本文關(guān)鍵詞：焊線機(jī)鍵合過程的有限元分析與工藝參數(shù)實(shí)驗(yàn)　出處：《廣東工業(yè)大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 焊球成形 鍵合質(zhì)量 正交試驗(yàn) 界面失效

【摘要】：微電子產(chǎn)品的應(yīng)用越來越廣泛,封裝是微電子技術(shù)的重要組成部分,引線鍵合實(shí)現(xiàn)了封裝內(nèi)部的電氣連接,其工藝持續(xù)發(fā)展變化,以適應(yīng)微電子封裝不斷發(fā)展的要求。鍵合過程的工藝參數(shù)多,鍵合過程直接影響了鍵合界面的成形,從而決定了鍵合穩(wěn)定性和鍵合質(zhì)量的好壞。本論文針對(duì)焊線過程的第一鍵合點(diǎn),研究焊線工藝參數(shù)對(duì)鍵合質(zhì)量的影響規(guī)律,運(yùn)用LS-DYNA建立鍵合界面焊球變形過程的有限元模型,分析瓷嘴接近速度與沖擊力的關(guān)系及鍵合界面失效形式,為鍵合過程工藝參數(shù)的合理設(shè)置提供參考。論文主要研究?jī)?nèi)容闡述如下：1.了解課題的研究背景與意義,調(diào)研鍵合工藝參數(shù)對(duì)焊線質(zhì)量影響規(guī)律的研究現(xiàn)狀,針對(duì)鍵合過程對(duì)于鍵合點(diǎn)的形狀的要求,研究鍵合工藝參數(shù)對(duì)鍵合界面成形的影響規(guī)律。2.利用正交試驗(yàn)方法對(duì)多個(gè)工藝參數(shù)不同水平進(jìn)行合理組合,研究溫度、瓷嘴接近速度、鍵合壓力和超聲振動(dòng)對(duì)最終的焊球形狀尺寸和鍵合質(zhì)量的影響規(guī)律。3.針對(duì)實(shí)驗(yàn)中難以獲得鍵合界面詳細(xì)變形過程的情況,運(yùn)用有限元分析軟件對(duì)鍵合過程焊球與焊盤變形過程進(jìn)行模擬仿真,獲得金球和焊盤在鍵合過程中焊球與焊盤的應(yīng)力應(yīng)變分布及變化規(guī)律,為焊盤結(jié)構(gòu)設(shè)計(jì),規(guī)避應(yīng)力集中提供理論支持。4.在分析鍵合界面失效形式的基礎(chǔ)上,通過構(gòu)建焊球沖擊焊盤過程的有限元模型,研究鍵合過程接近速度與沖擊力的關(guān)系,為鍵合過程工藝參數(shù)的合理設(shè)置提供參考。
[Abstract]:The application of microelectronic products is more and more extensive. Packaging is an important part of microelectronics technology. Lead bonding realizes the electrical connection inside the package, and its process continues to change. In order to meet the requirements of the continuous development of microelectronic packaging, the bonding process has a lot of process parameters, and the bonding process directly affects the formation of the bonding interface. Therefore, the stability and quality of bonding are determined. In this paper, the influence of welding process parameters on bonding quality is studied according to the first bonding point in the welding process. The finite element model of bonding interface welding ball deformation process was established by using LS-DYNA. The relationship between the close velocity of ceramic nozzle and impact force and the failure mode of bonding interface were analyzed. The main contents of this paper are as follows: 1. Understand the research background and significance of the subject, investigate the research status of bonding process parameters on the quality of welding line. According to the requirements of bonding process for the shape of bonding point, the influence of bonding process parameters on bonding interface forming is studied. 2. The orthogonal test method is used to combine several process parameters at different levels. 2. The effects of temperature, ceramic nozzle approach velocity, bonding pressure and ultrasonic vibration on the shape, size and bonding quality of the final welding ball are studied. 3. The detailed deformation process of the bonding interface is difficult to obtain in the experiment. The finite element analysis software is used to simulate the deformation process of the ball and pad during bonding process. The stress and strain distribution and variation law of the ball and pad in the bonding process are obtained, and the structure of the pad is designed. On the basis of analyzing the failure form of bonding interface, the relationship between the close velocity and the impact force of bonding process is studied by constructing the finite element model of the impact pad process. It provides a reference for the reasonable setting of the process parameters in the bonding process.
【學(xué)位授予單位】：廣東工業(yè)大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405

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