本文關(guān)鍵詞： 晶圓傳輸機(jī)械手 粘附機(jī)理 位姿調(diào)節(jié) 運(yùn)動(dòng)學(xué) 同步控制　出處：《上海工程技術(shù)大學(xué)》2016年碩士論文　論文類型：學(xué)位論文

【摘要】：集成電路裝備制造產(chǎn)業(yè)是國家大力發(fā)展的高新技術(shù)之一,對(duì)于推動(dòng)國民經(jīng)濟(jì)和社會(huì)信息化發(fā)展有著重要意義。晶圓傳輸機(jī)械手是集成電路制造裝備的重要組成部分,主要承擔(dān)著晶圓的精確定位與快速、穩(wěn)定的傳輸任務(wù)。目前制約晶圓傳輸效率的重要原因是傳輸界面間無法產(chǎn)生足夠大的摩擦力,本文分析了晶圓傳輸機(jī)械手的研究現(xiàn)狀,在研究微觀界面粘附理論的基礎(chǔ)上,提出了機(jī)械手末端執(zhí)行器在位姿調(diào)節(jié)下實(shí)現(xiàn)高加速晶圓傳輸?shù)男路椒?對(duì)所建立的高加速晶圓傳輸平臺(tái)的運(yùn)動(dòng)學(xué)、動(dòng)力學(xué)進(jìn)行求解;建立傳輸平臺(tái)的三維模型,完成運(yùn)動(dòng)學(xué)仿真的驗(yàn)證分析;基于晶圓傳輸面的粘附特性對(duì)高加速晶圓傳輸運(yùn)動(dòng)平臺(tái)的控制方法進(jìn)行了研究。主要工作有:在機(jī)械手末端執(zhí)行器與晶圓的微觀粘附機(jī)理方面,首先考慮機(jī)械手末端執(zhí)行器的本體結(jié)構(gòu),分析典型的摩擦模型與微觀接觸理論;考慮摩擦力的微觀作用力部分計(jì)算傳輸界面晶圓的摩擦力,根據(jù)JKR彈性接觸理論建立晶圓接觸面粘附力的數(shù)學(xué)模型;分別求解分析機(jī)械手末端執(zhí)行器水平位姿和傾斜位姿下的摩擦及粘附特性,得出接觸面粘附力隨位姿角度的變化規(guī)律;進(jìn)而仿真分析晶圓傳輸加速度與末端執(zhí)行器位姿傾角的關(guān)系,在此基礎(chǔ)上研究實(shí)現(xiàn)高加速晶圓傳輸?shù)挠行Х椒�。�?jīng)過系統(tǒng)分析實(shí)現(xiàn)高加速晶圓傳輸所需的運(yùn)動(dòng)結(jié)構(gòu)以及調(diào)節(jié)晶圓傳輸界面粘附力的方法,建立高加速晶圓傳輸運(yùn)動(dòng)及末端位姿調(diào)節(jié)的平臺(tái)模型。首先建立高加速晶圓傳輸運(yùn)動(dòng)平臺(tái)的坐標(biāo)系,分析原點(diǎn)移動(dòng)坐標(biāo)系的變換方程;進(jìn)而在所建坐標(biāo)系下研究高加速晶圓傳輸?shù)倪\(yùn)動(dòng)學(xué)模型、進(jìn)行運(yùn)動(dòng)學(xué)求解;并根據(jù)機(jī)構(gòu)的動(dòng)力學(xué)基礎(chǔ)完成動(dòng)力學(xué)分析;應(yīng)用UG建立運(yùn)動(dòng)系統(tǒng)各零部件的三維模型,完成了晶圓傳輸運(yùn)動(dòng)平臺(tái)的裝配,采用ADAMS仿真軟件對(duì)高加速晶圓傳輸平臺(tái)進(jìn)行運(yùn)動(dòng)學(xué)仿真,仿真結(jié)果表明應(yīng)用末端執(zhí)行器位姿調(diào)節(jié)的方法可以有效的提高晶圓傳輸?shù)募铀俣?實(shí)現(xiàn)晶圓快速穩(wěn)定的傳輸。根據(jù)高加速晶圓傳輸運(yùn)動(dòng)系統(tǒng)的要求,研究高加速運(yùn)動(dòng)平臺(tái)的控制方法。首先分析常見的同步運(yùn)動(dòng)控制結(jié)構(gòu),確定合理的高加速晶圓傳輸運(yùn)動(dòng)平臺(tái)的控制策略;運(yùn)動(dòng)平臺(tái)提供水平方向的高加速直線運(yùn)動(dòng),同時(shí)驅(qū)動(dòng)末端執(zhí)行器實(shí)現(xiàn)位姿角度的調(diào)節(jié);建立基于加速度調(diào)節(jié)的主從同步控制結(jié)構(gòu),保證高加速晶圓傳輸過程中加速度值與末端執(zhí)行器位姿轉(zhuǎn)角的同步協(xié)調(diào);滿足晶圓傳輸過程高粘附與釋放晶圓低粘附的運(yùn)動(dòng)要求,實(shí)現(xiàn)晶圓快速可靠的傳輸。
[Abstract]:Integrated circuit equipment manufacturing industry is one of the national high-tech development, is of great importance for promoting the development of national economy and social informationization. The wafer transfer manipulator is an important part of the integrated circuit manufacturing equipment, is mainly responsible for the wafer precisely and quickly, transmission stability. An important reason is restricting the efficiency of wafer transfer is the transmission interface cannot produce enough friction, this paper analyzes the research status of wafer transfer manipulator, based on the study of micro adhesion theory, put forward the manipulator end execution of a new method of implementing high speed wafer transmission device in the posture adjustment; based on the high speed wafer transmission platform kinematics to solve the three-dimensional model, dynamics; establish the transmission platform, analysis of kinematics simulation verification is