by ABAQUS finite element simulation software. The simulation results directly reflect the distribution of thermal stress and strain of silicon microchannel array. At 1100 鈩，

本文編號：2154481