本文選題：柔性電子 + 液態(tài)金屬　； 參考：《浙江大學(xué)》2017年碩士論文

【摘要】：柔性電子是將電子器件制作在柔性基板上的新興電子技術(shù),具有可彎曲、拉伸、輕量化等優(yōu)點(diǎn),近年來發(fā)展迅速。但現(xiàn)有的柔性電子制造技術(shù)從導(dǎo)電功能材料的制備到柔性電子的制作工藝,以及產(chǎn)品的后續(xù)處理等過程較為復(fù)雜,時間成本、設(shè)備成本和原料成本較高。鎵銦合金等液態(tài)金屬在室溫下呈液態(tài)、流動性好、電導(dǎo)率高、成本低,是較為理想的柔性電子制造技術(shù)功能材料。采用直寫液態(tài)金屬方法進(jìn)行柔性電子產(chǎn)品的制造,便捷高效,對設(shè)備要求低,柔性強(qiáng),具有廣闊的應(yīng)用前景。本論文提出了一種基于液態(tài)金屬直寫的柔性電子打印方法,實(shí)現(xiàn)柔性基底的液態(tài)金屬直寫打印及封裝。本論文的主要研究內(nèi)容如下:1、研究了液態(tài)金屬材料的氧化性質(zhì),選定適合液態(tài)金屬直寫的基底材料,探究了其與液態(tài)金屬的潤濕性及粘附機(jī)理。通過打印硅膠對液態(tài)金屬進(jìn)行封裝,便于柔性液態(tài)金屬產(chǎn)品的應(yīng)用和保存。2、搭建了液態(tài)金屬直寫設(shè)備。優(yōu)化了三軸運(yùn)動設(shè)備的穩(wěn)定度和運(yùn)動精度,設(shè)計了液態(tài)金屬與硅膠的擠出系統(tǒng),采用帶行星減速器的步進(jìn)電機(jī)系統(tǒng)精確控制滾珠絲杠的位移來保證材料擠出量的精確性,并構(gòu)建雙噴頭打印封裝系統(tǒng),減少產(chǎn)品加工設(shè)備。3、探究了液態(tài)金屬的直寫工藝,探究了針頭的種類、針頭的內(nèi)徑、噴頭運(yùn)動速度和平臺高度等運(yùn)動參數(shù)對液態(tài)金屬直寫效果的影響,選定最佳打印方案。對硅膠的打印參數(shù)進(jìn)行了研究,使其在打印過程中能夠完好地密封液態(tài)金屬直寫線路。4、研究了柔性電子直寫技術(shù)的系列應(yīng)用。實(shí)現(xiàn)了液態(tài)金屬直寫技術(shù)在RFID射頻識別標(biāo)簽、柔性天線等電子元件制造上的應(yīng)用。制作了柔型電路,提出柔性PCB的直寫方法。探究了本方法在可穿戴設(shè)備上的應(yīng)用。
[Abstract]:Flexible electron is a new electronic technology which fabricates electronic devices on flexible substrate. It has the advantages of bending, stretching, lightweight and so on. It has developed rapidly in recent years. However, the existing flexible electronic manufacturing technology is more complex from the preparation of conductive functional materials to the fabrication process of flexible electronics, and the follow-up treatment of products. The cost of time, equipment and raw materials is high. Liquid metals such as gallium and indium alloys are liquid at room temperature, with good fluidity, high conductivity and low cost, so they are ideal functional materials for flexible electronic manufacturing technology. It is convenient and efficient to use direct writing liquid metal method to manufacture flexible electronic products. In this paper, a flexible electronic printing method based on liquid metal direct writing is proposed to realize liquid metal direct writing printing and packaging on flexible substrate. The main contents of this thesis are as follows: 1. The oxidation properties of liquid metal materials are studied. The substrate materials suitable for direct writing of liquid metals are selected and the wettability and adhesion mechanism between them and liquid metals are investigated. The liquid metal is encapsulated by printing silica gel, which is convenient for the application and preservation of flexible liquid metal products, and the liquid metal direct writing equipment is built. The stability and precision of triaxial motion equipment are optimized, and the extrusion system of liquid metal and silica gel is designed. The displacement of ball screw is precisely controlled by step motor system with planetary reducer to ensure the accuracy of material extrusion quantity. And build a double nozzle printing and packaging system, reduce the product processing equipment. 3, explore the direct writing technology of liquid metal, probe into the type of needle, the inner diameter of needle, The effect of motion parameters such as velocity of nozzle and height of platform on the direct writing effect of liquid metal was selected and the best printing scheme was selected. The printing parameters of silica gel are studied so that it can seal the liquid metal direct writing circuit. 4. The application of flexible electronic direct writing technology is studied. The liquid metal direct writing technology is applied to the manufacture of RFID RFID tags, flexible antennas and other electronic components. A flexible circuit is made and a direct writing method for flexible PCB is proposed. The application of this method in wearable devices is explored.
【學(xué)位授予單位】：浙江大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TN605

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