本文關(guān)鍵詞：高可靠厚膜功率組件低空洞燒結(jié)設(shè)計與工藝技術(shù)研究　出處：《北華航天工業(yè)學(xué)院》2015年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 高可靠厚膜功率組件 燒結(jié) 空洞 回流焊 真空焊

【摘要】：在當(dāng)今電子工業(yè)高速發(fā)展的時代,隨著厚膜混合集成電路向著高性能、高可靠、小型化、高均一性及低成本方向的發(fā)展,對厚膜混合電路的組裝技術(shù)和工藝提出了越來越高的要求。在厚膜混合集成電路中,功率組件是核心器件,決定著厚膜功率組件的性能和熱響應(yīng)情況。在厚膜功率組件的組裝中,現(xiàn)在主要存在的問題是:由于焊接的器件空洞較多,所以工作時產(chǎn)生的熱量不能有效地發(fā)散,最終使器件的工作結(jié)溫高,降低了其使用壽命,甚至個別零件由于溫度較高而導(dǎo)致電壓擊穿。影響空洞產(chǎn)生的因素有很多,本文經(jīng)過查閱大量的文獻(xiàn),結(jié)合國內(nèi)外發(fā)展現(xiàn)狀,分別從厚膜管殼、基板的尺寸;焊料成分、狀態(tài)(焊片、焊膏)的選用;工藝曲線(真空度、還原氣氛、溫度設(shè)置)各個方面來減小孔洞率,其后通過外觀、X射線、金相分析、剪切力測試分析厚膜功率器件的孔洞率、可靠性,找出形成空洞的真正原因是焊料在燒結(jié)過程中殘留的氣體和氧化物無法排出。結(jié)果表明:回流焊中通過對工藝溫度曲線、焊接層厚度、壓力的分析,找到了各自合適的參數(shù)改善焊接空洞問題。得出溫度曲線是影響焊接空洞大小的最顯著因素,真空焊通過對工藝曲線、壓力、甲酸的控制、載體粗糙度、氣氛保護(hù)的分析,找到了各自合適的參數(shù)改善焊接空洞問題,得出工藝曲線、氣氛保護(hù)是影響焊接空洞大小的最顯著因素。
[Abstract]:In the era of high speed development of electronic industry, with the development of thick film hybrid integrated circuit towards high performance, high reliability, miniaturization, high uniformity and low cost. The assembly technology and process of thick film hybrid circuit are required more and more. In the thick film hybrid integrated circuit, the power component is the core device. It determines the performance and thermal response of thick film power assembly. In the assembly of thick film power assembly, the main problem is that there are more voids in welding devices. Therefore, the heat produced when working can not be effectively divergent, which ultimately makes the working temperature of the device high and reduces its service life. Even some parts cause voltage breakdown due to high temperature. There are many factors that affect the cavity. This paper reviews a large number of literature, combined with the development of domestic and foreign, respectively from the thick film shell, substrate size; Selection of solder composition and status (solder, solder paste); The process curve (vacuum, reduction atmosphere, temperature setting) is used to reduce the porosity of the thick film power device by X-ray, metallographic analysis and shear force test. The result shows that the process temperature curve, the thickness of welding layer and the pressure are analyzed in reflux welding. The temperature curve is the most significant factor affecting the size of the welding cavity. The vacuum welding through the process curve, pressure, formic acid control, carrier roughness. Based on the analysis of the atmosphere protection, the appropriate parameters are found to improve the welding cavity, and the process curve is obtained. The atmosphere protection is the most significant factor affecting the size of the welding cavity.
【學(xué)位授予單位】：北華航天工業(yè)學(xué)院
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN452

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