無透鏡數字全息顯微成像技術與應用
發(fā)布時間:2018-07-20 18:36
【摘要】:針對微結構和微光學元件等微小物體的表面定量檢測,本文介紹了一種利用無透鏡數字全息的快速、無損的顯微成像方法。首先介紹了基于球面波的無透鏡數字全息顯微成像技術的基本原理,采用CCD作為光電轉換器件,基于邁克爾遜干涉光路,設計了無透鏡數字全息顯微成像系統(tǒng),利用反射鏡構成折反式光路,系統(tǒng)結構簡單、緊湊,提升了系統(tǒng)便攜性。然后利用USAF1951分辨率板對構建的成像系統(tǒng)進行了標定實驗,得出其橫向分辨率為6.69μm,放大倍率為3.375,系統(tǒng)工作距離為12.0mm。此外,還對晶圓表面結構進行實際測量。實驗驗證了該系統(tǒng)的可行性和有效性,有望進一步應用于MEMS、微光學元件、光學元件等表面形貌的定量測量中。
[Abstract]:In this paper, a fast and lossless microscopic imaging method based on lensless digital holography is introduced for the surface quantitative detection of micro objects such as microstructures and micro optical elements. Firstly, the basic principle of lensless digital holographic microscopic imaging technology based on spherical wave is introduced. A lensless digital holographic microscopic imaging system is designed based on Michelson interference light path and CCD as photoelectric conversion device. The system structure is simple and compact, and the system portability is improved. Then the calibration experiment of the imaging system was carried out using USAF1951 resolution board. The transverse resolution was 6.69 渭 m, the magnification was 3.375, and the operating distance of the system was 12.0mm. In addition, the surface structure of the wafer was measured. The experimental results show that the system is feasible and effective, and it is expected to be used in the quantitative measurement of surface morphology of MEMS, microoptical elements and optical elements.
【作者單位】: 北京理工大學光電學院光機電聯合研究中心;北京理工大學深圳研究院;
【基金】:教育部重點實驗室2016開放基金(2016OEIOF05) 深圳市科技創(chuàng)新項目資助
【分類號】:TN26
[Abstract]:In this paper, a fast and lossless microscopic imaging method based on lensless digital holography is introduced for the surface quantitative detection of micro objects such as microstructures and micro optical elements. Firstly, the basic principle of lensless digital holographic microscopic imaging technology based on spherical wave is introduced. A lensless digital holographic microscopic imaging system is designed based on Michelson interference light path and CCD as photoelectric conversion device. The system structure is simple and compact, and the system portability is improved. Then the calibration experiment of the imaging system was carried out using USAF1951 resolution board. The transverse resolution was 6.69 渭 m, the magnification was 3.375, and the operating distance of the system was 12.0mm. In addition, the surface structure of the wafer was measured. The experimental results show that the system is feasible and effective, and it is expected to be used in the quantitative measurement of surface morphology of MEMS, microoptical elements and optical elements.
【作者單位】: 北京理工大學光電學院光機電聯合研究中心;北京理工大學深圳研究院;
【基金】:教育部重點實驗室2016開放基金(2016OEIOF05) 深圳市科技創(chuàng)新項目資助
【分類號】:TN26
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本文編號:2134399
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