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  本文關鍵詞：基于LTCC技術的垂直互連微波傳輸特性研究　出處：《西安電子科技大學》2015年碩士論文　論文類型：學位論文

  更多相關文章： 低溫共燒陶瓷 垂直互連 通孔 阻抗匹配

【摘要】：隨著通信產業(yè)的快速發(fā)展,各種智能化、小型化的終端產品不斷涌現(xiàn),智能手機、平板電腦等電子產品正在改善著人們的生活。人們對電子產品要求的不斷提高,直接推動了微電子產業(yè)不斷向前發(fā)展,集成電路封裝技術也處在不斷革新之中。其中,低溫共燒陶瓷技術以其優(yōu)異的高頻性能、極高的集成度、較低的成本在藍牙、WLAN等領域取得了廣泛的應用。在該工藝中,常使用垂直通孔連接不同介質基板上的走線,通孔的傳輸特性直接影響到了信號的傳輸質量,因此必須對通孔傳輸特性的影響因素進行充分研究。本文主要對LTCC中的垂直互連結構進行了系統(tǒng)的研究,建立了垂直通孔的等效電路模型,采用準靜態(tài)分析法并運用高斯定理等推導出通孔寄生參數(shù)的計算公式,將推導出來的公式輸入到MATLAB軟件中進行數(shù)值計算并與Q3D軟件的計算結果進行對比,結果顯示公式的計算結果與仿真結果的誤差不超過10%。接著,將等效電路模型在ADS中進行了S參數(shù)仿真并與通孔的HFSS仿真結果相對照,結果表明文中的等效電路模型在低頻和偏離諧振的頻點上具有較高的準確性。使用HFSS軟件建立了通孔的三維電磁仿真模型,分析了通孔尺寸(包括通孔半徑、焊盤半徑、反焊盤半徑和通孔長度)、傳輸線的連接角以及屏蔽孔的存在對垂直互連結構微波傳輸特性的影響。仿真結果表明,通過改變通孔的尺寸可以實現(xiàn)對其傳輸特性的微調,越是接近180°的夾角傳輸特性就越好,屏蔽孔的存在能對互連結構的第一諧振頻率起到很大的調節(jié)作用,并且能夠使得S參數(shù)曲線走勢更加平滑,在一定程度上增大了互連結構的帶寬。論文還研究了互連結構的諧振頻率在改善傳輸線微波傳輸特性上的特殊作用�；谧杩蛊ヅ浼夹g,在ADS中對垂直互連結構進行阻抗匹配設計,將設計好的傳輸線結構在HFSS中建立模型并仿真優(yōu)化。文中分別對工作頻率為20GHz和50GHz的互連結構進行阻抗匹配,匹配后的結果表明,并聯(lián)單枝節(jié)匹配以及四分之一波長變換器都可以有效改善通孔在工作頻率周圍的微波傳輸特性,且四分之一波長變換器匹配具有更小的面積和更寬的帶寬。另外,受阻抗匹配設計思想的啟發(fā),文中還采用了橢圓形反焊盤和阻抗調節(jié)段的方式對電路阻抗進行微調,使得通孔的微波傳輸特性得到了一定程度的改善。
[Abstract]:With the rapid development of the communication industry, a variety of intelligent, miniaturized end products continue to emerge, smart phones. Electronic products, such as tablets, are improving people's lives. The increasing demand for electronic products has directly promoted the development of microelectronics industry. Integrated circuit packaging technology is also in constant innovation. Among them, low temperature co-fired ceramic technology with its excellent high frequency performance, high integration, low cost in Bluetooth. WLAN and other fields have been widely used. In this process, vertical through holes are often used to connect the lines on different dielectric substrates, and the transmission characteristics of through holes directly affect the quality of signal transmission. Therefore, it is necessary to study the influence factors of through hole transmission characteristics. In this paper, the vertical interconnect structure in LTCC is studied systematically, and the equivalent circuit model of vertical through hole is established. By using quasi-static analysis method and Gao Si theorem, the formulas for calculating parasitic parameters of through holes are derived. The derived formula is inputted into MATLAB software for numerical calculation and compared with the results of Q3D software. The results show that the error between the calculation results and the simulation results is not more than 10. Then, the equivalent circuit model is simulated in ADS and compared with the through hole HFSS simulation results. The results show that the equivalent circuit model in this paper has high accuracy in low frequency and deviation from resonance frequency. A 3D electromagnetic simulation model of through hole is established by using HFSS software. The size of through hole (including through radius, pad radius, reverse pad radius and through hole length) is analyzed. The influence of the connection angle of transmission line and the existence of shielding hole on the microwave transmission characteristics of vertical interconnection structure. The simulation results show that the transmission characteristics can be fine-tuned by changing the size of the through hole. The closer to 180 擄angle transmission characteristics, the better, the existence of shielding holes can play a great role in regulating the first resonant frequency of the interconnection structure, and can make the S parameter curve more smooth. To a certain extent, the bandwidth of the interconnection structure is increased. The special role of resonant frequency of the interconnection structure in improving the microwave transmission characteristics of transmission lines is also studied, based on impedance matching technology. The impedance matching design of vertical interconnection structure is carried out in ADS. The designed transmission line structure is modeled in HFSS and optimized by simulation. The impedance matching of 20 GHz and 50 GHz interconnect structures is carried out respectively, and the matching results show that. Parallel single-branch matching and 1/4 wavelength converter can effectively improve the microwave transmission characteristics around the working frequency. The matching of 1/4 wavelength converter has smaller area and wider bandwidth. In addition, it is inspired by the design idea of impedance matching. In this paper, the impedance of the circuit is fine-tuned by using the elliptical reverse pad and the impedance adjusting section, which improves the microwave transmission characteristics of the through hole to a certain extent.
【學位授予單位】：西安電子科技大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TN015;TN405

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本文編號：1387545