高功率半導(dǎo)體激光泵閥表面改性技術(shù)及設(shè)備研究
本文選題:高功率半導(dǎo)體激光器 切入點(diǎn):泵閥表面改性 出處:《華中科技大學(xué)》2015年碩士論文
【摘要】:半導(dǎo)體激光器以其電光轉(zhuǎn)換效率高、性能穩(wěn)定、可靠性好、壽命長(zhǎng)、體積小、重量輕及易于與機(jī)器手臂結(jié)合等優(yōu)點(diǎn)開(kāi)拓了許多傳統(tǒng)激光器無(wú)法涉及的領(lǐng)域,在工業(yè)應(yīng)用方面受到了國(guó)內(nèi)外學(xué)者越來(lái)越多的關(guān)注。立足于浙江溫州當(dāng)?shù)貍鹘y(tǒng)優(yōu)勢(shì)泵閥產(chǎn)業(yè)目前所面臨的產(chǎn)業(yè)瓶頸,本文采用理論研究仿真和工藝實(shí)驗(yàn)探索驗(yàn)證的方法,從泵閥表面高功率半導(dǎo)體激光改性專用設(shè)備的設(shè)計(jì),激光、粉末和基體之間的互相作用關(guān)系及溫度場(chǎng)仿真,激光加工過(guò)程中的羽輝屏蔽效應(yīng),泵閥表面處理工藝參數(shù)的優(yōu)化和應(yīng)用過(guò)程中的現(xiàn)場(chǎng)缺陷分析及質(zhì)量控制方法這幾方面進(jìn)行了系統(tǒng)的分析和研究,所完成的工作如下:(1)研究了泵閥行業(yè)中的各類加工對(duì)象,設(shè)計(jì)出了泵閥表面高功率半導(dǎo)體激光改性專用設(shè)備,并對(duì)3KW半導(dǎo)體激光器、光束整形、冷卻系統(tǒng)、電源技術(shù)和五軸三聯(lián)動(dòng)加工系統(tǒng)進(jìn)行了分析。(2)研究了泵閥表面處理過(guò)程中,激光、基體和粉末之間的相互作用關(guān)系,并以此建立了半導(dǎo)體激光表面改性溫度場(chǎng)模型,對(duì)激光功率1KW,掃描速度5mm/s;激光功率2KW,掃描速度5mm/s;激光功率2KW,掃描速度10mm/s這三組工藝參數(shù)進(jìn)行了仿真與分析,探索了激光功率、掃描速度對(duì)表面改性的影響。(3)采用數(shù)值模擬與實(shí)驗(yàn)研究相結(jié)合的方法,構(gòu)建粒子密度數(shù)學(xué)模型和ABCD光學(xué)矩陣,從吸收和折射兩方面對(duì)光斑尺寸為0.5mm*1mm的半導(dǎo)體激光進(jìn)行羽輝屏蔽效應(yīng)研究,發(fā)現(xiàn)在一定程度上,羽輝對(duì)激光的影響可等效于一個(gè)梯度折射率透鏡,使其焦點(diǎn)下移,光斑尺寸變大,能量密度衰減最大可達(dá)90%以上。(4)通過(guò)人工神經(jīng)網(wǎng)絡(luò)算法對(duì)工藝參數(shù)進(jìn)行了初步優(yōu)化,且驗(yàn)證得激光功率為1.8KW,掃描速度為6mm/s時(shí),閥板樣品的表面硬度為378.8HV,與預(yù)測(cè)值基本相符,并對(duì)實(shí)驗(yàn)過(guò)程中的缺陷進(jìn)行了分析,提出了相應(yīng)的質(zhì)量控制方法。
[Abstract]:Semiconductor lasers have many advantages such as high electro-optic conversion efficiency, stable performance, good reliability, long life, small volume, light weight and easy combination with robot arms.More and more scholars at home and abroad pay more and more attention to industrial application.Based on the bottleneck of the traditional advantage pump valve industry in Wenzhou, Zhejiang Province, this paper adopts the methods of theoretical research, simulation and technological experiment to explore and verify the design of the special equipment for high power semiconductor laser modification on the surface of the pump valve, laser,The interaction between powder and matrix, the simulation of temperature field, and the shielding effect of plume during laser processing.The optimization of pump valve surface treatment process parameters and the field defect analysis and quality control methods in the application process are systematically analyzed and studied. The work accomplished is as follows: 1) the various processing objects in the pump valve industry have been studied.The special equipment for high power semiconductor laser modification of pump valve surface is designed. The 3KW semiconductor laser, beam shaping, cooling system, power supply technology and five-axis three linkage machining system are analyzed.The relationship among laser, matrix and powder, and the temperature field model of semiconductor laser surface modification is established.The laser power of 1kW, scanning speed of 5mm / s, laser power of 2kW, scanning speed of 5mm / s, laser power of 2kW, scanning speed 10mm/s were simulated and analyzed, and the laser power was explored.The effect of scanning speed on surface modification. (3) the mathematical model of particle density and ABCD optical matrix are constructed by combining numerical simulation with experimental study.The plume shielding effect of semiconductor laser with spot size of 0.5mm*1mm is studied in terms of absorption and refraction. It is found that, to a certain extent, the effect of plume on laser is equivalent to that of a gradient index lens, which causes the focus to shift down.When the laser power is 1.8 kW and the scanning speed is 6mm/s, the process parameters are optimized by artificial neural network algorithm, the maximum attenuation of energy density is more than 90%.The surface hardness of the valve plate sample is 378.8 HVV, which is basically consistent with the predicted value. The defects in the experiment are analyzed and the corresponding quality control method is put forward.
【學(xué)位授予單位】:華中科技大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2015
【分類號(hào)】:TN248.4
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