【摘要】：利用空間綜合輻照試驗(yàn)系統(tǒng)和X射線光電子能譜分析(XPS)、熱重等分析測(cè)試對(duì)空間電子輻射環(huán)境下聚酰亞胺薄膜力學(xué)性能演化及機(jī)理進(jìn)行了研究。研究發(fā)現(xiàn),聚酰亞胺薄膜的拉力、抗拉強(qiáng)度和斷裂伸長(zhǎng)率隨著電子輻照注量的增加先增加而后指數(shù)減小。由熱重分析可知,電子輻照可引起聚酰亞胺薄膜的失重溫度顯著降低,在以失重10%作為判據(jù)的條件下,其失重溫度由595℃下降為583℃。由XPS分析可知,電子輻照誘發(fā)聚酰亞胺薄膜化學(xué)價(jià)鍵的斷裂和交聯(lián),在電子輻照初期,C—N鍵的斷裂及引發(fā)的交聯(lián)是導(dǎo)致力學(xué)性能增加的主要原因,而隨著輻照注量的增加,C=O雙鍵、—N(CO)鍵的斷裂、新的C—N鍵的形成以及N元素的析出是導(dǎo)致聚酰亞胺薄膜力學(xué)性能降低的主要原因。
[Abstract]:The evolution and mechanism of mechanical properties of polyimide films under space electron radiation were studied by means of space integrated radiation test system and X-ray photoelectron spectroscopy (XPS) (XPS), thermogravimetric analysis. It is found that the tensile strength, tensile strength and elongation at break of polyimide films increase first and then decrease with the increase of electron irradiation flux. The results of thermogravimetric analysis show that the weight loss temperature of polyimide films can be significantly reduced by electron irradiation, and the weight loss temperature decreases from 595 鈩，

本文編號(hào)：2413275