本文選題：FPGA + 溫度傳感器��； 參考：《北京工業(yè)大學》2015年碩士論文

【摘要】：現(xiàn)場可編程邏輯門陣列(FPGA)因其高度靈活性和低成本,在眾多領(lǐng)域里占據(jù)越來越重要的地位。隨著FPGA的應用日趨復雜,FPGA中使用的邏輯門數(shù)不斷的增多,集成度不斷提高,產(chǎn)生的功耗越來越大,造成FPGA芯片上的溫度越來越高,這些都有可能造成電路可靠性的下降。芯片功耗不均勻增加,會導致熱斑的產(chǎn)生和溫度梯度的增大,單一結(jié)溫的測量不能反映出空間的溫度分布,對于總功耗和平均芯片溫度的估算方式不可避免地對熱斑的位置造成了誤判。因此,研究FPGA處于工作狀態(tài)時的溫度分布具有重要的意義。本文提出了一種智能溫度傳感網(wǎng)絡,測量了Altera公司CycloneШ系列的FPGA的瞬態(tài)溫度分布,不同于以往的電壓或者電流式的架構(gòu),采用環(huán)形振蕩器作為感測溫度的方式,將溫度信號轉(zhuǎn)換為延遲時間,這種溫度傳感器可以動態(tài)在FPGA內(nèi)部進行插入,或者刪除。在此基礎(chǔ)上進行了深入研究,具體內(nèi)容包括以下幾個方面:一、基于環(huán)形振蕩器提出了一種智能溫度傳感器,用于動態(tài)測量FPGA的瞬態(tài)溫度分布。這種智能溫度傳感器利用環(huán)形振蕩器的延遲與溫度的對應關(guān)系實現(xiàn)探測溫度。被測溫度可以被轉(zhuǎn)換成一個隨溫度成比例變化的時間信號。輸出頻率被一個帶掃描回路的計數(shù)器讀出,然后通過串口傳回到電腦的上位機。將這種溫度傳感器應用在FPGA上,測量了運行不同程序下的FPGA的溫度分布。然后討論了不同反相器數(shù)目和電源電壓對溫度傳感器的影響,計算出了溫度傳感器的熱響應時間。二、分別在真空和大氣下對這種智能溫度傳感器進行評估。紅外熱像儀作為準確的溫度參考。我們使用FLIR公司的SC5000紅外熱像儀來測量FPGA的溫度分布,為了更加精確的溫度測量,使用激光技術(shù)減薄FPGA芯片的封裝。經(jīng)過對比這種智能溫度傳感器可以適用于各種型號的FPGA。誤差最大為1.6℃。三、基于HotSpot軟件對FPGA進行溫度建模仿真,在HotSpot軟件中繪制FPGA的布局規(guī)劃圖,修改各項配置文檔,仿真可獲得FPGA的溫度分布圖,進一步與溫度傳感器得到的溫度分布對比。
[Abstract]:FPGA (Field Programmable Logic Gate Array) plays an increasingly important role in many fields because of its high flexibility and low cost. With the increasing number of logic gates used in the application of FPGA, the integration level is increasing, the power consumption is increasing, and the temperature on the FPGA chip is becoming higher and higher, which may lead to the decrease of circuit reliability. The uneven increase of chip power consumption will lead to the generation of heat spots and the increase of temperature gradient. The measurement of single junction temperature can not reflect the temperature distribution in space. The estimation of total power consumption and average chip temperature inevitably leads to misjudgment of heat spot location. Therefore, it is of great significance to study the temperature distribution of FPGA in working state. In this paper, an intelligent temperature sensing network is proposed. The transient temperature distribution of Cyclone series FPGA of Altera Company is measured, which is different from the previous structure of voltage or current. The ring oscillator is used as the way of temperature sensing. By converting the temperature signal to the delay time, the temperature sensor can be dynamically inserted or deleted inside the FPGA. On this basis, the following aspects are included: first, an intelligent temperature sensor based on ring oscillator is proposed to dynamically measure the transient temperature distribution of FPGA. This intelligent temperature sensor uses the corresponding relation between the delay and temperature of the ring oscillator to realize the detection temperature. The measured temperature can be converted into a time signal proportional to the temperature. The output frequency is read out by a counter with a scan loop and then sent back to the upper computer through the serial port. This temperature sensor is applied to FPGA to measure the temperature distribution of FPGA running in different programs. Then the influence of the number of inverters and the power supply voltage on the temperature sensor is discussed and the thermal response time of the temperature sensor is calculated. Second, the intelligent temperature sensor is evaluated in vacuum and atmosphere respectively. The infrared thermal imager is used as an accurate temperature reference. We use FLIR's SC5000 infrared thermal imager to measure the temperature distribution of FPGA. For more accurate temperature measurement, we use laser technology to reduce the packaging of FPGA chip. Compared with this intelligent temperature sensor, it can be applied to various types of FPGA. The maximum error is 1.6 鈩，

本文編號：1957914