本文選題：大功率LED　切入點(diǎn)：多孔微熱沉　出處：《湖南理工學(xué)院》2017年碩士論文

【摘要】：大功率LED(Light Emitting Diode)作為新一代半導(dǎo)體光源具有節(jié)能、環(huán)保、壽命長(zhǎng)等優(yōu)點(diǎn)而受到廣泛的研究和關(guān)注。然而,由于LED受電光轉(zhuǎn)換效率的限制,約有80%以上的功率轉(zhuǎn)換成了熱能,若不能及時(shí)有效地散出這些熱量,將會(huì)導(dǎo)致熱量積累造成結(jié)溫升高,從而降低LED的壽命和發(fā)光效率,嚴(yán)重影響LED工作的穩(wěn)定性。因此,散熱問(wèn)題是大功率LED器件應(yīng)用推廣急需解決的難題。針對(duì)大功率LED具有高熱流密度、結(jié)溫要求嚴(yán)格控制的特點(diǎn),本文提出一種新型的空冷式多孔微熱沉冷卻技術(shù)來(lái)滿足大功率LED陣列的散熱需求。首先,根據(jù)多孔微熱沉的結(jié)構(gòu)建立多孔微熱沉的數(shù)學(xué)模型和仿真計(jì)算模型。其次,使用流體仿真軟件Fluent對(duì)空冷式多孔微熱沉的大功率LED陣列進(jìn)行熱模擬,仿真結(jié)果表明:在環(huán)境溫度為27℃、LED陣列輸入功率為125W的情況下,LED芯片的最高溫度為62℃。最后,采用仿真模擬的方法,對(duì)影響多孔微熱沉流動(dòng)與傳熱的因素展開(kāi)分析,并得出以下結(jié)論:增大進(jìn)口風(fēng)速可以有效的降低LED芯片溫度,但下降趨勢(shì)逐漸減弱;減小孔隙率可以有效改善微熱沉的散熱效果,但會(huì)增大多孔微熱沉的壓降;減小多孔芯的厚度,LED芯片溫度逐漸降低,且下降趨勢(shì)逐漸增大;環(huán)境溫度與LED芯片溫度具有良好的線性關(guān)系;LED陣列輸入功率與LED芯片溫度也具有良好的線性關(guān)系。通過(guò)本文的研究工作可知,空冷多孔微熱沉散熱技術(shù)確實(shí)可以滿足大功率LED陣列的散熱需求,為大功率LED的應(yīng)用提供了一種新型的散熱方式。分析得到各影響因素對(duì)微熱沉散熱性能的影響規(guī)律,為多孔微熱沉的結(jié)構(gòu)優(yōu)化設(shè)計(jì)提供理論依據(jù)。
[Abstract]:As a new generation of semiconductor light source, high-power LED(Light Emitting Diode has been widely studied and paid attention to because of its advantages of energy saving, environmental protection and long life.However, due to the limitation of electro-optic conversion efficiency, more than 80% of the power of LED is converted into heat energy. If the heat can not be dissipated in time and effectively, it will lead to heat accumulation and increase the junction temperature, thus reducing the lifetime and luminous efficiency of LED.Seriously affect the stability of LED work.Therefore, the problem of heat dissipation is an urgent problem to be solved in the application and popularization of high power LED devices.In view of the characteristics of high power LED with high heat flux and strict control of junction temperature, a new air-cooled porous micro-heat sink cooling technology is proposed to meet the heat dissipation requirements of high-power LED arrays.Firstly, the mathematical model and simulation model of porous micro-heat sink are established according to the structure of porous micro-heat sink.Secondly, the high-power air-cooled porous micro-heat sink LED array is simulated by the fluid simulation software Fluent. The simulation results show that the maximum temperature of the Fluent chip is 62 鈩，

本文編號(hào)：1730305