本文選題：金剛石銅　切入點(diǎn)：GaN芯片　出處：《半導(dǎo)體技術(shù)》2017年04期 　論文類型：期刊論文

【摘要】：金剛石銅具有高導(dǎo)熱率和低膨脹系數(shù),可用于大功率芯片的散熱熱沉。未做處理的金剛石表面非常光滑,不易附著其他金屬,由于金剛石性質(zhì)非常穩(wěn)定,不容易被強(qiáng)酸和強(qiáng)堿進(jìn)行表面處理。采用JG-01金剛石銅粗化處理液對(duì)金剛石進(jìn)行粗化處理,而對(duì)銅無損傷,提升了金剛石表面結(jié)合力。金剛石銅鍍層對(duì)金錫(AuSn)和錫鉛(PbSn)焊料的潤(rùn)濕性滿足GJB548B-2005要求。GaN功率放大器芯片采用金剛石銅熱沉比銅鉬銅熱沉結(jié)溫可以降低12℃。金剛石銅載板鍍層潤(rùn)濕性良好,焊接后芯片底部的空洞率不大于3%,熱沉焊接后空洞率不大于5%,滿足高功率芯片散熱要求。按照產(chǎn)品環(huán)境適應(yīng)要求,對(duì)GaN功率放大器做了高低溫沖擊和機(jī)械振動(dòng)兩種環(huán)境篩選實(shí)驗(yàn),最終滿足可靠性考核要求。
[Abstract]:Diamond copper has high thermal conductivity and low coefficient of expansion, which can be used for heat sink of high power chip. The surface of untreated diamond is very smooth, and it is not easy to adhere to other metals. It is not easy to be treated by strong acid and alkali. The JG-01 diamond coarsening solution is used to roughen the diamond, but it has no damage to copper. The wettability of diamond copper coating on AuSnSn and PbSnSn) solders can meet the requirements of GJB548B-2005. The diamond copper heat sink can reduce 12 鈩，

本文編號(hào)：1622222