本文選題：航天產(chǎn)品 + CCGA�。� 參考：《北華航天工業(yè)學(xué)院》2017年碩士論文

【摘要】：隨著科技的進(jìn)步和工藝的發(fā)展,電子元器件多功能、小型化、高密度、高可靠的發(fā)展趨勢(shì)和要求日益迫切。為適應(yīng)高可靠應(yīng)用環(huán)境,高密度多引腳面陣列封裝BGA由塑料封裝轉(zhuǎn)向陶瓷封裝。為進(jìn)一步改善器件基板與電路板之間的熱膨脹系數(shù)不匹配造成的熱疲勞損傷,將BGA封裝的焊球換成焊柱,即CCGA封裝,具有更高的熱可靠性。為滿足航天產(chǎn)品的應(yīng)用需求,論文對(duì)CCGA封裝器件的高可靠裝聯(lián)技術(shù)進(jìn)行了研究。CCGA裝聯(lián)技術(shù)的關(guān)鍵是器件植柱工藝和板級(jí)裝聯(lián)工藝。本文通過(guò)試驗(yàn)對(duì)CCGA裝聯(lián)工藝參數(shù)和流程進(jìn)行摸索和控制,主要包括CCGA植柱工裝設(shè)計(jì)、植柱印刷錫膏量、焊柱安裝、印刷參數(shù)、貼裝參數(shù)、回流焊接工藝及溫度參數(shù)、清洗等。首先,完成不同錫膏量和溫度參數(shù)下器件板級(jí)裝聯(lián),然后,對(duì)試驗(yàn)電路板進(jìn)行環(huán)境試驗(yàn)(溫度循環(huán)和振動(dòng)),最后,通過(guò)光學(xué)顯微鏡、X-Ray檢測(cè)儀、金相顯微鏡、掃描電子顯微鏡等對(duì)焊點(diǎn)外觀形貌、焊點(diǎn)內(nèi)部以及焊料與基板間IMC進(jìn)行分析。利用有限元仿真對(duì)板級(jí)PCBA和器件級(jí)CCGA在溫度循環(huán)和振動(dòng)載荷下應(yīng)力分布以及變形情況進(jìn)行了分析,并與環(huán)境試驗(yàn)結(jié)果進(jìn)行對(duì)比。研究表明:(1)器件植柱工裝及工藝可行,植柱效果和板級(jí)組裝質(zhì)量達(dá)到相關(guān)要求。(2)CCGA封裝具有更高的熱可靠性,可作為苛刻環(huán)境中相關(guān)電子產(chǎn)品器件的優(yōu)先選擇;研究CCGA封裝的組裝工藝,為電子產(chǎn)品能在更加苛刻的環(huán)境中工作提供可靠的裝聯(lián)工藝。
[Abstract]:With the development of science and technology, the multifunction, miniaturization, high density and high reliability of electronic components are becoming more and more urgent. In order to adapt to the high reliable application environment, the high density multi-pin array packaging (BGA) changed from plastic packaging to ceramic packaging. In order to further improve the thermal fatigue damage caused by the mismatch of thermal expansion coefficient between the substrate and the circuit board, the solder ball of BGA package is replaced by solder post, that is, CCGA package, which has higher thermal reliability. In order to meet the application requirements of aerospace products, the key technologies of high reliability mounting technology of CCGA packaging devices are device mounting technology and plate-level mounting technology. In this paper, the process parameters and process of CCGA mounting are studied and controlled by experiments, including the design of CCGA column mounting equipment, the amount of solder paste, the installation of solder post, printing parameters, mounting parameters, reflux welding process and temperature parameters, cleaning and so on. First of all, to complete the different tin paste and temperature parameters of the device board level assembly, and then, to test the circuit board environment test (temperature cycle and vibration, finally, through optical microscope X-Ray detector, metallographic microscope, Scanning electron microscopy (SEM) was used to analyze the appearance of solder joint, internal solder and IMC between solder and substrate. Finite element simulation was used to analyze the stress distribution and deformation of plate-level PCBA and device-level CCGA under temperature cycling and vibration loading, and the results were compared with the results of environmental tests. The results show that the structure and process of the component are feasible, and the effect of column planting and the quality of board assembly are up to the relevant requirements. The CCGA package has higher thermal reliability and can be used as the first choice of the related electronic devices in harsh environment. The assembly process of CCGA packaging is studied to provide reliable assembly process for electronic products working in more demanding environment.
【學(xué)位授予單位】：北華航天工業(yè)學(xué)院
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN405

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