本文選題：微電子組裝 + 工藝參數(shù)優(yōu)化�。� 參考：《西南交通大學(xué)》2017年碩士論文

【摘要】：工業(yè)4.0和智能制造帶動(dòng)了制造業(yè)的轉(zhuǎn)型和升級(jí),工業(yè)4.0的特征是多品種小批量的定制生產(chǎn),根據(jù)定制產(chǎn)品,能快速、智能化調(diào)整和設(shè)置制造工藝和設(shè)備的參數(shù)。微組裝工藝技術(shù)包含著大量的輸入?yún)?shù),這些參數(shù)與輸出之間具有復(fù)雜的非線性關(guān)系,在實(shí)際生產(chǎn)過程中,往往需要大量的實(shí)驗(yàn)進(jìn)行多次調(diào)整修正才能最終確定滿足要求的工藝參數(shù),不能智能制造。因此,通過對(duì)實(shí)際微電子組裝工藝參數(shù)的分析和研究,建立微電子組裝工藝專家系統(tǒng),是實(shí)現(xiàn)微電子組裝智能制造的基礎(chǔ)。微組裝技術(shù)實(shí)質(zhì)上是一種高密度封裝聯(lián)合微焊接技術(shù)為基礎(chǔ)的綜合性工藝技術(shù),其主要的工藝流程包括錫膏印刷、貼裝、回流焊、檢測(cè)和返修。本文分析和歸納出不同封裝類型的組裝工藝流程及其相關(guān)的工藝參數(shù)的工程經(jīng)驗(yàn)值,主要研究微組裝錫膏印刷和回流焊工藝參數(shù)的優(yōu)化方法,并設(shè)計(jì)了微電子組裝工藝參數(shù)專家系統(tǒng)。首先,給出一種析因?qū)嶒?yàn)設(shè)計(jì)和響應(yīng)曲面中心復(fù)合設(shè)計(jì)法結(jié)合的錫膏印刷工藝參數(shù)的優(yōu)化方法。通過對(duì)焊膏印刷工藝參數(shù)的研究,確定影響印刷質(zhì)量的關(guān)鍵參數(shù)。在PCB良好且焊盤設(shè)計(jì)合理的情況下,采用5因數(shù)2水平的部分析因?qū)嶒?yàn),以印刷壓力、印刷速度、刮刀角度、脫模速度和脫模間距為實(shí)驗(yàn)因子,并以平均每塊實(shí)驗(yàn)板的焊膏填充率作為響應(yīng)結(jié)果。利用Minitab軟件對(duì)實(shí)驗(yàn)因子進(jìn)行分析,確立了影響印刷質(zhì)量的主要因素。根據(jù)析因?qū)嶒?yàn)的結(jié)果,采用響應(yīng)曲面法對(duì)印刷工藝參數(shù)進(jìn)行優(yōu)化,進(jìn)一步確定最佳的印刷工藝參數(shù)。其次,給出一種用神經(jīng)網(wǎng)絡(luò)技術(shù)建立回流溫度曲線輸入輸出映射模型,并用改進(jìn)的遺傳算法進(jìn)行回流溫度曲線優(yōu)化的方法。先分析回流焊接工藝的過程中,確定影響回流曲線設(shè)置的主要工藝參數(shù)。再采用傳統(tǒng)遺傳算法優(yōu)化的BP神經(jīng)網(wǎng)絡(luò)和改進(jìn)的遺傳算法優(yōu)化的BP神經(jīng)網(wǎng)絡(luò)對(duì)回流曲線模型進(jìn)行預(yù)測(cè),并用Matlab軟件對(duì)兩種算法進(jìn)行仿真分析,驗(yàn)證了改進(jìn)的遺傳算法在回流曲線優(yōu)化問題上的優(yōu)越性,進(jìn)一步采用改進(jìn)遺傳算法對(duì)回流溫度曲線參數(shù)設(shè)置進(jìn)行優(yōu)化,得出理論上最優(yōu)的工藝參數(shù)組合。最后通過實(shí)際的回流焊接驗(yàn)證優(yōu)化算法得出的最佳工藝參數(shù)的正確性。最后,采用VC6.0編程技術(shù)和SQL Server 2000數(shù)據(jù)庫(kù)技術(shù)開發(fā)出微電子組裝工藝參數(shù)專家系統(tǒng)。該系統(tǒng)利用規(guī)則庫(kù),對(duì)不同封裝類型的組裝工藝參數(shù)進(jìn)行選擇和設(shè)置,使用戶可以在開發(fā)的軟件平臺(tái)上進(jìn)行微組裝工藝優(yōu)化設(shè)置。
[Abstract]:Industry 4.0 and intelligent manufacturing drive the transformation and upgrading of manufacturing industry 4.0 is characterized by a variety of small batch customized production according to customized products can quickly and intelligently adjust and set manufacturing process and equipment parameters.The microassembly process contains a large number of input parameters, which have a complex nonlinear relationship with the output.It often needs a lot of experiments to adjust and revise many times in order to finally determine the process parameters that meet the requirements, so it can not be manufactured intelligently.Therefore, through the analysis and research of the actual microelectronic assembly process parameters, the establishment of the microelectronic assembly process expert system is the basis for the realization of intelligent microelectronic assembly manufacturing.Microassembly technology is essentially a comprehensive technology based on high-density packaging and micro-welding technology. Its main process processes include paste printing, paste, reflow welding, detection and rework.This paper analyzes and generalizes the engineering experience values of different packaging types of assembly process and related process parameters, and mainly studies the optimization methods of the process parameters of micro-assembly solder paste printing and reflow welding.An expert system for microelectronic assembly process parameters is designed.Firstly, a method of optimizing the printing process parameters of tin paste is presented, which combines the experimental design of factorial analysis with the complex design of response surface center.The key parameters affecting the printing quality are determined through the study of the printing process parameters of butt solder paste.Under the condition of good PCB and reasonable pad design, the experiment of 5 factor 2 level partial analysis is used. The experimental factors are printing pressure, printing speed, blade angle, demoulding speed and demoulding distance.The average soldering paste filling rate of each test plate was taken as the response result.The experimental factors were analyzed by Minitab software, and the main factors affecting printing quality were established.According to the results of factoring experiment, the response surface method is used to optimize the printing process parameters and to determine the best printing process parameters.Secondly, an input and output mapping model of reflux temperature curve is established by using neural network technology, and an improved genetic algorithm is used to optimize the reflux temperature curve.In the process of reflow welding, the main process parameters affecting the setting of reflux curve are determined.Then BP neural network optimized by traditional genetic algorithm and BP neural network optimized by improved genetic algorithm are used to predict the model of backflow curve, and the two algorithms are simulated and analyzed by Matlab software.The superiority of the improved genetic algorithm in the optimization of the reflux curve is verified. Further, the parameters of the reflux temperature curve are optimized by the improved genetic algorithm, and the optimal combination of the process parameters is obtained.Finally, the correctness of the optimal process parameters obtained by the optimization algorithm is verified by the actual circumfluence welding.Finally, an expert system for microelectronic assembly process parameters is developed by using VC6.0 programming technology and SQL Server 2000 database technology.The system makes use of the rule base to select and set the assembly process parameters of different packaging types so that the user can optimize the assembly process on the developed software platform.
【學(xué)位授予單位】：西南交通大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2017
【分類號(hào)】：TN405

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