本文選題：LED + 結(jié)溫　； 參考：《深圳大學(xué)》2015年碩士論文

【摘要】：大功率LED的實(shí)際使用壽命遠(yuǎn)低于其理論壽命,存在可靠性和耐久性問(wèn)題,從而制約其在高效節(jié)能環(huán)保照明領(lǐng)域的廣泛應(yīng)用。針對(duì)結(jié)溫和熱阻是影響大功率LED器件可靠性的重要因素,本文以實(shí)現(xiàn)LED結(jié)溫與熱阻的在線測(cè)量為目標(biāo),對(duì)結(jié)溫和熱阻在線測(cè)量原理進(jìn)行了分析,設(shè)計(jì)并研發(fā)了多通道LED結(jié)溫和熱阻在線測(cè)量系統(tǒng),并結(jié)合LED復(fù)合過(guò)應(yīng)力加速老化試驗(yàn)系統(tǒng),對(duì)老化過(guò)程中大功率LED芯片的結(jié)溫和熱阻變化規(guī)律進(jìn)行了探索性研究。主要工作及結(jié)論如下:(1)通過(guò)對(duì)大功率LED結(jié)溫與熱阻測(cè)量方法的大量調(diào)研,對(duì)小電流K系數(shù)法進(jìn)行了理論分析和推導(dǎo),提出了減少測(cè)試電流引起LED器件自發(fā)熱影響的小電流K系數(shù)法。(2)提出了基于ARM-Cortex M3內(nèi)核的八通道大功率LED結(jié)溫與熱阻在線測(cè)量系統(tǒng)實(shí)現(xiàn)方案,實(shí)現(xiàn)了大電流壓控恒流源及小電流測(cè)試恒流源的精確輸出以及LED端電壓的準(zhǔn)確測(cè)量。設(shè)計(jì)了包括K值標(biāo)定算法、電流標(biāo)定算法以及結(jié)溫和熱阻測(cè)量算法的嵌入式程序,并開(kāi)發(fā)了相應(yīng)的上位機(jī)軟件,實(shí)現(xiàn)了多通道LED的切換控制和結(jié)溫與熱阻的測(cè)量以及數(shù)據(jù)存儲(chǔ)。最后,通過(guò)多組實(shí)際測(cè)試數(shù)據(jù)對(duì)系統(tǒng)的軟硬件電路進(jìn)行了實(shí)驗(yàn)驗(yàn)證。(3)將研發(fā)出的大功率LED結(jié)溫與熱阻在線測(cè)量系統(tǒng)與溫度、濕度、振動(dòng)三綜合可靠性試驗(yàn)系統(tǒng)相結(jié)合,實(shí)現(xiàn)了大功率LED器件在過(guò)應(yīng)力環(huán)境下,光、色、熱、電等多參數(shù)的實(shí)時(shí)在線測(cè)量。(4)利用具有光、色、熱、電參數(shù)在線實(shí)時(shí)測(cè)量功能的三綜合可靠性測(cè)試試驗(yàn)機(jī)對(duì)LED器件在復(fù)合過(guò)應(yīng)力條件下,結(jié)溫與熱阻以及光參數(shù)的變化規(guī)律進(jìn)行了探索性研究。初步研究發(fā)現(xiàn),大功率LED器件在過(guò)載電流驅(qū)動(dòng)下,結(jié)溫隨著工作時(shí)間的增加逐漸增加;大功率LED器件結(jié)溫和熱阻的突變,沒(méi)有引起光通量、色溫和光譜較明顯的變化。本文研發(fā)的大功率LED結(jié)溫與熱阻測(cè)量系統(tǒng)能準(zhǔn)確有效地在線獲得大LED器件工作時(shí)的結(jié)溫及熱阻,為L(zhǎng)ED產(chǎn)業(yè)鏈中相關(guān)工藝的精確控制及LED產(chǎn)品可靠性研究提供了有力的依據(jù)。
[Abstract]:The practical service life of high power LED is far lower than its theoretical life, which has the problems of reliability and durability, which restricts its wide application in the field of high efficiency, energy saving and environmental protection lighting. In view of the fact that junction temperature and thermal resistance are important factors affecting the reliability of high power LED devices, the principle of on-line measurement of junction temperature and thermal resistance is analyzed in this paper, aiming at the on-line measurement of LED junction temperature and thermal resistance. An on-line measurement system of multi-channel LED junction and thermal resistance was designed and developed. Combined with LED composite overstress accelerated aging test system, the variation of junction and thermal resistance of high-power LED chip during aging was investigated. The main work and conclusions are as follows: (1) the small current K coefficient method is theoretically analyzed and deduced through a large number of investigations on the measurement methods of junction temperature and thermal resistance of high power LED. A low current K coefficient method for reducing the self-heating effect of LED devices caused by testing current is presented. A scheme of the eight channel high power LED junction temperature and thermal resistance on-line measurement system based on ARM-Cortex M3 core is proposed. The accurate output of high current voltage controlled constant current source and small current measurement constant current source and the accurate measurement of LED terminal voltage are realized. The embedded program including K value calibration algorithm, current calibration algorithm and junction and thermal resistance measurement algorithm is designed, and the corresponding host computer software is developed. The switch control of multi-channel LED, the measurement of junction temperature and thermal resistance and the data storage are realized. Finally, the hardware and software circuits of the system are verified by many real test data. The high power LED junction temperature and thermal resistance on-line measurement system is combined with three integrated reliability test systems, temperature, humidity and vibration. In this paper, we have realized the real time on-line measurement of light, color, heat, electricity and other parameters in high power LED devices under overstress environment, using light, color, heat, etc. An exploratory study on the variation of junction temperature, thermal resistance and optical parameters of LED devices under the condition of composite overstress is carried out by three comprehensive reliability testing machines for on-line real-time measurement of electrical parameters. It is found that the junction temperature of high power LED devices increases gradually with the increase of working time under the driving of overload current, and the sudden change of junction temperature and thermal resistance of high power LED devices does not cause the luminous flux, and the color temperature spectrum changes obviously. The high power LED junction temperature and thermal resistance measurement system developed in this paper can accurately and effectively obtain the junction temperature and thermal resistance of large LED devices online, which provides a powerful basis for the precise control of relevant processes in the LED industrial chain and the study of the reliability of LED products.
【學(xué)位授予單位】：深圳大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN312.8

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