本文選題：半導體　切入點：金屬層　出處：《華東理工大學》2015年碩士論文　論文類型：學位論文

【摘要】：光刻工藝是半導體制造中最為重要的工藝步驟之一。光刻的成本約為整個硅片制造工藝的30%。國內(nèi)半導體生產(chǎn)廠家主要的光刻機臺為ArF、DUV和MUV三種,ArF機臺能力主要應用在0.11um以下工藝,DUV主要應用在0.11～0.18um工藝,MUV機臺主要是大線寬的工藝,其中MUV機臺價格相對較便宜。國內(nèi)半導體產(chǎn)品大都在0.05um-0.3m之間,鑒于機臺能力的限制,許多公司的DUV機臺承擔大部分產(chǎn)品的產(chǎn)能,但是DUV機臺和材料成本都高于MUV機臺。本文針對0.18um工藝金屬層,對使用MUV機臺替代DUV機臺的技術工藝優(yōu)化進行了研究�；谙冗M的光刻工藝技術,通過對抗反射圖層、光刻膠厚度、曝光條件和顯影程序分別進行優(yōu)化,并采用OPC修正技術,提高MUV機臺的工藝能力,使MUV機臺能生產(chǎn)部分DUV的金屬層產(chǎn)品,仿真和生產(chǎn)實踐證明了優(yōu)化工藝的可行性,該工藝的應用能夠分擔DUV機臺負重,在不影響產(chǎn)品質(zhì)量的情況下,提高產(chǎn)能,降低生產(chǎn)成本。
[Abstract]:Lithography process is one of the most important process steps in semiconductor manufacturing. The cost of lithography is about 30% of the whole silicon wafer manufacturing process. DUV used below 0.11um is mainly used in 0.110.18um process and MUV machine is mainly used in large linewidth process. The price of MUV machine is relatively cheap. Most of the semiconductor products in China are in the range of 0.05um-0.3 m. Due to the limitation of the machine's capacity, many companies' DUV machines bear the capacity of most of the products. However, the cost of DUV machine and material is higher than that of MUV machine. In this paper, the technology optimization of replacing DUV machine with MUV machine is studied for 0.18um process metal layer. The thickness of photoresist, the exposure condition and the development program were optimized respectively, and the OPC correction technology was adopted to improve the technological ability of the MUV machine, so that the MUV machine could produce part of the metal layer products of DUV. The simulation and production practice prove the feasibility of optimizing the process. The application of this process can share the load of DUV machine, improve the production capacity and reduce the production cost without affecting the product quality.
【學位授予單位】：華東理工大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TN305.7

【參考文獻】

相關期刊論文 前2條

1 郭立萍,黃惠杰,王向朝;光學光刻中的離軸照明技術[J];激光雜志;2005年01期

2 肖嘯,杜驚雷,郭永康,楊靜,謝世偉;減小光刻中駐波效應的新方法研究[J];微細加工技術;2002年04期

，

本文編號：1621524