本文關(guān)鍵詞：電路模塊堆疊立體組裝技術(shù)研究　出處：《西安電子科技大學(xué)》2015年碩士論文　論文類型：學(xué)位論文

  更多相關(guān)文章： 堆疊 立體組裝 垂直互連 翹曲

【摘要】：隨著電子產(chǎn)品特別是高精尖設(shè)備的尺寸和重量日趨變小,實(shí)現(xiàn)復(fù)雜電路功能的集成電路板變的越來越小、越來越輕,需要堆疊在一起的板的層數(shù)也越來越多,器件的精密度要求相應(yīng)的變高。原有的組裝技術(shù)已經(jīng)不能滿足電子組裝技術(shù)的要求,需要探索一種既能減輕設(shè)備質(zhì)量、縮小設(shè)備體積,延長(zhǎng)系統(tǒng)續(xù)航時(shí)間,又能提高設(shè)備便攜能力的組裝工藝方法,即堆疊立體組裝技術(shù)。本文針對(duì)目前電路模塊設(shè)備重量和體積較大,不能滿足設(shè)備小型化、高可靠性要求的需求瓶頸,研究器件立體堆疊組裝工藝技術(shù),通過使用板級(jí)電路模塊堆疊立體組裝技術(shù),提高電子設(shè)備制造工藝技術(shù)水平,實(shí)現(xiàn)電子測(cè)控設(shè)備的小型化、輕量化、模塊化,滿足測(cè)控設(shè)備的變批量研制生產(chǎn)的需要。文章概述了堆疊立體組裝技術(shù)的研究背景、發(fā)展現(xiàn)狀和趨勢(shì),分析研究了堆疊立體組裝技術(shù)在市場(chǎng)應(yīng)用方面的重要意義;分析了堆疊立體器件封裝中電路設(shè)計(jì)方面存在的問題,并對(duì)常見的串?dāng)_、反射、電磁干擾、同步開關(guān)噪聲等現(xiàn)象進(jìn)行了具體分析,提出了解決方法;對(duì)堆疊模塊內(nèi)電源、接地、信號(hào)與層之間的相互連接等問題進(jìn)行了研究,采用目前最為先進(jìn)的垂直互連技術(shù),確保堆疊立體組裝器件電氣性能較好的實(shí)現(xiàn),通過控制再流焊過程的溫度,減小器件滑移、翹曲和橋連發(fā)生的概率;分析了堆疊組裝器件貼片環(huán)節(jié)存在的精度問題,針對(duì)問題提出了相應(yīng)的解決方法,對(duì)堆疊立體組裝過程中出現(xiàn)的翹曲問題進(jìn)行了分析。本文所研究的組裝技術(shù)還可廣泛用于電氣可靠性要求高、整機(jī)體積和重量嚴(yán)格受限的電子設(shè)備的制造中,滿足未來高精尖設(shè)備電路模塊的研制要求,使電子設(shè)備在包含更多功能、保持電氣連接可靠性的同時(shí),實(shí)現(xiàn)小型化和輕量化。該技術(shù)研究成果可推廣到其它電子模塊的批量組裝中。
[Abstract]:Along with the electronic products especially the size and weight of sophisticated equipment is smaller, the integrated circuit board to achieve complex circuit functions become more and more small, more and more light, need to be stacked together with the number of layers is also more and more, the corresponding precision requirements of the device becomes high. The original assembly technology has been unable to meet the electronic assembly the technical requirements, we need to explore a kind of equipment which can reduce the quality, reduce the volume of the device and prolong the system life time, assembly process and improve the ability of portable devices, the stacked assembly technology. In this paper the circuit module device weight and large volume, can not meet the demand of equipment miniaturization, high reliability requirements of the bottleneck study on three-dimensional stacked assembly technology, component technology, through the use of a board level circuit stacked assembly technology, improve the technical level of manufacturing process of electronic equipment, electronic measurement Control equipment miniaturization, lightweight, modular, meet the control equipment and batch production needs development. This paper summarizes the research background of stacked assembly technology, the development status and trend analysis, the significance of stacked assembly technology in the market applications; analysis of existing circuit stacked packages in the design, and the common reflection, crosstalk, electromagnetic interference, analyzes the phenomenon of synchronous switch noise, puts forward the solving method of power supply module; stacking, grounding, mutual connection between the signal and the layer was studied, using the most advanced technology to ensure vertical interconnection. The electrical performance of stacked assembly devices better, by controlling the reflow process of the temperature reducing device, sliding, warping and bridging the probability of occurrence; analysis of the stacked ring patch assembly device The problems existing in the precision problem, puts forward corresponding solving methods, the problems of warpage of stacked assembly process were analyzed. The assembly technology can also be widely used in electrical reliability of electronic equipment manufacturing, the volume and weight of strict limitation in the future development of high-tech equipment to meet the requirements circuit module, electronic equipment contains more features, while maintaining electrical connection reliability, miniaturization and lightweight. The research results can be extended to other bulk electronic module assembly.

【學(xué)位授予單位】：西安電子科技大學(xué)
【學(xué)位級(jí)別】：碩士
【學(xué)位授予年份】：2015
【分類號(hào)】：TN405

【參考文獻(xiàn)】

相關(guān)期刊論文 前1條

1 宣大榮;表面組裝技術(shù)[J];電子元件與材料;1990年03期

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本文編號(hào)：1383510