具備直流故障清除能力的MMC多電平子模塊拓?fù)?/H1>
發(fā)布時(shí)間:2018-03-13 22:38
本文選題:模塊化多電平換流器 切入點(diǎn):高壓直流輸電 出處:《高電壓技術(shù)》2017年01期
論文類型:期刊論文
【摘要】:MMC-HVDC的直流故障處理能力直接關(guān)系到其在架空線領(lǐng)域和高壓大容量場(chǎng)合的應(yīng)用前景。因此,提出了一種MMC改進(jìn)拓?fù)?其利用子模塊電容電壓形成反電動(dòng)勢(shì)來強(qiáng)制關(guān)斷二極管,快速地清除故障電流。詳細(xì)分析了該拓?fù)渲绷鞴收锨宄砗透鞴β势骷哪蛪呵闆r,并與其他拓?fù)溥M(jìn)行了對(duì)比分析。最后采用PSCAD/EMTDC仿真驗(yàn)證了所提新型子模塊拓?fù)涞恼_性和有效性。結(jié)果表明,所提出的拓?fù)涞闹鱅GBT和保護(hù)IGBT的額定電壓都僅為常規(guī)設(shè)計(jì)的1/2,可有效降低換流器成本。
[Abstract]:The DC fault handling ability of MMC-HVDC is directly related to its application prospect in the field of overhead line and high voltage and large capacity. Therefore, an improved topology of MMC is proposed, which uses the capacitor voltage of submodule to form a back EMF to force off the diode. The principle of DC fault clearing and the voltage resistance of each power device are analyzed in detail. Finally, the correctness and validity of the proposed new sub-module topology are verified by PSCAD/EMTDC simulation. The results show that, The rated voltage of both the main IGBT and the protected IGBT of the proposed topology is only 1 / 2 of that of the conventional design, which can effectively reduce the cost of the converter.
【作者單位】: 北京交通大學(xué)電氣工程學(xué)院;
【分類號(hào)】:TM721.1;TM46
【相似文獻(xiàn)】
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1 江國(guó)平;;Vitros250干式生化分析儀硬件故障清除[J];醫(yī)療衛(wèi)生裝備;2006年09期
,
本文編號(hào):1608460
本文鏈接:http://sikaile.net/kejilunwen/dianlidianqilunwen/1608460.html
本文選題:模塊化多電平換流器 切入點(diǎn):高壓直流輸電 出處:《高電壓技術(shù)》2017年01期 論文類型:期刊論文
【摘要】:MMC-HVDC的直流故障處理能力直接關(guān)系到其在架空線領(lǐng)域和高壓大容量場(chǎng)合的應(yīng)用前景。因此,提出了一種MMC改進(jìn)拓?fù)?其利用子模塊電容電壓形成反電動(dòng)勢(shì)來強(qiáng)制關(guān)斷二極管,快速地清除故障電流。詳細(xì)分析了該拓?fù)渲绷鞴收锨宄砗透鞴β势骷哪蛪呵闆r,并與其他拓?fù)溥M(jìn)行了對(duì)比分析。最后采用PSCAD/EMTDC仿真驗(yàn)證了所提新型子模塊拓?fù)涞恼_性和有效性。結(jié)果表明,所提出的拓?fù)涞闹鱅GBT和保護(hù)IGBT的額定電壓都僅為常規(guī)設(shè)計(jì)的1/2,可有效降低換流器成本。
[Abstract]:The DC fault handling ability of MMC-HVDC is directly related to its application prospect in the field of overhead line and high voltage and large capacity. Therefore, an improved topology of MMC is proposed, which uses the capacitor voltage of submodule to form a back EMF to force off the diode. The principle of DC fault clearing and the voltage resistance of each power device are analyzed in detail. Finally, the correctness and validity of the proposed new sub-module topology are verified by PSCAD/EMTDC simulation. The results show that, The rated voltage of both the main IGBT and the protected IGBT of the proposed topology is only 1 / 2 of that of the conventional design, which can effectively reduce the cost of the converter.
【作者單位】: 北京交通大學(xué)電氣工程學(xué)院;
【分類號(hào)】:TM721.1;TM46
【相似文獻(xiàn)】
相關(guān)期刊論文 前1條
1 江國(guó)平;;Vitros250干式生化分析儀硬件故障清除[J];醫(yī)療衛(wèi)生裝備;2006年09期
,本文編號(hào):1608460
本文鏈接:http://sikaile.net/kejilunwen/dianlidianqilunwen/1608460.html
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