本文關(guān)鍵詞：多層PCB過孔轉(zhuǎn)換結(jié)構(gòu)的信號完整性分析　出處：《集美大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 多層印制電路板 信號完整性 過孔 電源/地平面 邊界元法 串?dāng)_

【摘要】：在多層印制電路板(PCB)中,過孔轉(zhuǎn)換結(jié)構(gòu)被廣泛地用于不同層之間的信號連接。當(dāng)傳輸高頻信號時,過孔的存在會導(dǎo)致電源/地平面結(jié)構(gòu)信號返回路徑阻抗不連續(xù),從而引起信號完整性問題,影響信號傳輸質(zhì)量,進(jìn)而妨礙高速PCB的設(shè)計。本文主要采用常單元邊界元法和腔模諧振法對多層PCB電源/地平面結(jié)構(gòu)進(jìn)行建模分析與計算。首先,對存在單個和多個信號過孔的電源/地平面結(jié)構(gòu)進(jìn)行分析計算,計算出電源/地平面返回路徑的輸入阻抗,并提取出過孔的等效集總電路模型,同時結(jié)合PSpice軟件仿真過孔的S參數(shù),再在信號過孔周圍添加短路過孔的方法來改善過孔對信號傳輸及串?dāng)_的影響。然后,闡述了兩種求解多層PCB過孔轉(zhuǎn)換結(jié)構(gòu)的級聯(lián)方法,包括過孔等效電路模型的級聯(lián)方法和二端口網(wǎng)絡(luò)[ABCD]矩陣級聯(lián)S參數(shù)方法,仿真分析了多層PCB多個平面之間過孔級聯(lián)的S參數(shù)。最后,采用三維全波電磁場分析軟件HFSS仿真分析了不同差分過孔結(jié)構(gòu)參數(shù)對信號傳輸?shù)挠绊�。由三維電磁場有限元軟件ANSYS和HFSS驗證了計算方法的準(zhǔn)確性。研究結(jié)果表明:多層PCB電源/地平面返回路徑的輸入阻抗在反諧振頻率處出現(xiàn)極大值,造成高頻信號經(jīng)過過孔時的傳輸效率很低,并使多過孔之間的耦合程度達(dá)到極大值。采用過孔等效電路模型的級聯(lián)方法或者[ABCD]矩陣級聯(lián)S參數(shù)的方法均可求解多層PCB過孔轉(zhuǎn)換結(jié)構(gòu)的級聯(lián)問題。在多層PCB中使用差分過孔傳輸差分信號時,減小過孔半徑和焊盤半徑,增大反焊盤半徑,并減小差分過孔的中心距,有利于提高高頻信號通過差分過孔時的傳輸性能。論文的創(chuàng)新之處:(1)采用常單元邊界元法并將反焊盤處入射波和反射波進(jìn)行疊加,建模分析多層PCB電源/地平面輸入阻抗;(2)采用場路結(jié)合的方法分析電源/地平面多過孔對信號傳輸以及串?dāng)_的影響;(3)采用二端口網(wǎng)絡(luò)[ABCD]矩陣求解多層PCB過孔轉(zhuǎn)換結(jié)構(gòu)的級聯(lián)S參數(shù)。
[Abstract]:In the multilayer printed circuit board (PCB), via transition structure is widely used in signal connection between different layers. When the high frequency signal transmission, a hole will lead to the power / ground plane structure signal return path discontinuities, causing signal integrity problems, affecting the quality of signal transmission, and design with high speed PCB. This paper mainly uses the boundary element method of constant elements and cavity resonance method of multilayer PCB power / ground plane structure modeling analysis and calculation. Firstly, the power / existence of single and multiple signal via the ground plane structure are analyzed and calculated, calculate the input impedance of the power / ground plane return path, and extracted via the equivalent lumped circuit model, combined with the parameters of S PSpice software simulation hole, adding method of short circuit vias in signal vias to improve the effect of hole around the signal transmission and crosstalk. Then, describes the two kinds of solving PCB cascade method transition pore structure, including a cascaded approach hole equivalent circuit model and two port network [ABCD] parameters S matrix method, the simulation analysis of S parameters between multilayer PCB multiple plane via cascade. Finally, the three dimensional full wave electromagnetic field analysis software HFSS simulation of the different differential vias structure parameters on the signal transmission. By the finite element software ANSYS and HFSS to verify the accuracy of the calculation method. The results show that: the input resistance of multilayer PCB power / ground plane return path resistance maximum value in the anti resonant frequency, caused by the high frequency signal through the transmission efficiency the hole is very low, and the degree of coupling between multiple vias reaches the maximum value. The method of cascade hole equivalent circuit model or [ABCD] matrix method can solve parameters of cascade S multilayer P The CB cascade structure. Using the conversion problem of hole differential via differential signal transmission in multilayer PCB, reduce the pore radius and pad radius, increase anti pad radius, and reduce hole center distance, to increase the transmission performance of high frequency signal through the differential vias. The innovations of this paper are: (1) by using constant element boundary element method and anti pad at the incident wave and reflected wave superposition analysis, multilayer PCB power / ground plane input impedance modeling; (2) analysis method by using the field circuit combined power / ground plane multiple vias on signal transmission and the effect of crosstalk; (3) using the two port network [ABCD] matrix PCB multilayer structure S cascade transition pore parameters.

【學(xué)位授予單位】：集美大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN41

【共引文獻(xiàn)】

相關(guān)期刊論文 前10條

1 文開壹;;串?dāng)_問題分析及對PCB設(shè)計的指導(dǎo)[J];電子技術(shù);2014年02期

2 謝永明;李英蓮;;工頻磁場對單相電能表的影響[J];電測與儀表;2014年07期

3 李璐;張金寶;;接地對電源濾波器性能的影響[J];安全與電磁兼容;2014年04期

4 李殿來;龔欣;王智君;;預(yù)加重在高速電路板中的應(yīng)用[J];電子科技;2014年08期

5 余青旺;張赤斌;王廣平;;高速PCB同步開關(guān)噪聲仿真抑制分析[J];電子器件;2014年04期

6 李海軍;牟俊杰;周迎;陳育良;;直升機(jī)發(fā)射控制電路監(jiān)控方法設(shè)計[J];四川兵工學(xué)報;2015年01期

7 高晨;周荔丹;;變頻器內(nèi)部EMI濾波板的研究設(shè)計及仿真[J];電器與能效管理技術(shù);2015年08期

8 余偉;王世山;虞振洋;周峰;;永磁交流伺服驅(qū)動系統(tǒng)共模EMI噪聲的預(yù)測及抑制[J];電工電能新技術(shù);2015年08期

9 沙卓p，

本文編號：1409727