本文選題：透明基板封裝 + LED燈絲�。� 參考：《杭州電子科技大學(xué)》2015年碩士論文

【摘要】：本文以透明基板為封裝材料,設(shè)計(jì)并實(shí)現(xiàn)了一種新型的LED燈絲球泡燈,以提高LED的出光效率為主要目的,對(duì)LED芯片封裝技術(shù)的發(fā)展現(xiàn)狀和存在的一些問(wèn)題進(jìn)行了較為深入的闡述;通過(guò)理論分析、仿真模擬與實(shí)踐相結(jié)合的方法,探索了LED最佳光色性能和散熱性能的封裝結(jié)構(gòu)和材料的工藝參數(shù);制作并測(cè)試透明基板封裝的LED燈絲球泡燈的相關(guān)性能。分析以及測(cè)試結(jié)果表明:(1)對(duì)小功率LED芯片而言,選用熱導(dǎo)率為20W/(m?K)氧化鋁陶瓷基板,熱導(dǎo)率為10~64W/(m?K)導(dǎo)熱膠即可滿足其封裝要求。散熱基板厚度為0.2mm厚時(shí),增大固晶層厚度可在一定程度上減小LED芯片溫度,一般情況下,為避免固晶膠爬膠、浸沒(méi)LED芯片等引起電極短路問(wèn)題的發(fā)生,固晶層厚度應(yīng)小于LED芯片厚度。(2)LED基板厚度增大,LED芯片正常工作的溫度越低,適當(dāng)減小LED封裝基板材料的厚度,可避免LED器件的藍(lán)光泄露、眩光,且節(jié)約成本,故選取LED基板厚度為0.2mm。(3)研制了一種新型高出光效率的透明基板封裝的LED燈絲球泡燈。根據(jù)ANSYS仿真,對(duì)LED芯片封裝工藝做了全面且細(xì)致的設(shè)計(jì),而后采用絲網(wǎng)印刷技術(shù)制備了封裝線路板、接著對(duì)LED芯片固晶和引線焊接、熒光粉膠的調(diào)配、熒光膠的涂覆,最后制成了正裝芯片和倒裝芯片封裝在不同基板材料上的幾種高出光效率的透明基板封裝的LED燈絲球泡燈。(4)測(cè)試所制的高出光效率的透明基板封裝的LED燈絲的光色電性能、老化性能、紅外熱像圖以及鉑熱電阻,LED燈絲球泡燈(采用正裝/倒裝芯片的玻璃封裝)光通量467.29lm/230.802 lm、光效110.06lm/W/118.36 lm/W;相關(guān)色溫3172K/3158 K、顯色指數(shù)84.1/82.7、色純度34.9%/37.4%。LED燈絲球泡燈(采用正裝/倒裝芯片的藍(lán)寶石封裝)光通量471.69lm/231.375 lm、光效111.79lm/W/120.07 lm/W;相關(guān)色溫3004K/3048 K、顯色指數(shù)81.9/83.5、色純度47%/42.2%。(5)對(duì)現(xiàn)有的LED球泡燈做了光學(xué)對(duì)比測(cè)試與分析,采用透明基板封裝的LED燈絲球泡燈比現(xiàn)有封裝LED的亮度提升了16%,發(fā)光效率提高了13%,顯色指數(shù)提高了4%。采用透明基板封裝的LED燈絲結(jié)構(gòu)緊湊、體積小、重量輕、成本低、高光效,代替了人們使用了100多年的鎢絲白熾燈,符合人們的審美觀。
[Abstract]:In this paper, a new type of LED filament bulb lamp is designed and realized with transparent substrate as the packaging material. The main purpose of this paper is to improve the efficiency of LED. The development of LED chip packaging technology and some existing problems are described in depth, and the method of combining simulation with practice, through theoretical analysis, simulation and practice, is presented. The optimum photochromic and heat dissipation properties of LED packaging structure and material process parameters were explored, and the properties of LED filament bulb lamp with transparent substrate packaging were tested and fabricated. The analysis and test results show that for the low power LED chip, the thermal conductivity of 20 W / m ~ (-1) Al _ 2O _ 3 ceramic substrate with a thermal conductivity of 10 ~ 64 W / m ~ (-1) can meet the packaging requirements. When the thickness of the heat dissipation substrate is 0.2mm, the temperature of the LED chip can be reduced to some extent by increasing the thickness of the solid layer. In general, in order to avoid the short circuit of the electrode caused by the gluing of the solids and the immersion of the LED chip, The thickness of solid layer should be smaller than the thickness of LED chip. The thicker the substrate thickness of LED chip is, the lower the temperature of normal operation of LED chip is. It can avoid the leakage of blue light, glare and save cost by decreasing the thickness of LED packaging substrate material. Therefore, a new type of LED filament bulb lamp with high light efficiency and transparent substrate encapsulation is developed by selecting 0.2mm 路m3 LED substrate thickness. According to ANSYS simulation, the encapsulation process of LED chip is designed in detail, and then the packaging circuit board is fabricated by screen printing technology. Then, the solid crystal and lead welding of LED chip, the blending of phosphor glue and the coating of fluorescent glue are carried out. Finally, several kinds of LED filament bulb lamp with high light efficiency and transparent substrate encapsulated on different substrate materials are fabricated to test the photochromic properties of the LED filament with high light efficiency and transparent substrate encapsulation. Aging performance, Infrared thermogram and platinum thermal resistor LED filament bulb lamp (glass package with positive / inverted chip) luminous flux 467.29lm/230.802 lm, light efficiency 110.06lm/W/118.36 LM / W; related color temperature 3172K/3158 K, color index 84.1 / 82.7, color purity 34.9%/37.4%.LED filament bulb lamp (using formal / inverted chip) The luminous flux 471.69lm/231.375 lm, light efficiency 111.79lm/W/120.07 LM / W; related color temperature 3004K/3048 K, color rendering index 81.9 / 83.5, color purity 47 / 42.2) were compared and analyzed for the existing LED bulb lamps. The brightness of the LED filament bulb lamp packaged with transparent substrate is increased by 16 times than that of the existing package LED, the luminous efficiency is increased by 13 times, and the color rendering index is increased by 4%. The LED filament packaged with transparent substrate has compact structure, small volume, light weight, low cost and high light efficiency. It replaces the tungsten filament incandescent lamp which has been used for more than 100 years.
【學(xué)位授予單位】：杭州電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN312.8

