金剛線切多晶黑硅的制備及性能研究
[Abstract]:Crystal silicon cells have always occupied more than 80% of the global photovoltaic market, among which polysilicon cells have been the mainstream of crystal silicon products for many years. The wafer cutting technology developed in recent years has many advantages, such as friendly environment, low loss, high chip efficiency and so on. It can reduce the cost of monolithic silicon wafer by 0.4-0.6 yuan, which is recognized as an advanced slicing technology. It has been widely used in the cutting of single crystal silicon wafer. However, the popularization of this technology in polycrystal has encountered great obstacles, which is due to the existence of a layer of amorphous silicon on the surface of the diamond chip, which affects the effectiveness of the traditional polysilicon HF/HNO3 velvet system. Therefore, a new method is urgently needed to solve the problem of making polysilicon. In the current solution, metal-catalyzed chemical etching of (MCCE) black silicon has become the focus of research due to its low substrate selectivity, low price and compatibility with existing production lines. In this paper, the mechanism of silver catalyzed chemical etching of polysilicon wafers, the process technology and the optical properties of different suede structures have been systematically studied. Firstly, the mechanism of preparing black silicon in HF/AgNO3/H2O2 system was studied: electrochemical deposition of silver nanoparticles and oxidation of silicon atoms by hydrogen peroxide and dissolution by hydrofluoric acid under the catalysis of silver nanoparticles. Then, the influence of the composition ratio on the black silicon structure and its optical properties was studied, and a kind of black silicon structure was obtained by optimizing the ratio. Due to the rough surface of the black silicon structure without post-treatment, it is necessary to optimize the black silicon structure because of the large composition, which seriously affects the performance of the battery. Therefore, the optimization process of black silicon structure is studied. The structure of black silicon was optimized by using the mixed solution of KOH/IPA. A series of structures, such as nanometer inverted pyramid, nanometer square hole and nanometer round pit, were obtained. The surface of the structure was smooth, the opening was large, and the reflectivity was lower than 15%. The black silicon structure was prepared by the metal silver catalytic etching method with the pretreated 156.75*156.75mm2 linear cut P polysilicon wafer, and the fabrication of the silicon battery was completed by the combination of the production line process and the metal silver catalytic etching method. The prepared black silicon battery has a short circuit current of 114.9 Ma, an open circuit voltage of 114.9 Ma, a filling factor FF of 0.74 and a 0.32% increase of conversion efficiency. The excellent performance of diamond wire cut black silicon battery proves that the process of preparing black silicon by MCCE has great advantages in solving the problem of making velvet and improving the performance of the battery. At the same time, because of the simplicity of this process, Perfect compatibility with production line process, very suitable for commercial production.
【學(xué)位授予單位】:中國(guó)科學(xué)院大學(xué)(中國(guó)科學(xué)院物理研究所)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2017
【分類號(hào)】:TN304.12;TM914.4
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