本文選題：回流焊　切入點(diǎn)：Ansys　出處：《北華航天工業(yè)學(xué)院》2017年碩士論文

【摘要】：近年來,隨著電子技術(shù)的飛速發(fā)展,電子產(chǎn)品的集成化程度大大提升。相應(yīng)的,表面貼裝技術(shù)SMT(Surface Mount Technology,簡稱SMT)迅速發(fā)展起來�；亓骱甘荢MT特有的核心工藝,也是目前最流行和最常用的批量生產(chǎn)焊接技術(shù),它是一種自動群焊過程,成千上萬個(gè)焊點(diǎn)的焊接在短短幾分鐘內(nèi)一次完成,其焊接質(zhì)量的優(yōu)劣直接影響到產(chǎn)品的質(zhì)量和可靠性。本文對固定型號線路板的表面貼裝焊接工藝進(jìn)行研究,該線路板在焊接中有錫珠產(chǎn)生,并且QPI-5LZ器件虛焊,針對此類焊接不良問題,提出仿真與正交實(shí)驗(yàn)相結(jié)合的研究方法。仿真借助Ansys Workbench軟件,對PCB組件進(jìn)行仿真分析,觀察PCB組件測試點(diǎn)的升溫情況以及整體的熱分布云圖,進(jìn)而針對傳送帶速率以及溫區(qū)的溫度設(shè)計(jì)正交實(shí)驗(yàn),借助KIC溫度測試軟件,對測試點(diǎn)實(shí)際升溫?cái)?shù)據(jù)進(jìn)行分析,找到影響焊接質(zhì)量的因素。通過仿真與正交實(shí)驗(yàn),解決了XX線路板焊接缺陷的問題,并對QPI-5LZ器件的焊接情況進(jìn)行了分析,為類似封裝器件的焊接提供了依據(jù)。最終達(dá)到了優(yōu)化焊接缺陷,提高焊接質(zhì)量的目的。
[Abstract]:In recent years, with the rapid development of electronic technology, the degree of integration of electronic products has been greatly improved.Accordingly, surface mount technology, SMT(Surface Mount Technology, has developed rapidly.Reflow welding is the core process of SMT, and it is also the most popular and commonly used mass production welding technology. It is an automatic group welding process. Thousands of solder joints are welded in just a few minutes.The quality of welding directly affects the quality and reliability of products.In this paper, the surface mount welding technology of fixed type circuit board is studied. There are tin beads produced in the welding of the circuit board, and the QPI-5LZ device is virtual welded. Aiming at the problem of this kind of bad welding, the research method of combining simulation and orthogonal experiment is put forward.With the help of Ansys Workbench software, the simulation analysis of the PCB module is carried out, and the temperature rise of the test point of the PCB component and the overall thermal distribution cloud diagram are observed. Then the orthogonal experiment is designed for the conveyer belt rate and the temperature in the temperature zone, and the KIC temperature test software is used to test the temperature.The actual temperature data of test points are analyzed and the factors affecting welding quality are found out.Through simulation and orthogonal experiment, the welding defects of XX circuit board are solved, and the welding condition of QPI-5LZ device is analyzed, which provides the basis for the welding of similar packaging devices.Finally, the purpose of optimizing welding defects and improving welding quality is achieved.
【學(xué)位授予單位】：北華航天工業(yè)學(xué)院
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TN405

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