本文選題：微納制造 + 鍵合　； 參考：《西安工業(yè)大學(xué)》2015年碩士論文

【摘要】：近年來,隨著MEMS技術(shù)和半導(dǎo)體技術(shù)的進(jìn)步,電子器件正向著高集成度、低功耗和高速度方面發(fā)展。聲表面波器件(Surface acoustic wave,SAW)所使用的材料對(duì)器件的性能起著決定性的作用,本文對(duì)器件的材料石英和LiNbO3分別和Si進(jìn)行了鍵合技術(shù)研究,為了制作器件對(duì)鍵合片進(jìn)行了減薄拋光,設(shè)計(jì)了簡單的器件并用COMSOL和MATLAB對(duì)器件的性能進(jìn)行了仿真、后續(xù)研究了器件的光刻技術(shù)。從本文的研究內(nèi)容得到以下結(jié)論：①通過選擇一定波段的紫外固化膠,并在300-436nm曝光波長的曝光機(jī)下曝光,制得了8mm×8mm鍵合片。分別實(shí)現(xiàn)了LiNbO3以及石英和硅片的鍵合,用剪切力測試機(jī)測得最大鍵剪切力分別為116.2N和117.9N。用裂紋傳播測試法測試LiNbO3鍵合片的鍵合能為5.831 J/m2。鍵合片的中間鍵合層厚度為約3μm。②在聲表面波器件的設(shè)計(jì)中,根據(jù)δ函數(shù)模型的理論分析結(jié)合本實(shí)驗(yàn)對(duì)叉指換能器的參數(shù)進(jìn)行了設(shè)計(jì),設(shè)計(jì)出線寬2.495μm的延遲器和線寬2μm的諧振器,后根據(jù)設(shè)計(jì)的結(jié)果用L-edit畫出版圖,制得本實(shí)驗(yàn)所需要的掩膜板。③用有限元仿真軟件COMSOL對(duì)設(shè)計(jì)的器件進(jìn)行建立模型,分析了器件的波傳播特性。在MATLAB上以LiNbO3為基底,用P矩陣和COM耦合模型對(duì)聲表面波諧振器電學(xué)諧振特性的插入損耗和諧振導(dǎo)納進(jìn)行了仿真研究。④用設(shè)計(jì)制得的掩膜板做掩膜,在制得的鍵合片上經(jīng)過涂膠、前烘、曝光、顯影四個(gè)部分制得了光刻形貌較好的樣品。經(jīng)過試驗(yàn)得到前烘100℃(10min),曝光時(shí)間7.5s,顯影時(shí)間40s用顯微鏡觀察到最好的光刻效果,光刻線寬為2.495μm。前烘100℃(10min),曝光時(shí)間8s,顯影時(shí)間40s得到線寬為2μm的最好光刻圖案。
[Abstract]:In recent years, with the development of MEMS technology and semiconductor technology, electronic devices are developing towards high integration, low power consumption and high speed. The materials used in the surface acoustic wave device (saw) play a decisive role in the performance of the device. In this paper, the bonding technology of quartz and LiNbO3 and Si are studied respectively. In order to make the device, the bonding plate is thinned and polished. A simple device is designed and the performance of the device is simulated by COMSOL and MATLAB. The photolithography technology of the device is studied. From the study of this paper, the following conclusions are drawn: 1. By selecting a certain band of UV curable adhesive and exposed under the exposure machine of 300-436nm exposure wavelength, the 8mm 脳 8mm bonding plate is prepared. The bonding of LiNbO3 and quartz and silicon wafer is realized respectively. The maximum bond shear force measured by shear force tester is 116.2N and 117.9Nrespectively. The bonding energy of LiNbO3 bonding plate measured by crack propagation method is 5.831 J / m2. The thickness of the intermediate bonding layer of the bonding plate is about 3 渭 m ~ 2. In the design of saw devices, the parameters of the interDigital transducer are designed according to the theoretical analysis of the 未 function model and this experiment. The delay device of 2.495 渭 m line width and the resonator of 2 渭 m line width are designed. According to the design results, the layout of the device is drawn with L-edit, and the mask plate 3 required in this experiment is built up by the finite element simulation software COMSOL. The wave propagation characteristics of the device are analyzed. The insertion loss and resonant admittance of surface acoustic wave resonator are simulated by using P matrix and COM coupling model based on LiNbO3 on MATLAB. 4. The mask plate designed is used as mask. The samples with better lithography were prepared by coating, pre-baking, exposure and development on the prepared bonding sheet. The best lithography effect was observed by microscope for 40 s, exposure time was 7.5 s. The line width of lithography was 2.495 渭 m. The best lithography pattern with a linewidth of 2 渭 m was obtained by baking at 100 鈩，

本文編號(hào)：1917510