【摘要】：基于籠型倍半硅氧烷(POSS)的有機(jī)-無(wú)機(jī)雜化納米復(fù)合低介電材料由于具有良好的綜合性能,在微電子封裝中存在潛在應(yīng)用。然而目前基于POSS的可聚合單元通常含有氋極性基團(tuán),對(duì)材料低介電性能造成了不利影響�；诒讲h(huán)丁烯(BCB)基團(tuán)在高性能低介電材料中的獨(dú)特優(yōu)勢(shì),利用POSS的Heck反應(yīng),在POSS上引入BCB官能團(tuán),進(jìn)而制備形成衍生聚合物。核磁氫譜表明成功實(shí)現(xiàn)了POSS的BCB官能化,取代率達(dá)到約50%。差示熱量測(cè)試表明BCBPOSS通過(guò)[~(2+)4]環(huán)加成實(shí)現(xiàn)了交聯(lián)聚合。熱重測(cè)試表明BCB-POSS交聯(lián)樹(shù)脂具有優(yōu)異的熱穩(wěn)定性能。掃描探針顯微鏡結(jié)果表明BCB-POSS交聯(lián)樹(shù)脂薄膜表面光潔性較好,滿(mǎn)足微電子應(yīng)用的基本要求。
[Abstract]:Organic-inorganic hybrid nanocomposite low dielectric materials based on cage silsesquioxane (POSS) have potential applications in microelectronic packaging because of their good comprehensive properties. However, at present, the polymerizable units based on POSS usually contain polar groups, which have a negative effect on the low dielectric properties of the materials. Based on the unique advantages of benzocyclobutene (BCB) group in high performance and low dielectric materials, BCB functional groups were introduced into POSS by Heck reaction of POSS, and then derivative polymers were prepared. The nuclear magnetic hydrogen spectrum shows that the BCB functionalization of POSS is successfully realized, and the substitution rate is about 50%. The differential heat test showed that the cross-linking polymerization of BCBPOSS was realized by [~ (2) 4] cycloaddition. Thermogravimetric test showed that BCB-POSS crosslinked resin had excellent thermal stability. The results of scanning probe microscope show that the surface finish of BCB-POSS crosslinked resin film is good, which meets the basic requirements of microelectronics application.
【作者單位】： 西南科技大學(xué)材料科學(xué)與工程學(xué)院;四川省非金屬?gòu)?fù)合與功能材料重點(diǎn)實(shí)驗(yàn)室-省部共建國(guó)家重點(diǎn)實(shí)驗(yàn)室培育基地西南科技大學(xué)材料科學(xué)與工程學(xué)院;
【基金】：西南科技大學(xué)博士基金資助項(xiàng)目(10zx7116)
【分類(lèi)號(hào)】：TB33;TQ317

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