本文選題：MEMS　切入點(diǎn)：MEMS加工工藝　出處：《合肥工業(yè)大學(xué)》2015年碩士論文

【摘要】：MEMS(即微機(jī)電系統(tǒng))在集成電路技術(shù)基礎(chǔ)上發(fā)展而來,經(jīng)過二十多年來的飛速發(fā)展,已發(fā)展成為一門涉及到電學(xué)、熱學(xué)、機(jī)械、磁等不同學(xué)科領(lǐng)域的交叉學(xué)科,廣泛應(yīng)用于材料科學(xué)、生物醫(yī)學(xué)、航空航天和汽車工業(yè)等各重要領(lǐng)域,一直都是世界各國科學(xué)技術(shù)研究的熱點(diǎn)。MEMS加工技術(shù)是MEMS器件研究和制造的基礎(chǔ),主要包括刻蝕、淀積、光刻電鑄成型(LIGA)等多種加工工藝。MEMS加工工藝相比于IC工藝而言,更加注重MEMS器件在微納尺度下的三維立體結(jié)構(gòu)和表面形貌。目前,除了利用部分集成電路的工藝標(biāo)準(zhǔn),針對(duì)很多MEMS工藝的研究探索主要還是依賴積累的經(jīng)驗(yàn)和反復(fù)的試探,這不可避免的導(dǎo)致了生產(chǎn)資源的浪費(fèi)、生產(chǎn)周期的延長,造成了成本增加,也不利于MEMS的進(jìn)一步發(fā)展。在MEMS工藝計(jì)算機(jī)模擬領(lǐng)域中,對(duì)于二維的模擬,已有一些研究。而MEMS工藝的三維模擬,面臨著CPU和內(nèi)存占用大、算法不完善、模擬速度慢以及模擬精度低等問題。隨著MEMS器件的功能越來越細(xì)化,其結(jié)構(gòu)的設(shè)計(jì)和加工也越來越復(fù)雜,高深寬比結(jié)構(gòu)的刻蝕作為MEMS工藝的關(guān)鍵性工藝引起了廣泛的關(guān)注。在MEMS工藝中,通常采用BOSCH工藝來實(shí)現(xiàn)高深寬比結(jié)構(gòu)。目前,對(duì)于MEMS工藝模擬技術(shù)中單一加工工藝已有一些研究,但對(duì)于BOSCH工藝這種復(fù)合工藝的三維建模模擬仿真未見報(bào)道。本文提到的一些商業(yè)軟件雖對(duì)簡單的單項(xiàng)工藝有所涉及,但所提供的文檔大部分是對(duì)軟件的使用方法進(jìn)行介紹,對(duì)工藝建模方法及仿真過程非常保密,很少介紹和敘述。論文首先對(duì)現(xiàn)有幾種仿真平臺(tái)做了簡要介紹和對(duì)比；接著,深入研究幾種三維表面演化算法,論證其優(yōu)缺點(diǎn)及可行性,優(yōu)化改進(jìn)三維線算法模型,并基于此算法對(duì)BOSCH工藝進(jìn)行三維建模,運(yùn)用C語言編寫程序處理數(shù)據(jù)來對(duì)演化過程進(jìn)行模擬,用MATLAB將演化的數(shù)據(jù)結(jié)果進(jìn)行圖形化輸出,從而達(dá)到三維可視化的結(jié)果。在BOSCH工藝中,刻蝕窗口的形狀、尺寸和加工時(shí)長,均對(duì)加工結(jié)果的深寬比和側(cè)壁表面形貌產(chǎn)生影響。本文結(jié)合實(shí)驗(yàn)情況,通過改變初始條件、控制模擬時(shí)間周期,得到不同刻蝕窗口條件下的模擬結(jié)果,最后對(duì)模擬結(jié)果進(jìn)行分析,與實(shí)驗(yàn)及預(yù)測(cè)結(jié)果較為一致,驗(yàn)證了本算法及物理模型的準(zhǔn)確性,為MEMS CAD領(lǐng)域中的刻蝕工藝進(jìn)一步的研究(如實(shí)時(shí)模擬等)提供研究基礎(chǔ)。
[Abstract]:Based on the integrated circuit technology, MEMS (Micro-Electromechanical system) has developed into an interdisciplinary subject involving electrical, thermal, mechanical, magnetic and other disciplines after more than 20 years of rapid development.Widely used in material science, biomedicine, aerospace, automobile industry and other important fields, it has been a hot spot in science and technology research all over the world. MEMS processing technology is the basis of the research and manufacture of MEMS devices, including etching, deposition, and so on.Compared with IC process, many kinds of fabrication processes, such as photolithographic electroforming process, pay more attention to the three-dimensional structure and surface morphology of MEMS devices at micro and nano scale.At present, in addition to using the process standards of some integrated circuits, the research and exploration of many MEMS processes mainly rely on accumulated experience and repeated explorations, which inevitably lead to the waste of production resources and the prolongation of production cycle.Has caused the cost to increase, also unfavorable to the MEMS further development.In the field of computer simulation of MEMS process, two-dimensional simulation has been studied.The 3D simulation of MEMS process is faced with many problems, such as large CPU and memory occupation, imperfect algorithm, slow simulation speed and low simulation precision.As the functions of MEMS devices become more and more refined, the design and fabrication of their structures are becoming more and more complicated. The etching of high aspect ratio structures has attracted wide attention as the key technology of MEMS process.In MEMS process, BOSCH process is usually used to realize high aspect ratio structure.At present, there has been some research on the single machining process in the MEMS process simulation technology, but there is no report on the 3D modeling simulation of the BOSCH process.Although some commercial software mentioned in this paper are related to a simple single process, most of the documents provided are about the use of the software. The process modeling method and the simulation process are very confidential and rarely introduced and described.Firstly, several simulation platforms are briefly introduced and compared. Then, several 3D surface evolution algorithms are deeply studied, their advantages, disadvantages and feasibility are demonstrated, and the improved 3D line algorithm model is optimized.Based on this algorithm, 3D modeling of BOSCH process is carried out. C language is used to process data to simulate the evolution process. The result of evolution is graphically output by MATLAB, and the result of 3D visualization is achieved.In BOSCH process, the shape, size and processing time of the etching window have an effect on the aspect ratio of the machining results and the surface morphology of the side wall.In this paper, the simulation results under different etching windows are obtained by changing the initial conditions and controlling the simulation time periods. Finally, the simulation results are analyzed, which are consistent with the experimental and prediction results.The accuracy of the algorithm and the physical model is verified, which provides the basis for the further study of etching technology in the field of MEMS CAD, such as real-time simulation.
【學(xué)位授予單位】：合肥工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405

