本文關(guān)鍵詞： 多熱源 液冷技術(shù) 凸凹位置 凸凹形狀 流道結(jié)構(gòu)設(shè)計(jì)　出處：《電子科技大學(xué)》2016年碩士論文　論文類(lèi)型：學(xué)位論文

【摘要】：隨著多芯片組件技術(shù)在電子產(chǎn)品中的廣泛應(yīng)用,使得電子設(shè)備中電子元器件的封裝密度越來(lái)越高,而且電子設(shè)備功率的提高也導(dǎo)致了產(chǎn)品發(fā)熱量的不斷增大。多芯片組件產(chǎn)品是將多塊電路芯片組裝在一塊基板上,這就必然會(huì)引起因各芯片發(fā)熱量不同而導(dǎo)致的基板受熱不均勻,產(chǎn)生不同熱應(yīng)力的現(xiàn)象,從而影響多芯片組件使用壽命。因此,設(shè)計(jì)出針對(duì)多熱源區(qū)域散熱的散熱器是非常有必要的。相比于風(fēng)冷散熱方式,液冷微流道散熱方式具有所需空間小、結(jié)構(gòu)緊湊、散熱效率高等優(yōu)點(diǎn),而且隨著封裝工藝的進(jìn)步,液冷系統(tǒng)中的微流道封裝也不再是難題,因此為了滿(mǎn)足高熱流密度芯片的散熱要求,微流道液體散熱方式是芯片散熱領(lǐng)域的一個(gè)重要研究方向,而且由于液體在微流道中流動(dòng),可以針對(duì)不同熱源設(shè)計(jì)出不同的微流道結(jié)構(gòu),進(jìn)行有目的散熱,使芯片基板溫度更加均勻。為了更好的了解芯片液冷散熱的熱量傳遞路徑,研究芯片液冷的熱擴(kuò)散性,本文通過(guò)簡(jiǎn)化芯片液冷散熱結(jié)構(gòu),把微流道散熱器等效為固體熱沉結(jié)構(gòu),從微流道結(jié)構(gòu)內(nèi)部各部分熱阻求出微流道散熱器熱阻,然后采用逆推方法,求出等效換熱系數(shù),從而求出芯片液冷的擴(kuò)散熱阻,然后再通過(guò)仿真軟件Icepack分析驗(yàn)證該等效算法的誤差性,最后得出該等效算法在功率較低時(shí)誤差率在5%以?xún)?nèi)。由于微流道內(nèi)部壁面的凸凹結(jié)構(gòu)可以打破流體邊界層,使流體發(fā)生相互擾動(dòng),增強(qiáng)微流道的換熱特性,所以本文主要針對(duì)凸凹微細(xì)流道傳熱特性進(jìn)行分析,研究錯(cuò)位凸凹、對(duì)稱(chēng)凸凹、錯(cuò)位雙凹、對(duì)稱(chēng)雙凹等四種流道壁面及三角形、梯形、圓弧形等三種凸凹形狀模型的傳熱特性,然后通過(guò)對(duì)圓弧形和三角形進(jìn)行實(shí)驗(yàn)分析,最后得出錯(cuò)位凸凹圓弧具有良好的傳熱特性。最后,設(shè)計(jì)出三種針對(duì)多熱源的微流道散熱器,使用Fluent軟件對(duì)三種散熱器進(jìn)行散熱特性分析,從流速和泵功率以及層數(shù)的角度出發(fā),對(duì)比分析三種模型的溫度場(chǎng)和流場(chǎng)變化,考慮不同區(qū)域的熱源變化,得出模型二有較好的傳熱特性和較低的泵功率。
[Abstract]:With the wide application of multi-chip module technology in electronic products, the packaging density of electronic components in electronic devices becomes higher and higher. And the increase in the power of the electronic equipment also leads to the continuous increase of the calorific value of the product. The multi-chip module product is to install the multi-circuit chipset on one substrate. This will inevitably lead to uneven heating of the substrate due to different calorific values of each chip, resulting in different thermal stresses, thus affecting the service life of multichip modules. It is very necessary to design a radiator for multi-heat source area. Compared with the air-cooled heat dissipation mode, the liquid-cooled micro-channel cooling mode has the advantages of small space, compact structure, high heat dissipation efficiency and so on, and with the development of packaging technology, The microchannel packaging in liquid-cooled system is no longer a difficult problem, so in order to meet the requirement of high heat flux chip, the liquid cooling mode of microchannel is an important research direction in the field of chip heat dissipation, and because the liquid flows in the microchannel, Different microchannel structures can be designed for different heat sources, and the temperature of the chip substrate can be more homogenized. In order to better understand the heat transfer path of the chip liquid cooling heat dissipation, the thermal diffusion of the chip liquid cooling can be studied. In this paper, the microchannel radiator is equivalent to a solid heat sink structure by simplifying the chip liquid-cooled heat dissipation structure. The thermal resistance of the microchannel radiator is obtained from the thermal resistance of each part of the microchannel structure, and the equivalent heat transfer coefficient is obtained by using the inverse method. The diffusive thermal resistance of the chip liquid cooling is obtained, and then the error of the equivalent algorithm is verified by the simulation software Icepack. Finally, it is concluded that the error rate of the equivalent algorithm is less than 5% when the power is low. Because the convex-concave structure of the inner wall of the microchannel can break the boundary layer of the fluid, the fluid will be disturbed each other, and the heat transfer characteristics of the microchannel can be enhanced. So this paper mainly analyzes the heat transfer characteristics of convex-concave micro-channel, and studies the heat transfer characteristics of four kinds of flow channel wall and triangular, trapezoid and circular arc models, which are staggered convex and concave, symmetrical convex concave, staggered double concave and symmetrical double concave. Then through the experimental analysis of circular arc and triangle, it is concluded that the dislocated convex and concave circular arc has good heat transfer characteristics. Finally, three kinds of microchannel radiators for multiple heat sources are designed. The heat dissipation characteristics of three radiators are analyzed by using Fluent software. From the point of view of flow velocity, pump power and layer number, the temperature field and flow field of the three models are compared and analyzed, and the heat source changes in different regions are considered. It is concluded that model 2 has better heat transfer characteristics and lower pump power.
【學(xué)位授予單位】：電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2016
【分類(lèi)號(hào)】：TN402

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