本文選題：紙基 + 噴墨印制　； 參考：《電子科技大學(xué)》2017年碩士論文

【摘要】：近年來,隨著電子產(chǎn)品向低成本、柔性化的方向發(fā)展,傳統(tǒng)的剛性電路板已經(jīng)不能滿足當(dāng)前電子器件發(fā)展需求。紙基電路成本低、可降解、能夠折疊成三維器件,對柔性電子的發(fā)展具有十分重要的意義。本論文將探討紙基全印制導(dǎo)電線路的制備技術(shù),為紙基柔性印刷電路的制備提供可行性解決方案。本論文采用噴印催化油墨與化學(xué)沉積金屬層相結(jié)合的方式在紙基表面制備導(dǎo)電線路,針對溶液型催化油墨在多孔紙基表面滲透率過高,導(dǎo)致催化化學(xué)沉積速度慢,金屬膜層覆蓋不完整等問題,采用適用于紙基表面前處理的氯化亞錫膠體溶液,在紙基表面形成一層膠體薄膜,將油墨的滲透深度從約330μm降低到100μm,使得金屬膜層既能生長到紙基纖維內(nèi)部,增強(qiáng)金屬膜層的附著性能,又能在紙基表面留存足夠多的催化油墨,改善沉積金屬膜層的質(zhì)量。優(yōu)化化學(xué)沉積時間,完善工藝流程,在無需任何嚴(yán)苛環(huán)境要求和精密設(shè)備儀器的情況下,使用本論文所研究技術(shù)途徑在紙基上制備出致密、平整、連續(xù)的導(dǎo)電銅層。銅層的電導(dǎo)率達(dá)到銅塊材的70%,且制備出的線條圖案精度也達(dá)到約95μm。通過對紙基全印制導(dǎo)電線路彎折彎曲性能的研究,得出無論是彎折還是彎曲,紙基全印制導(dǎo)電線路都會保持一定的導(dǎo)電性。并且,利用紙基全印制導(dǎo)電線路的彎折彎曲性能,本論文還制作出了三維折疊器件原型,顯示出該技術(shù)路線的潛在應(yīng)用價值。依據(jù)設(shè)計理論與基本天線結(jié)構(gòu),在厚度為356μm,相對介電常數(shù)為2.16,損耗角正切值為0.0012的Teslin紙基板上設(shè)計出天線阻抗與NXP公司的SL3S1002FTB1,115型超高頻標(biāo)簽芯片達(dá)成共軛匹配的小型化超高頻標(biāo)簽天線。采用本論文技術(shù)路線制備出的天線原型,實際測量得到的S11值在915 MHz處為-25dB左右,現(xiàn)場讀取距離大約30 cm。本論文所研究的技術(shù)路線簡潔環(huán)保、成本低廉,且由于紙基的柔性特征,還可以實現(xiàn)標(biāo)簽天線的R2R大規(guī)模生產(chǎn),更能發(fā)揮規(guī)模擴(kuò)大的邊際效益,使得單個標(biāo)簽的生產(chǎn)成本降低到分量級的超低價格,進(jìn)一步拓展RFID技術(shù)的應(yīng)用范圍。
[Abstract]:In recent years, with the development of electronic products in the direction of low cost and flexibility, the traditional rigid circuit boards can not meet the current development needs of electronic devices. The paper based circuit is low cost, degradable and can be folded into three dimensional devices, which is of great significance to the development of flexible electronics. In this paper, the fabrication technology of paper-based full-printed conductive circuit is discussed, which provides a feasible solution for the preparation of paper-based flexible printing circuit. In this paper, we use the combination of printing ink and chemical deposition metal layer to prepare conductive circuit on the paper surface. Because of the high permeability of the solution type catalytic ink on the porous paper surface, the catalytic chemical deposition speed is slow. A colloidal film was formed on the paper substrate by using the colloidal solution of stannous chloride, which is suitable for the pretreatment of the paper surface, to form a colloidal film on the paper substrate. By reducing the penetration depth of the ink from 330 渭 m to 100 渭 m, the metal film can grow into the paper fiber, enhance the adhesion of the metal film, and retain enough catalytic ink on the paper surface to improve the quality of the deposited metal film. The chemical deposition time was optimized and the technological process was improved. The dense, smooth and continuous conductive copper layer was prepared on the paper substrate without any strict environmental requirements and precision equipment instruments. The conductivity of the copper layer is 70% of that of the copper block, and the precision of the line pattern is about 95 渭 m. Through the study of the bending and bending properties of paper based full printed conductive circuit, it is concluded that whether it is bending or bending, paper based all printed conductive circuit will maintain certain electrical conductivity. Furthermore, using the bending and bending properties of paper based fully printed conductive circuit, the prototype of 3D folding device is made in this paper, which shows the potential application value of this technology route. According to the design theory and the basic antenna structure, On a Teslin paper substrate with a thickness of 356 渭 m, a relative dielectric constant of 2.16 and a loss angle tangent of 0.0012, a miniaturized UHF tag antenna with conjugate matching between the antenna impedance and the SL3S1002FTB1115 UHF tag chip of NXP has been designed. The antenna prototype is prepared by the technique route in this paper. The measured S11 value is about -25dB at 915MHz, and the reading distance is about 30cm. The technical route studied in this paper is simple and environmental friendly, low cost, and because of the flexible characteristics of paper, it can also realize the large-scale production of R2R tag antenna, and can play the marginal benefit of scale expansion. The production cost of single tag is reduced to the ultra-low price of component level, and the application of RFID technology is further expanded.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TN41

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本文編號：2068721