【摘要】：提出一種新型的金屬與聚乙烯薄膜層間有機黏合方法,能夠?qū)崿F(xiàn)薄膜層之間的有機黏合。該方法基于大氣壓Ar/O2介質(zhì)阻擋放電對聚乙烯薄膜表面改性預(yù)處理,利用射頻電感耦合等離子體增強非平衡磁控濺射系統(tǒng)在預(yù)處理的聚乙烯薄膜表面鍍銅膜。研究結(jié)果表明,介質(zhì)阻擋放電處理聚乙烯薄膜表面,引入了氧原子功能團(tuán)(C—O,C=O,O—C=O等),導(dǎo)致薄膜表面自由能的增加。此外,這種方法得到的薄膜層之間黏著強度為1.5 MPa;而銅膜與未進(jìn)行等離子體預(yù)處理聚乙烯之間的黏著強度僅為0.8 MPa。此外,SEM照片也顯示,經(jīng)過等離子體預(yù)處理后聚乙烯表面的電鍍銅膜晶粒較小且分布更均勻。
[Abstract]:A new method of organic bonding between metal and polyethylene film is proposed, which can realize the organic bonding between metal and polyethylene film. The method is based on the pretreatment of polyethylene film surface by atmospheric pressure Ar/O2 dielectric barrier discharge. The copper film is deposited on the surface of pretreated polyethylene film by RF inductively coupled plasma enhanced unbalanced magnetron sputtering system. The results show that oxygen atom functional groups (C _ (O), O ~ (2 +) are introduced into the surface of polyethylene film treated by dielectric barrier discharge (DBD), which leads to the increase of the free energy on the surface of the film. In addition, the adhesion strength between the films obtained by this method is 1.5 MPa;, while the adhesion strength between copper film and unpretreated polyethylene is only 0.8 MPa.. In addition, SEM images also show that the grain size of copper plating film on the surface of polyethylene is smaller and more uniform after plasma pretreatment.
【作者單位】： 南昌大學(xué)物理系;大連理工大學(xué)物理與光電工程學(xué)院;
【基金】：國家自然科學(xué)基金項目(11465013) 江西省科技廳自然科學(xué)基金項目(20151BAB212012,20161BAB201013)
【分類號】：TB306;TQ153.14

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