本文選題：InPb焊料 + 非制冷焦平面探測(cè)器　； 參考：《紅外技術(shù)》2017年07期

【摘要】：研究了采用純度為99.9%的In70Pb30合金作為焊料片的低溫焊接技術(shù),分析了焊接時(shí)候的影響因素:焊料片的影響、升溫速率、焊接溫度、真空度,通過采用甲酸對(duì)焊料片預(yù)處理去除氧化層,在215℃、5×10~(-7) torr的真空環(huán)境下進(jìn)行了焊接,焊接后的樣品采用X-ray、拉力測(cè)試系統(tǒng)、檢漏儀測(cè)試了樣品的孔洞率、焊接強(qiáng)度、漏率,結(jié)果表明:焊接后焊接區(qū)域合金均勻、無縫隙、孔洞率少、剪切力高、氣密性好,能夠滿足非制冷焦平面的窗口封接的氣密性要求。
[Abstract]:The low temperature welding technology of In70Pb30 alloy with 99.9% purity as solder was studied. The influence factors of welding time, such as the influence of solder, heating rate, welding temperature, vacuum degree, were analyzed. The oxidation layer was removed by pretreating the solder sheet with formic acid, and the welding was carried out in a vacuum environment of 215 鈩，

本文編號(hào)：1797463