SiC單晶刻劃過程的脆塑性轉(zhuǎn)變特征研究
發(fā)布時(shí)間:2018-03-26 07:03
本文選題:SiC單晶 切入點(diǎn):脆性材料 出處:《人工晶體學(xué)報(bào)》2016年11期
【摘要】:SiC單晶化學(xué)性能穩(wěn)定、導(dǎo)熱系數(shù)高、熱膨脹系數(shù)小、耐磨性能好,廣泛用于大功率器件產(chǎn)業(yè)。但由于其材料的硬度很大,加工非常困難。脆性材料塑性域加工為提高該類材料的表面質(zhì)量,降低加工時(shí)間和成本提供了有效的途徑。本文采用不同刀具角度和刀尖圓弧半徑的單點(diǎn)金剛石刀具對(duì)4H-SiC單晶進(jìn)行刻劃實(shí)驗(yàn),利用聲發(fā)射、摩擦力傳感器來監(jiān)測(cè)刻劃過程中聲發(fā)射信號(hào)強(qiáng)度以及摩擦力的變化,并通過LeicaDCM3D以及SEM觀察劃痕溝槽表面形貌、切屑狀態(tài),綜合分析以獲得4H-SiC單晶在不同角度、刀尖圓弧半徑下塑脆轉(zhuǎn)變的臨界切削深度。結(jié)果表明,增大刀具角度有利于塑性域加工;在相同條件下,刀尖圓弧半徑越大,臨界切削深度越大。
[Abstract]:SiC single crystal chemical stability, high thermal conductivity, low thermal expansion coefficient, good wear resistance, widely used in high power devices industry. But because of the hardness of the material, processing is very difficult. The brittle domain of plastic processing to improve the surface quality of the material, and provides an effective way to reduce the processing time and cost. This paper adopts single point diamond cutter in different cutting angle and the radius of scratch test of 4H-SiC single crystal, the use of the acoustic emission, friction sensor to monitor the acoustic emission signal intensity and the change of the friction characterization process, and through LeicaDCM3D and SEM observation of scratch groove surface morphology, cutting conditions, comprehensive analysis to obtain in 4H-SiC single crystal from different angles, critical cutting depth of ductile brittle transition of the nose radius. The results show that the increase of the angle of the cutting tool for plastic processing domain; in the same conditions, the knife The greater the radius of the tip arc, the greater the critical cutting depth.
【作者單位】: 西安理工大學(xué)機(jī)械與精密儀器工程學(xué)院;
【基金】:國(guó)家自然科學(xué)基金(51575442,51175420) 陜西省機(jī)械裝備重點(diǎn)實(shí)驗(yàn)室(14JS061)資助項(xiàng)目
【分類號(hào)】:TN305.1
,
本文編號(hào):1666847
本文鏈接:http://sikaile.net/kejilunwen/dianzigongchenglunwen/1666847.html
最近更新
教材專著