本文選題：紅外熱像儀　切入點(diǎn)：運(yùn)動(dòng)參數(shù)分析　出處：《北京交通大學(xué)》2015年碩士論文

【摘要】：當(dāng)前,紅外熱像儀測(cè)試系統(tǒng)主要針對(duì)可變溫差、等效溫差等方面的研究,關(guān)于整機(jī)運(yùn)動(dòng)參數(shù)的測(cè)試系統(tǒng)絕大多數(shù)的研究仍停留在實(shí)驗(yàn)室階段,本文基于紅外熱像儀的工作原理,研發(fā)一種能夠測(cè)量紅外熱像儀運(yùn)動(dòng)參數(shù)的設(shè)備,有效的彌補(bǔ)國(guó)內(nèi)在這一領(lǐng)域的不足。論文主要研究?jī)?nèi)容如下： 1、對(duì)紅外熱像儀的國(guó)內(nèi)外現(xiàn)狀進(jìn)行研究,并根據(jù)紅外熱像儀的發(fā)展對(duì)其測(cè)試系統(tǒng)的國(guó)內(nèi)外現(xiàn)狀進(jìn)行研究。 2、分析紅外熱像儀的基本工作原理,對(duì)紅外熱像儀進(jìn)行建模,根據(jù)熱像儀的測(cè)試要求,提出測(cè)試方案,建立測(cè)試系統(tǒng)的模型。 3、針對(duì)要測(cè)量的內(nèi)容,設(shè)計(jì)測(cè)量方案,選定測(cè)量方法并進(jìn)傳感器的選型。 4、對(duì)紅外熱像儀進(jìn)行力學(xué)分析。對(duì)連續(xù)變焦組件和回掃組件進(jìn)行動(dòng)力學(xué)分析,推導(dǎo)出拉格朗日方程,得出其運(yùn)動(dòng)速度和加速度的關(guān)系,為測(cè)試提供了理論基礎(chǔ)；對(duì)運(yùn)動(dòng)鏡片和回掃片進(jìn)行模態(tài)分析,為測(cè)量時(shí)避開共振區(qū)提供依據(jù)；對(duì)微掃組件進(jìn)行動(dòng)力學(xué)分析,建立動(dòng)力學(xué)方程,得到固有頻率,進(jìn)行模態(tài)分析,得其固有頻率,兩者對(duì)比確保正確性,同時(shí)還對(duì)微掃組件的最大弱截面處進(jìn)行靜力學(xué)分析和仿真分析,計(jì)算出應(yīng)力最大值并得到其應(yīng)力云圖,驗(yàn)證它的可靠性；對(duì)滾珠絲杠副的滑塊進(jìn)行模態(tài)分析,求得其固有頻率,為測(cè)量時(shí)避開共振區(qū)提供依據(jù),對(duì)其最大應(yīng)力處滾珠進(jìn)行應(yīng)力分析,得到應(yīng)力云圖,驗(yàn)證其可靠性。 5、明確測(cè)試軟件的功能需求,設(shè)計(jì)軟件思想和處理流程,并進(jìn)行總體結(jié)構(gòu)設(shè)計(jì),用c#編程測(cè)試軟件,完成界面和功能的實(shí)現(xiàn),并進(jìn)行軟硬件聯(lián)調(diào),完成測(cè)試。
[Abstract]:A kind of equipment which can measure the motion parameters of infrared thermal imager is developed, which can effectively make up for the deficiency in this field.The main contents of this thesis are as follows:1. The present situation of infrared thermal imager at home and abroad is studied, and the present situation of its testing system is studied according to the development of infrared thermal imager.2. The basic working principle of the infrared thermal imager is analyzed, and the model of the infrared thermal imager is established. According to the test requirements of the infrared thermal imager, the test scheme is put forward, and the model of the test system is established.3. According to the content to be measured, the measurement scheme is designed, and the selection of measurement method and sensor is selected.4. Mechanical analysis of infrared thermal imager.The dynamic analysis of the continuous zoom assembly and the flyback assembly is carried out, the Lagrange equation is derived, and the relationship between the velocity and the acceleration is obtained, which provides a theoretical basis for the testing.In order to avoid the resonance region, the dynamic analysis of the micro-sweep assembly, the establishment of the dynamic equation, the natural frequency, the modal analysis, and the comparison between the two to ensure the correctness,At the same time, static analysis and simulation analysis of the maximum weak cross section of the micro-sweep assembly are carried out, the maximum stress is calculated and its stress cloud diagram is obtained to verify its reliability, and the natural frequency of the slider of the ball screw pair is obtained by modal analysis.In order to avoid the resonance region, the stress analysis of the ball at the maximum stress is carried out, and the stress cloud diagram is obtained to verify its reliability.5. Make clear the function requirement of the test software, design the software idea and process flow, and carry on the overall structure design, program the test software with c#, complete the realization of the interface and function, and carry on the hardware and software combination, complete the test
【學(xué)位授予單位】：北京交通大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN219;TP274

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