本文關(guān)鍵詞： 大功率LED 數(shù)值模擬 熱分析 翅片組合 散熱性能 溫度分布　出處：《電子元件與材料》2016年12期 　論文類(lèi)型：期刊論文

【摘要】：為了解決大功率LED散熱問(wèn)題,構(gòu)建了包括LED固體部件及外部流體空間的三維數(shù)學(xué)模型。基于有限元法,應(yīng)用k-ε模型模擬自然對(duì)流換熱條件下LED模組散熱情況。模擬結(jié)果表明,LED模組溫度場(chǎng)分布不均,芯片結(jié)溫較高;受芯片功率密度及位置布設(shè)的影響,中心翅片的散熱效果差。通過(guò)改變散熱器結(jié)構(gòu),設(shè)計(jì)了兩種翅片組合形式,雖然換熱面積有所減少,但由于中心翅片的對(duì)流換熱得到強(qiáng)化,達(dá)到了降低結(jié)溫的效果,提高了散熱性能。
[Abstract]:In order to solve the heat dissipation problem of high-power LED, a three-dimensional mathematical model including LED solid components and external fluid space is constructed based on finite element method. K- 蔚 model is used to simulate the heat dissipation of LED module under natural convection heat transfer. The simulation results show that the temperature field of LED module is uneven and the chip junction temperature is high. Under the influence of chip power density and position layout, the heat dissipation effect of the central fin is poor. By changing the structure of the radiator, two kinds of fin combination forms are designed, although the heat transfer area is reduced. However, the convection heat transfer of the central fin is strengthened, which can reduce the junction temperature and improve the heat dissipation performance.
【正文快照】： 第 35 卷 第 12 期 電 子 元 件 與 材 料 Vol.35 No.12 2016 年 12 月 ELECTRONIC COMPONENTS AND MATERIALS Dec. 2016 基于有限元法 LED 散，

本文編號(hào)：1450573