高速PCB的信號(hào)完整性分析與硬件設(shè)計(jì)
本文選題:信號(hào)完整性 + PCB。 參考:《西安電子科技大學(xué)》2016年碩士論文
【摘要】:在現(xiàn)代高速PCB設(shè)計(jì)中,研究信號(hào)完整性問(wèn)題在于:對(duì)于PCB(印刷電路板)來(lái)說(shuō),信號(hào)完整性是其能否設(shè)計(jì)成功的關(guān)鍵因素。而隨著系統(tǒng)時(shí)鐘的頻率和信號(hào)邊沿的陡峭程度,在如今的高速數(shù)字電路設(shè)計(jì)中的要求越來(lái)越高,為了得到高質(zhì)量的產(chǎn)品,我們需要進(jìn)行信號(hào)完整性分析設(shè)計(jì)。本文的工作,在于解決高速PCB的信號(hào)完整性問(wèn)題,在理論分析的基礎(chǔ)上,仿真分析高速信號(hào)的波形,并根據(jù)仿真結(jié)果指導(dǎo)最終的PCB的設(shè)計(jì)。信號(hào)完整性分析的優(yōu)點(diǎn)是可以有效減短產(chǎn)品的開(kāi)發(fā)周期,在設(shè)計(jì)開(kāi)發(fā)過(guò)程中降低成本,并在產(chǎn)品的完成上提供更高的可靠性。首先,在查閱大量的文獻(xiàn)資料的基礎(chǔ)上,詳細(xì)介紹了信號(hào)完整性問(wèn)題;信號(hào)完整性分析需要仿真軟件的參與,介紹了在仿真軟件的參與下,信號(hào)完整性分析的仿真流程;國(guó)內(nèi)外的研究現(xiàn)狀對(duì)本課題研究具有指導(dǎo)意義,作者對(duì)其進(jìn)行了總結(jié)。其次,需要理論依據(jù)分析各種問(wèn)題,而信號(hào)完整性問(wèn)題的首要理論依據(jù)為傳輸線理論,在該理論的基礎(chǔ)上,對(duì)反射和串?dāng)_進(jìn)行仿真與分析,反射和串?dāng)_是高速PCB設(shè)計(jì)中的信號(hào)完整性問(wèn)題的重中之重,在仿真的基礎(chǔ)上找到解決這些影響的方法。再次,對(duì)具體設(shè)計(jì)——新體制成像系統(tǒng)的產(chǎn)品特點(diǎn)、硬件結(jié)構(gòu)原理圖和關(guān)鍵網(wǎng)絡(luò)進(jìn)行了闡述。另外,詳細(xì)分析了新體制成像系統(tǒng)的整體布局布線和層疊設(shè)計(jì),并對(duì)PCB的關(guān)鍵信號(hào)的信號(hào)完整性進(jìn)行仿真分析及應(yīng)用。最后,總結(jié)本文得出的結(jié)論,并對(duì)實(shí)際高速PCB設(shè)計(jì)以及與其相關(guān)的應(yīng)用具有一定的指導(dǎo)意義。
[Abstract]:In modern high-speed PCB design, the problem of signal integrity research is: for PCB (printed Circuit Board), the signal integrity is the key factor to the success of its design. With the frequency of the system clock and the steepness of the signal edge, the requirement of the high-speed digital circuit design is becoming higher and higher. In order to get the high quality products, we need to carry out the signal integrity analysis and design. The work of this paper is to solve the problem of signal integrity of high speed PCB. On the basis of theoretical analysis, the waveform of high speed signal is simulated and analyzed, and the final design of PCB is guided by the simulation results. The advantage of signal integrity analysis is that it can effectively shorten the product development cycle, reduce the cost in the process of design and development, and provide higher reliability in the completion of the product. First of all, on the basis of consulting a lot of literature, the signal integrity problem is introduced in detail, and the simulation flow of signal integrity analysis is introduced with the participation of simulation software. The research situation at home and abroad is of guiding significance to the research, and the author summarizes it. Secondly, all kinds of problems need to be analyzed theoretically, and the primary theoretical basis of signal integrity is transmission line theory. On the basis of this theory, the reflection and crosstalk are simulated and analyzed. Reflection and crosstalk are the most important problems of signal integrity in high-speed PCB design. Thirdly, the product characteristics, hardware schematic diagram and key network of the new system are described. In addition, the overall layout, wiring and stack design of the new imaging system are analyzed in detail, and the signal integrity of the key signals of PCB is simulated and applied. Finally, the conclusion of this paper is summarized, and it has certain guiding significance for the design of high speed PCB and its related applications.
【學(xué)位授予單位】:西安電子科技大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2016
【分類(lèi)號(hào)】:TN41
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