本文關(guān)鍵詞： 環(huán)氧模塑料 聯(lián)苯環(huán)氧樹脂 大規(guī)模集成電路封裝 固化行為 介電性能 彎曲性能　出處：《北京化工大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

【摘要】：本文對大規(guī)模集成電路封裝用環(huán)氧模塑料的的配方、制備工藝及性能進(jìn)行研究。根據(jù)本實(shí)驗(yàn)需求,選出了一套實(shí)驗(yàn)制備環(huán)氧模塑料的設(shè)備,設(shè)計(jì)加工了壓餅?zāi)＞�、螺旋流動模具、彎曲及阻燃性能模具、線膨脹系數(shù)模具及介電性能模具。對環(huán)氧模塑料樣品EC-15L和EME-1100中各組分的種類與含量進(jìn)行了分析,EC-15L中填充了約79%粒徑在1-50μm的熔融不規(guī)則型硅微粉,EME-1100中填充了約83%粒徑在1-10μm的部分結(jié)晶的不規(guī)則型硅微粉,基體樹脂為鄰甲酚醛環(huán)氧樹脂,并添加了Sb203作為阻燃劑。選取鄰甲酚醛環(huán)氧樹脂為基體樹脂,分別以三苯基膦和2-甲基咪唑?yàn)楣袒龠M(jìn)劑制備集成電路封裝用環(huán)氧模塑料,并對固化物進(jìn)行了TMA、DMA測試。相比于2-甲基咪唑體系,使用三苯基膦的體系固化反應(yīng)程度較低,交聯(lián)結(jié)構(gòu)不完全,因而表現(xiàn)出較低的玻璃化轉(zhuǎn)變溫度。以非等溫DSC法研究了鄰甲酚醛環(huán)氧模塑料和聯(lián)苯環(huán)氧模塑料的固化行為,酚醛樹脂用量高的體系,其反應(yīng)的固化活化能明顯小于酚醛樹脂用量低的體系；促進(jìn)劑為2-甲基咪唑的體系其固化活化能較低；2-甲基咪唑用量高的體系,其反應(yīng)的固化活化能明顯小于2-甲基咪唑用量低的體系,使用較長的預(yù)固化時(shí)間,在后期固化過程當(dāng)中放出的熱量較�。患兟�(lián)苯環(huán)氧樹脂的體系固化活化能較低,隨著聯(lián)苯環(huán)氧樹脂含量的增加,鄰甲酚醛環(huán)氧樹脂含量的降低,固化體系反應(yīng)活化能降低,但凝膠化時(shí)間延長。硅微粉含量的增加會導(dǎo)致環(huán)氧模塑料的流動性變差；增加樣條制備時(shí)的注射壓力可以提高其密度、彎曲模量和彎曲強(qiáng)度,增加后固化時(shí)間,樣品的機(jī)械性能有顯著提高；填料可提高聚合物基體材料的玻璃化轉(zhuǎn)變溫度、耐熱性能以及力學(xué)性能；聯(lián)苯環(huán)氧樹脂制備的環(huán)氧模塑料萃取液PH值呈弱酸性,Cl-含量低于7×10-5mol/l;樣條密度的增大吸水率減小,本實(shí)驗(yàn)中各體系的吸水率均小于1%,具有良好的耐濕性能；體系的介電性能均達(dá)到要求。
[Abstract]:In this paper, the formulation, preparation process and properties of epoxy moulding plastics for large scale integrated circuit packaging are studied. According to the requirements of this experiment, a set of experimental equipment for preparing epoxy moulding plastics is selected, and the die for pressing cake is designed and processed. Spiral flow mould, bending and flame-retardant mould, Linear expansion coefficient mould and dielectric properties mould. Analysis of the types and contents of components in EC-15L and EME-1100 of epoxy moulding plastics samples filled with about 83% particles in the melt irregular silicon powder EME-1100 with about 79% diameters of 1-50 渭 m in EEC-15L. Partially crystallized irregular silicon powder with diameters of 1-10 渭 m, The base resin was o-cresol formaldehyde epoxy resin, and Sb203 was added as flame retardant. The epoxy resin for IC packaging was prepared by using triphenylphosphine and 2-methyl imidazole as curing accelerators, respectively, in which o-cresol aldehyde epoxy resin was used as matrix resin, and 2-methylimidazole was used as curing accelerator. Compared with 2-methylimidazole system, the curing reaction degree of the system with triphenylphosphine was lower and the crosslinking structure was not complete. The curing behavior of o-cresol formaldehyde epoxy moulding plastics and biphenyl epoxy moulding plastics was studied by non-isothermal DSC method, and the system with high content of phenolic resin was used to study the curing behavior of o-cresol formaldehyde epoxy moulding plastics and biphenyl epoxy moulding plastics. The curing activation energy of the reaction was obviously lower than that of the system with low amount of phenolic resin, and the system with 2-methylimidazole as accelerator had a lower curing activation energy than that with high dosage of 2-methylimidazole. The curing activation energy of the reaction is obviously lower than that of the system with low dosage of 2-methylimidazole, and the heat released during the later curing process is smaller when the curing time is longer, and the curing activation energy of the pure biphenyl epoxy resin system is lower than that of the pure biphenyl epoxy resin system. With the increase of the content of biphenyl epoxy resin, the content of o-cresol formaldehyde epoxy resin decreases, the activation energy of curing system decreases, but the gelation time is prolonged. When the injection pressure was increased, the density, flexural modulus and flexural strength of the samples were increased, and the mechanical properties of the samples were significantly improved with the increase of curing time, and the glass transition temperature of the polymer matrix materials could be increased by the filler. Heat resistance and mechanical properties, PH value of epoxy moulding plastic extractant prepared by biphenyl epoxy resin was less than 7 脳 10 ~ (-5) mol / l, water absorption decreased with the increase of spline density. In this experiment, the water absorption of each system is less than 1, and the system has good moisture resistance, and the dielectric properties of the system meet the requirements.
【學(xué)位授予單位】：北京化工大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN47

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