【相似文獻(xiàn)】

相關(guān)期刊論文 前4條

1 許靜;;BOSCH電動(dòng)缸在壓裝機(jī)中的應(yīng)用[J];國內(nèi)外機(jī)電一體化技術(shù);2005年03期

2 李慧,張德江,林君,林志琦;BOSCH傳感器特性研究及信號(hào)調(diào)理電路的設(shè)計(jì)[J];傳感技術(shù)學(xué)報(bào);2004年01期

3 ;STS的MEMS晶圓深層蝕刻機(jī)贏得Bosch訂單[J];集成電路應(yīng)用;2005年10期

4 ;[J];;年期

相關(guān)會(huì)議論文 前1條

1 舒章鈞;;Bosch焊接控制器在KUKA點(diǎn)焊機(jī)器人系統(tǒng)中的應(yīng)用[A];科技支撐 科學(xué)發(fā)展——2009年促進(jìn)中部崛起專家論壇暨第五屆湖北科技論壇文集[C];2009年

相關(guān)重要報(bào)紙文章 前4條

1 朱曉東　許海東;真品未推向市場(chǎng) 假貨已上市銷售[N];中國工商報(bào);2009年

2 李建國;德國BOSCH（博世）的塑料聯(lián)杯無菌灌裝技術(shù)[N];中國包裝報(bào);2003年

3 本報(bào)記者 汪俊 黃震;約會(huì)春天[N];當(dāng)代汽車報(bào);2006年

4 ;同仁堂公司將改造藥酒灌裝車間[N];中國中醫(yī)藥報(bào);2000年

相關(guān)碩士學(xué)位論文 前1條

1 張杰;基于線算法的BOSCH工藝三維模型與模擬[D];合肥工業(yè)大學(xué);2015年

，

本文編號(hào)：1724543