本文關(guān)鍵詞：多層PCB過(guò)孔轉(zhuǎn)換結(jié)構(gòu)的信號(hào)完整性分析　出處：《集美大學(xué)》2015年碩士論文　論文類(lèi)型：學(xué)位論文

  更多相關(guān)文章： 多層印制電路板 信號(hào)完整性 過(guò)孔 電源/地平面 邊界元法 串?dāng)_

【摘要】：在多層印制電路板(PCB)中,過(guò)孔轉(zhuǎn)換結(jié)構(gòu)被廣泛地用于不同層之間的信號(hào)連接。當(dāng)傳輸高頻信號(hào)時(shí),過(guò)孔的存在會(huì)導(dǎo)致電源/地平面結(jié)構(gòu)信號(hào)返回路徑阻抗不連續(xù),從而引起信號(hào)完整性問(wèn)題,影響信號(hào)傳輸質(zhì)量,進(jìn)而妨礙高速PCB的設(shè)計(jì)。本文主要采用常單元邊界元法和腔模諧振法對(duì)多層PCB電源/地平面結(jié)構(gòu)進(jìn)行建模分析與計(jì)算。首先,對(duì)存在單個(gè)和多個(gè)信號(hào)過(guò)孔的電源/地平面結(jié)構(gòu)進(jìn)行分析計(jì)算,計(jì)算出電源/地平面返回路徑的輸入阻抗,并提取出過(guò)孔的等效集總電路模型,同時(shí)結(jié)合PSpice軟件仿真過(guò)孔的S參數(shù),再在信號(hào)過(guò)孔周?chē)砑佣搪愤^(guò)孔的方法來(lái)改善過(guò)孔對(duì)信號(hào)傳輸及串?dāng)_的影響。然后,闡述了兩種求解多層PCB過(guò)孔轉(zhuǎn)換結(jié)構(gòu)的級(jí)聯(lián)方法,包括過(guò)孔等效電路模型的級(jí)聯(lián)方法和二端口網(wǎng)絡(luò)[ABCD]矩陣級(jí)聯(lián)S參數(shù)方法,仿真分析了多層PCB多個(gè)平面之間過(guò)孔級(jí)聯(lián)的S參數(shù)。最后,采用三維全波電磁場(chǎng)分析軟件HFSS仿真分析了不同差分過(guò)孔結(jié)構(gòu)參數(shù)對(duì)信號(hào)傳輸?shù)挠绊�。由三維電磁場(chǎng)有限元軟件ANSYS和HFSS驗(yàn)證了計(jì)算方法的準(zhǔn)確性。研究結(jié)果表明:多層PCB電源/地平面返回路徑的輸入阻抗在反諧振頻率處出現(xiàn)極大值,造成高頻信號(hào)經(jīng)過(guò)過(guò)孔時(shí)的傳輸效率很低,并使多過(guò)孔之間的耦合程度達(dá)到極大值。采用過(guò)孔等效電路模型的級(jí)聯(lián)方法或者[ABCD]矩陣級(jí)聯(lián)S參數(shù)的方法均可求解多層PCB過(guò)孔轉(zhuǎn)換結(jié)構(gòu)的級(jí)聯(lián)問(wèn)題。在多層PCB中使用差分過(guò)孔傳輸差分信號(hào)時(shí),減小過(guò)孔半徑和焊盤(pán)半徑,增大反焊盤(pán)半徑,并減小差分過(guò)孔的中心距,有利于提高高頻信號(hào)通過(guò)差分過(guò)孔時(shí)的傳輸性能。論文的創(chuàng)新之處:(1)采用常單元邊界元法并將反焊盤(pán)處入射波和反射波進(jìn)行疊加,建模分析多層PCB電源/地平面輸入阻抗;(2)采用場(chǎng)路結(jié)合的方法分析電源/地平面多過(guò)孔對(duì)信號(hào)傳輸以及串?dāng)_的影響;(3)采用二端口網(wǎng)絡(luò)[ABCD]矩陣求解多層PCB過(guò)孔轉(zhuǎn)換結(jié)構(gòu)的級(jí)聯(lián)S參數(shù)。
[Abstract]:In the multilayer printed circuit board (PCB), via transition structure is widely used in signal connection between different layers. When the high frequency signal transmission, a hole will lead to the power / ground plane structure signal return path discontinuities, causing signal integrity problems, affecting the quality of signal transmission, and design with high speed PCB. This paper mainly uses the boundary element method of constant elements and cavity resonance method of multilayer PCB power / ground plane structure modeling analysis and calculation. Firstly, the power / existence of single and multiple signal via the ground plane structure are analyzed and calculated, calculate the input impedance of the power / ground plane return path, and extracted via the equivalent lumped circuit model, combined with the parameters of S PSpice software simulation hole, adding method of short circuit vias in signal vias to improve the effect of hole around the signal transmission and crosstalk. Then, describes the two kinds of solving PCB cascade method transition pore structure, including a cascaded approach hole equivalent circuit model and two port network [ABCD] parameters S matrix method, the simulation analysis of S parameters between multilayer PCB multiple plane via cascade. Finally, the three dimensional full wave electromagnetic field analysis software HFSS simulation of the different differential vias structure parameters on the signal transmission. By the finite element software ANSYS and HFSS to verify the accuracy of the calculation method. The results show that: the input resistance of multilayer PCB power / ground plane return path resistance maximum value in the anti resonant frequency, caused by the high frequency signal through the transmission efficiency the hole is very low, and the degree of coupling between multiple vias reaches the maximum value. The method of cascade hole equivalent circuit model or [ABCD] matrix method can solve parameters of cascade S multilayer P The CB cascade structure. Using the conversion problem of hole differential via differential signal transmission in multilayer PCB, reduce the pore radius and pad radius, increase anti pad radius, and reduce hole center distance, to increase the transmission performance of high frequency signal through the differential vias. The innovations of this paper are: (1) by using constant element boundary element method and anti pad at the incident wave and reflected wave superposition analysis, multilayer PCB power / ground plane input impedance modeling; (2) analysis method by using the field circuit combined power / ground plane multiple vias on signal transmission and the effect of crosstalk; (3) using the two port network [ABCD] matrix PCB multilayer structure S cascade transition pore parameters.

【學(xué)位授予單位】：集美大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類(lèi)號(hào)】：TN41

【共引文獻(xiàn)】

相關(guān)期刊論文 前10條

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9 沙卓p，

本文編號(hào)：1409727