【共引文獻(xiàn)】

相關(guān)期刊論文 前1條

1 吳敏強(qiáng);;LED摩托車前照燈的光學(xué)系統(tǒng)設(shè)計(jì)[J];機(jī)電工程技術(shù);2014年01期

相關(guān)碩士學(xué)位論文 前8條

1 祁姝琪;LED芯片的COB封裝技術(shù)[D];杭州電子科技大學(xué);2013年

2 李震;基于Zigbee技術(shù)的大功率LED路燈監(jiān)控系統(tǒng)的設(shè)計(jì)與實(shí)現(xiàn)[D];華南理工大學(xué);2014年

3 袁巧霞;LED臺(tái)燈的設(shè)計(jì)與研究[D];華南理工大學(xué);2014年

4 李祥;帶過(guò)溫保護(hù)功能的低功耗LED恒流驅(qū)動(dòng)電路設(shè)計(jì)[D];湘潭大學(xué);2014年

5 李向陽(yáng);綠色節(jié)能目標(biāo)下的商業(yè)照明燈具應(yīng)用設(shè)計(jì)研究[D];齊齊哈爾大學(xué);2014年

6 凌嘉輝;應(yīng)用鋁碳化硅散熱基板的LED高性能COB封裝[D];華南理工大學(xué);2014年

7 畢建峰;具有日光感知功能的LED調(diào)光控制器研究[D];大連工業(yè)大學(xué);2014年

8 劉剛;植物生長(zhǎng)LED照明控制系統(tǒng)的研究[D];天津職業(yè)技術(shù)師范大學(xué);2014年

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本文編號(hào)：1918317