沖擊式多晶硅破碎裝置的研究與設(shè)計(jì)
本文選題:多晶硅 + 損傷分析。 參考:《石河子大學(xué)》2017年碩士論文
【摘要】:多晶硅(Polysilicon)作為半導(dǎo)體材料所使用的基礎(chǔ)材料,在微電子技術(shù)和光伏發(fā)電技術(shù)中應(yīng)用普遍,被稱為“微電子大廈的基石”。多晶硅破碎長久以來一直是采用人工使用鑲嵌硬質(zhì)合金或者碳化鎢合金的破碎錘進(jìn)行敲碎作業(yè),即使在一些多晶硅技術(shù)較先進(jìn)的國家也一貫采用這種破碎方式。人工破碎靈活性好,但破碎效率低,破碎過程中產(chǎn)生的粉塵,對(duì)工人健康危害較大。隨著國內(nèi)多晶硅企業(yè)的規(guī)模和集中度大幅提升,人工破碎已難以滿足生產(chǎn)需求,自動(dòng)化破碎是多晶硅破碎發(fā)展的必然趨勢(shì)。本文以多晶硅在沖擊作用下的損傷裂紋擴(kuò)展的基礎(chǔ)上,研究設(shè)計(jì)了沖擊式多晶硅破碎裝置。采用Pro/E三維建模軟件建立了破碎裝置的三維模型,對(duì)破碎裝置的主要零部件進(jìn)行了靜力學(xué)分析,并對(duì)破碎裝置進(jìn)行了PLC運(yùn)控控制的編寫。1、采用AUTODYN軟件,結(jié)合脆性材料的損傷本構(gòu)模型,對(duì)多晶硅棒在平面破碎錘和圓頭破碎錘對(duì)多晶硅棒進(jìn)行沖擊損傷模擬,觀察其各自的裂紋擴(kuò)展分布情況。平面錘頭沖擊下裂紋擴(kuò)展較快且擴(kuò)展區(qū)域更廣,圓錘頭裂紋擴(kuò)展較慢。經(jīng)分析,平面錘頭更適合多晶硅的破碎,圓點(diǎn)的作用更適合作為輔助破碎。根據(jù)這部分的損傷模擬分析,為沖擊式多晶硅破碎裝置提供了理論依據(jù)。2、根據(jù)沖擊式多晶硅破碎裝置的設(shè)計(jì)要求,以沖擊作用下多晶硅損傷裂紋擴(kuò)展為基礎(chǔ),提出沖擊式多晶硅破碎裝置的總體設(shè)計(jì)方案,對(duì)傳動(dòng)部分進(jìn)行選型,對(duì)關(guān)鍵零部件進(jìn)行設(shè)計(jì),最后采用Pro/E進(jìn)行裝置的整體三維建模。3、采用ANSYS有限元分析軟件對(duì)裝置的關(guān)鍵零部件進(jìn)行靜力學(xué)仿真,分析了關(guān)鍵零部件在作業(yè)過程的可靠性。4、使用PLC可編程邏輯控制器,根據(jù)所要求的破碎步驟,采用GX-Developer軟件編寫梯形圖指令,實(shí)現(xiàn)破碎裝置的自動(dòng)化控制。經(jīng)軟件仿真模擬,指令編寫正確。
[Abstract]:Polysilicon, as the basic material used in semiconductor materials, is widely used in microelectronics and photovoltaic power generation technology. It is called "the cornerstone of microelectronics building". For a long time, the crushing of polysilicon has been done by using hammer embedded in cemented carbide or tungsten carbide, even in some countries with advanced polysilicon technology. The artificial crushing has good flexibility, but the crushing efficiency is low, and the dust produced in the crushing process is harmful to workers' health. With the increase of the scale and concentration of polysilicon enterprises in China, it is difficult to meet the production demand by artificial crushing. Automatic crushing is the inevitable trend of the development of polysilicon crushing. On the basis of damage crack propagation of polysilicon under impact, an impact polysilicon crushing device is designed in this paper. The 3D model of the crushing device is established by using Pro/E software. The main parts of the crushing device are statically analyzed, and the PLC operation control is compiled for the crushing device. The AUTODYN software is used to control the crushing device. Combined with the damage constitutive model of brittle materials, the impact damage of polysilicon bar on plane and round head was simulated, and their crack propagation distribution was observed. Under the impact of the plane hammer, the crack growth is faster and the propagation area is wider, and the crack growth of the circular hammer is slower. The analysis shows that the plane hammer is more suitable for the breaking of polysilicon and the dot is more suitable for the auxiliary crushing. According to the damage simulation analysis of this part, it provides a theoretical basis for the impact polysilicon crushing device. According to the design requirements of the impact polysilicon crushing device, it is based on the damage crack propagation of the impact polysilicon. The overall design scheme of the impact polysilicon crushing device is put forward. The type selection of the transmission part and the design of the key parts are carried out. Finally, the whole 3D modeling of the device is built by Pro/E. The statics simulation of the key parts of the device is carried out by using ANSYS finite element analysis software. The reliability of the key parts in the operation process is analyzed. The reliability of the key parts is analyzed. The PLC programmable logic controller is used. According to the required crushing steps, the GX-Developer software is used to write the ladder diagram instruction to realize the automatic control of the crushing device. Through the simulation of software, the instruction is written correctly.
【學(xué)位授予單位】:石河子大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2017
【分類號(hào)】:TN304.12
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