本文選題：PCB板 + 熱結(jié)構(gòu)分析��； 參考：《西安電子科技大學(xué)》2015年碩士論文

【摘要】：電子設(shè)備在實(shí)際工作中經(jīng)常會(huì)處在溫度劇烈變化的環(huán)境中,也有些器件在工作過程中會(huì)被加熱到很高的溫度,由于溫度變化、溫度梯度、異質(zhì)材料連接以及約束的存在,就會(huì)產(chǎn)生熱應(yīng)力和熱變形,這些應(yīng)力和變形有時(shí)甚至?xí)蔀槠骷茐牡臎Q定性因素,因此對(duì)電子設(shè)備進(jìn)行熱控制設(shè)計(jì)很有必要。熱控方案的驗(yàn)證可通過熱試驗(yàn)和計(jì)算機(jī)仿真來實(shí)現(xiàn),前者成本高而且耗時(shí),后者則較為方便快捷,也受到越來越多的青睞。但由于近年來設(shè)備結(jié)構(gòu)越來越復(fù)雜,一方面模型及仿真條件的簡(jiǎn)化處理仍然存在較多問題,另一方面如何對(duì)模型進(jìn)行合理有效的優(yōu)化設(shè)計(jì)也是困擾研究者的一個(gè)重要問題。因此,研究如何建立合理高效的電子設(shè)備熱結(jié)構(gòu)分析模型并實(shí)現(xiàn)有效的優(yōu)化設(shè)計(jì)很有意義。本文首先介紹了ANSYS和UG NX軟件熱結(jié)構(gòu)仿真分析的方法流程,以及PCB板常見熱應(yīng)力問題的分析方法,主要包括PCB板彎曲熱應(yīng)力分析和PCB板底面約束應(yīng)力分析,同時(shí)總結(jié)了目前PCB板應(yīng)力和變形的主要實(shí)驗(yàn)測(cè)量方法。接著討論了螺紋連接的建模方法,主要包含螺紋連接結(jié)構(gòu)模型簡(jiǎn)化處理的基本方法和原則,預(yù)緊力的加載,螺紋連接結(jié)構(gòu)接觸設(shè)置分析;并借助ANSYS軟件對(duì)不同建模方式的螺釘連接模型及粘接、焊接、螺釘連接和螺栓連接等PCB板不同連接固定方式模型進(jìn)行了熱結(jié)構(gòu)分析并對(duì)其中幾種典型連接方式進(jìn)行了影響因素研究,驗(yàn)證模型實(shí)際應(yīng)用的有效性,為工程實(shí)際提供參考。最后介紹了響應(yīng)曲面法和PCB板預(yù)變形的相關(guān)理論知識(shí),采用響應(yīng)曲面法進(jìn)行試驗(yàn)設(shè)計(jì),以某星載有源相控陣天線中PCB板的最小Z向變形為響應(yīng)目標(biāo),借助ANSYS軟件進(jìn)行熱結(jié)構(gòu)分析,研究PCB板定位點(diǎn)不共面對(duì)上述響應(yīng)目標(biāo)的影響,并找出最佳的定位點(diǎn)不共面方案,為工程實(shí)際中PCB組件的熱結(jié)構(gòu)優(yōu)化設(shè)計(jì)提供一個(gè)新思路。
[Abstract]:Electronic devices are often in an environment in which the temperature varies dramatically in practice, and some devices are heated to a very high temperature in the course of operation, because of the temperature change, temperature gradient, heterogeneity material connection and the existence of constraints. Thermal stress and deformation will be produced, which sometimes even become the decisive factor of device failure, so it is necessary to design the thermal control of electronic equipment. The verification of thermal control scheme can be realized by thermal test and computer simulation. The former is expensive and time-consuming, while the latter is more convenient and more popular. However, due to the increasing complexity of the equipment structure in recent years, on the one hand, there are still many problems in simplifying the model and simulation conditions. On the other hand, how to optimize the model reasonably and effectively is an important problem that puzzles the researchers. Therefore, it is significant to study how to establish a reasonable and efficient thermal structure analysis model of electronic equipment and to realize effective optimization design. This paper first introduces the method flow of thermal structure simulation analysis of ANSYS and UG NX software, and the analysis methods of common thermal stress problems of PCB board, including bending thermal stress analysis of PCB board and constraint stress analysis of PCB board bottom. At the same time, the main experimental measurement methods of PCB board stress and deformation are summarized. Then the modeling method of thread connection is discussed, including the basic method and principle of simplified processing of thread connection structure model, the loading of preload force and the analysis of contact setting of thread connection structure. And with the help of ANSYS software, the screw connection model, bonding and welding of different modeling methods are made. This paper analyzes the thermal structure of different PCB connection modes, such as screw connection and bolt connection, and studies the influencing factors of several typical connection modes. It verifies the validity of the practical application of the model and provides a reference for engineering practice. Finally, the theory of response surface method and PCB board pre-deformation is introduced. The experimental design is carried out by using the response surface method, and the minimum Z-direction distortion of PCB board in a star-carrying phased array antenna is taken as the response target. Based on the thermal structure analysis of ANSYS software, this paper studies the influence of PCB positioning points on the above response targets, and finds out the best location point noncoplanar scheme, which provides a new idea for the thermal structure optimization design of PCB components in engineering practice.
【學(xué)位授予單位】：西安電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN41

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本文編號(hào)：2102542