本文關(guān)鍵詞：面向復雜半導體生產(chǎn)線的多產(chǎn)品工件合并方法研究　出處：《北京化工大學》2015年碩士論文　論文類型：學位論文

  更多相關(guān)文章： 半導體制造系統(tǒng) 工件合并 工件聚類 模糊聚類

【摘要】：半導體制造系統(tǒng)是最復雜的工業(yè)制造系統(tǒng)之一,隨著國內(nèi)外信息產(chǎn)業(yè)與電子技術(shù)的蓬勃發(fā)展,對半導體生產(chǎn)技術(shù)的升級需求迫在眉睫。在客戶訂單多樣化,生產(chǎn)需求小批量的背景下,對半導體生產(chǎn)線工件合并方法的研究,是生產(chǎn)調(diào)度優(yōu)化領(lǐng)域的一個新興方向,以優(yōu)化生產(chǎn)指標、提高生產(chǎn)線加工效率為目標,重點解決工件的排序、聚類、分派等問題,為復雜制造過程的生產(chǎn)優(yōu)化方法提供研究新思路。本文圍繞半導體制造系統(tǒng)工件合并問題展開以下研究：(1)針對半導體制造系統(tǒng)緩沖區(qū)實際生產(chǎn)調(diào)度過程,分析半導體工件合并理論的基礎(chǔ)及相關(guān)約束條件,簡要介紹工件在聚類過程中,從生產(chǎn)線上獲得的不同類型數(shù)據(jù)的處理方法,以及常用的聚類算法,為后續(xù)研究提供理論基礎(chǔ)。(2)針對半導體制造系統(tǒng)訂單數(shù)量大、產(chǎn)品種類多、交貨期廣等特點,研究一種多產(chǎn)品工件合并方法。通過一組復合排序規(guī)則對緩沖區(qū)工件進行排序合并,并利用迭代法優(yōu)化合并決策,然后借鑒閉環(huán)控制思想研究一種動態(tài)修正工件加權(quán)因子策略,以降低生產(chǎn)線不確定事件的發(fā)生帶來的影響。(3)以最小化平均加工周期與訂單拖期率為目標,通過提取半導體生產(chǎn)線工件特征屬性,設計一種相融于工件特征屬性權(quán)值優(yōu)化的模糊C均值聚類算法,以聚類結(jié)果指導工件合并過程推進,以此改善半導體生產(chǎn)線加工性能。
[Abstract]:Semiconductor manufacturing system is one of the most complex industrial manufacturing systems. With the rapid development of information industry and electronic technology at home and abroad, it is urgent to upgrade the semiconductor manufacturing technology. Under the background of small batch production demand, the research on the workpiece merging method of semiconductor production line is a new direction in the field of production scheduling optimization. The goal is to optimize the production index and improve the processing efficiency of the production line. Focus on solving the problem of job sorting, clustering, assignment and so on. This paper focuses on the following research on the integration of semiconductor manufacturing system parts: 1) the actual production scheduling process for the buffer zone of semiconductor manufacturing system. This paper analyzes the basis of semiconductor workpiece merging theory and related constraints, briefly introduces the processing methods of different types of data obtained from the production line in the process of job clustering, as well as the usual clustering algorithms. To provide a theoretical basis for the follow-up study. (2) aiming at the semiconductor manufacturing system order quantity large, product types, wide delivery time and other characteristics. In this paper, a method of multi-product job merging is studied. A set of composite collation rules is used to sort and merge buffer jobs, and iterative method is used to optimize the merging decision. Then a dynamic modified workpiece weighting factor strategy based on closed-loop control is proposed to reduce the impact of uncertain events in production line. The goal is to minimize the average processing cycle and order delay rate. By extracting the feature attributes of the workpiece in the semiconductor production line, a fuzzy C-means clustering algorithm is designed, which is integrated with the weight optimization of the workpiece characteristic attribute, and the clustering results can guide the process of workpiece merging. In order to improve the processing performance of semiconductor production line.
【學位授予單位】：北京化工大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TN305

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