complete; the adhesion characteristics based on wafer transmission The control method of high speed wafer transfer motion platform are studied. The main work is: in the aspect of Micro Adhesion Mechanism of the end effector and the wafer, first consider the body structure of the end effector, analysis of friction model and microcosmic contact theory typical; calculation of friction force transmission interface considering the micro force part of the friction wafer and according to the mathematical model of JKR elastic contact theory to establish the wafer contact surface adhesion force; friction analysis respectively solve the end effector level posture and tilt position and adhesion properties, changes with the position angle of the contact surface and the adhesive force; simulation analysis of actuator position angle relationship of wafer transmission with the acceleration of the end, on the basis of the effective method to realize the high acceleration of wafer transmission. After the system analysis to achieve high accelerating wafer transfer required for transport The method of adjusting the wafer transfer structure and interfacial adhesion, the establishment of high acceleration platform model transmission movement wafer and end pose adjustment. Firstly, high speed wafer transfer motion platform coordinate system, analysis of moving coordinate transformation equation of origin; and in the coordinate study on kinematic model of high acceleration wafer transmission system, kinematics solution; and according to the dynamic analysis of complete dynamics based mechanism; 3D model is built by using UG components of the motor system, complete assembly of wafer transfer motion platform, using ADAMS simulation software for kinematics simulation of high acceleration wafer transmission platform, simulation results show that the application of the end effector pose adjustment method can effectively the increase of wafer transmission acceleration, to achieve fast and stable wafer transfer. According to the high speed movement wafer transmission system, research The acceleration control method of motion platform. Firstly, analysis of common synchronous motion control structure, determine the control strategy of high acceleration wafer transfer motion platform is reasonable; the movement platform provides horizontal high speed linear motion, while driving the end effector can adjust the pose angle; establish synchronization control structure based on master-slave acceleration adjustment, ensure acceleration high speed wafer transfer value in the process of synchronization and the end effector pose angle; meet the wafer transfer process of high adhesion and low adhesion release wafer movement, to achieve fast and reliable transmission of wafer.

【學(xué)位授予單位】：上海工程技術(shù)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2016
【分類號(hào)】：TN405

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