本文選題：現(xiàn)場(chǎng)總線 + 介質(zhì)結(jié)合單元�。� 參考：《沈陽(yáng)工業(yè)大學(xué)》2015年碩士論文

【摘要】：論文研究基于國(guó)內(nèi)工藝的現(xiàn)場(chǎng)總線介質(zhì)結(jié)合單元（MAU）芯片設(shè)計(jì)技術(shù)�，F(xiàn)場(chǎng)總線是自動(dòng)控制領(lǐng)域的先進(jìn)技術(shù)，現(xiàn)場(chǎng)總線儀表較常規(guī)儀表有許多顯著的優(yōu)點(diǎn)。介質(zhì)結(jié)合單元（MAU）電路是現(xiàn)場(chǎng)總線儀表中的關(guān)鍵部件，用于實(shí)現(xiàn)內(nèi)部邏輯信號(hào)與總線信號(hào)的相互轉(zhuǎn)換，總線供電型現(xiàn)場(chǎng)總線儀表的MAU電路還負(fù)責(zé)從總線上吸取電流，為系統(tǒng)提供穩(wěn)定的工作電源。MAU電路是現(xiàn)場(chǎng)總線儀表的設(shè)計(jì)難點(diǎn)，目前只有少數(shù)國(guó)外公司能提供專(zhuān)用芯片，課題的研究對(duì)于提高國(guó)產(chǎn)現(xiàn)場(chǎng)總線儀表的競(jìng)爭(zhēng)力有重要意義。 論文首先介紹了現(xiàn)場(chǎng)總線的發(fā)展?fàn)顩r和國(guó)際標(biāo)準(zhǔn)，重點(diǎn)介紹了和分析了采用IEC61158-2低速現(xiàn)場(chǎng)總線標(biāo)準(zhǔn)的現(xiàn)場(chǎng)總線儀表的通信機(jī)制和信號(hào)傳輸原理，分析了MAU電路的功能和性能要求。在此基礎(chǔ)上，介紹了一種國(guó)外公司生產(chǎn)的典型MAU芯片，該芯片是一種大規(guī)�；旌闲盘�(hào)集成電路，使用少量外部元件即可實(shí)現(xiàn)MAU電路功能。為深入理解MAU電路的工作原理和設(shè)計(jì)方法，首先對(duì)該款芯片進(jìn)行了逆向分析，提取并整理了電路，并對(duì)該電路的工作原理和工藝要求進(jìn)行了深入分析。由于國(guó)內(nèi)沒(méi)有與原芯片兼容的工藝，，故采用了正向與逆向結(jié)合的設(shè)計(jì)方法，基于HHNEC0.35μm BCD工藝重新設(shè)計(jì)了一種與原芯片功能兼容的MAU芯片。設(shè)計(jì)中保留了部分原有電路結(jié)構(gòu)，但對(duì)許多電路模塊做了較大修改，部分模塊完全是重新設(shè)計(jì)的。論文具體介紹了其中啟動(dòng)模塊、恒流模塊、電源模塊和發(fā)送成型模塊等功能模塊的電路設(shè)計(jì)、仿真驗(yàn)證和版圖設(shè)計(jì)工作。設(shè)計(jì)中充分利用現(xiàn)有工藝的優(yōu)勢(shì)，簡(jiǎn)化了一些功能的實(shí)現(xiàn)方式，減小了版圖面積。論文中給出了詳細(xì)的仿真分析結(jié)果，結(jié)果表明所設(shè)計(jì)的MAU芯片在功能上與原芯片兼容，各項(xiàng)性能指標(biāo)均不低于原芯片水平。論文中給出了相關(guān)模塊的版圖和整體版圖，版圖設(shè)計(jì)通過(guò)了DRC和LVS驗(yàn)證。
[Abstract]:This paper studies the design technology of fieldbus dielectric combination Unit (mau) chip based on domestic technology. Fieldbus is an advanced technology in the field of automatic control. Fieldbus instruments have many advantages over conventional instruments. The dielectric combination Unit (Mau) circuit is the key component in the fieldbus instrument, which is used to realize the interconversion between the internal logic signal and the bus signal. The MAU circuit of the bus-powered fieldbus instrument is also responsible for absorbing the current from the bus. It is difficult to design fieldbus instrument to provide stable working power supply. At present, only a few foreign companies can provide special chip. The research on this topic is of great significance to improve the competitiveness of domestic fieldbus instruments. Firstly, this paper introduces the development of fieldbus and international standards, especially introduces and analyzes the communication mechanism and signal transmission principle of fieldbus instrument based on IEC61158-2 low speed fieldbus standard, and analyzes the function and performance requirements of MAU circuit. On this basis, a typical MAU chip produced by foreign companies is introduced. The chip is a large scale mixed signal integrated circuit, which can realize the function of MAU circuit with a few external components. In order to understand the working principle and design method of the MAU circuit, the reverse analysis of the chip is carried out, the circuit is extracted and sorted out, and the working principle and technological requirements of the circuit are analyzed. Because there is no compatible technology with the original chip in our country, a new MAU chip which is compatible with the original chip is designed based on the HHNEC0.35 渭 m BCD process. Part of the original circuit structure has been retained in the design, but many circuit modules have been greatly modified, and some of the modules have been completely redesigned. This paper introduces the circuit design, simulation verification and layout design of the function modules, such as startup module, constant current module, power supply module and transmission molding module. In the design, the advantages of the existing technology are fully utilized to simplify the realization of some functions and reduce the layout area. The detailed simulation results show that the designed MAU chip is compatible with the original chip in function and the performance index is not lower than that of the original chip. The layout and overall layout of the related modules are given in this paper. The layout design is verified by DRC and LVS.
【學(xué)位授予單位】：沈陽(yáng)工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TN402

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