樹脂基導熱復合材料的制備與性能研究
發(fā)布時間:2018-12-28 14:03
【摘要】:隨著微電子信息技術的逐漸發(fā)展,傳統(tǒng)的電子元器件正逐步向著高精度、高集成方向發(fā)展,這就意味著電子設備在單位體積上產(chǎn)生更多的熱量。為了保障電子設備可以高效長久的工作,能否及時的把器件產(chǎn)生的熱量散出便成了至關重要的因素,填充型樹脂基導熱復合材料正是基于這個因素逐漸發(fā)展起來的。本論文以氧化鋁(Al2O3)、氧化石墨烯(GO)為導熱填料,以環(huán)氧樹脂為基體,以碳纖維布(CF)和玄武巖纖維/碳纖維合股布(BF/CF)為增強材料,分別制備了導熱樹脂基澆鑄體和導熱樹脂基層壓板。為了改善Al2O3填料與樹脂基體的相容性和界面結合強度,通過兩步改性對Al2O3填料進行處理:先使用偶聯(lián)劑處理引入環(huán)氧基官能團(Al2O3-KH560),在改性后的粒子上接枝低分子聚酰胺引入氨基官能團(Al2O3-PA650)。接著使用紅外和熱失重對改性后的填料進行表征。使用未處理的Al2O3粒子、Al2O3-KH560粒子和Al2O3-PA650粒子三種不同表面特性的填料填充環(huán)氧樹脂制備導熱復合材料。采用導熱儀、熱失重分析儀、掃描電子顯微鏡和萬能試樣機等設備研究復合材料的導熱性能、力學性能和形貌。結果表明:Al2O3-PA650粒子在環(huán)氧樹脂中的分散性最好。三種復合材料的導熱系數(shù)都隨填料使用量的增大而增大。當填充量相等時,Al2O3-PA650/環(huán)氧樹脂復合材料的導熱性能和力學性能最好。此外,通過加入微量氧化石墨烯與Al2O3-PA650粒子復配使用,極大的改善了復合材料的導熱性能和力學性能。當使用1 wt%GO和30 wt%Al2O3-PA650復配使用時,復合材料的導熱系數(shù)可達0.61W/mK,比純環(huán)氧樹脂的0.237 W/mK提升了157%。以導熱填料的表面改性為基礎,制備并研究了碳纖維布和玄碳合股布增強填充型環(huán)氧樹脂層壓板的導熱性能與力學性能。系統(tǒng)的探討了不同Al2O3-PA650填料添加量對兩種不同特性的纖維布增強環(huán)氧樹脂層壓板的綜合性能的影響。結果顯示:兩種纖維布增強環(huán)氧樹脂層壓板的縱向和橫向?qū)嵯禂?shù)都隨氧化鋁填料含量的增大而呈先增加后減少的趨勢。當Al2O3-PA650使用量為30 wt%時,兩種層壓板的縱向?qū)嵯禂?shù)差別最大,分別為1.05 W/mK和0.61 W/mK。碳纖維布增強環(huán)氧樹脂層壓板的力學性能整體好于玄碳合股布增強環(huán)氧層壓板,且兩者隨填料含量的變化規(guī)律基本一致。
[Abstract]:With the development of microelectronic information technology, traditional electronic components are gradually developing towards high precision and high integration, which means that electronic devices produce more heat per unit volume. In order to ensure that electronic equipment can work efficiently and for a long time, whether or not the heat produced by the device can be dissipated in time becomes a crucial factor, and it is based on this factor that the filled resin matrix thermal conductivity composite material is gradually developed. In this paper, alumina (Al2O3), graphene oxide (GO) as thermal conductive filler, epoxy resin as matrix, carbon fiber sheet (CF) and basalt fiber / carbon fiber composite (BF/CF) as reinforcements. Heat-conducting resin-based casting bodies and heat-conducting resin base compaction plates were prepared respectively. In order to improve the compatibility and interfacial bonding strength of Al2O3 filler with resin matrix, the Al2O3 filler was treated by two steps of modification: first, the epoxy functional group (Al2O3-KH560) was introduced by coupling agent treatment. The modified particles were grafted with low molecular polyamide to introduce amino functional group (Al2O3-PA650). The modified filler was characterized by IR and TG. Epoxy resin filled with untreated Al2O3 particles, Al2O3-KH560 particles and Al2O3-PA650 particles with different surface characteristics was used to prepare thermal conductivity composites. The thermal conductivity, mechanical properties and morphology of the composites were studied by means of thermal conductivity instrument, thermogravimetric analyzer, scanning electron microscope and universal specimen machine. The results show that the dispersion of Al2O3-PA650 particles in epoxy resin is the best. The thermal conductivity of the three composites increases with the increase of filler content. The thermal conductivity and mechanical properties of Al2O3-PA650/ epoxy resin composites are the best when the filling amount is equal. In addition, the thermal conductivity and mechanical properties of the composites were greatly improved by adding trace graphene oxide and Al2O3-PA650 particles. When 1 wt%GO and 30 wt%Al2O3-PA650 were used, the thermal conductivity of the composite was 0.61W / mK, which was 157mm higher than that of pure epoxy resin (0.237 W/mK). Based on the surface modification of thermal conductive filler, the thermal conductivity and mechanical properties of epoxy resin laminates reinforced by carbon fiber cloth and metacronal fabric were studied. The effects of different Al2O3-PA650 fillers on the comprehensive properties of two kinds of fiber cloth reinforced epoxy resin laminates were studied systematically. The results show that the longitudinal and transverse thermal conductivity of the two fiber cloth reinforced epoxy resin laminates increase first and then decrease with the increase of alumina filler content. When the amount of Al2O3-PA650 was 30 wt%, the difference of longitudinal thermal conductivity between the two laminates was 1.05 W/mK and 0.61 W / mK, respectively. The mechanical properties of carbon fiber reinforced epoxy laminates are better than that of metacrylonitrile reinforced epoxy laminates.
【學位授予單位】:哈爾濱工業(yè)大學
【學位級別】:碩士
【學位授予年份】:2015
【分類號】:TB332
[Abstract]:With the development of microelectronic information technology, traditional electronic components are gradually developing towards high precision and high integration, which means that electronic devices produce more heat per unit volume. In order to ensure that electronic equipment can work efficiently and for a long time, whether or not the heat produced by the device can be dissipated in time becomes a crucial factor, and it is based on this factor that the filled resin matrix thermal conductivity composite material is gradually developed. In this paper, alumina (Al2O3), graphene oxide (GO) as thermal conductive filler, epoxy resin as matrix, carbon fiber sheet (CF) and basalt fiber / carbon fiber composite (BF/CF) as reinforcements. Heat-conducting resin-based casting bodies and heat-conducting resin base compaction plates were prepared respectively. In order to improve the compatibility and interfacial bonding strength of Al2O3 filler with resin matrix, the Al2O3 filler was treated by two steps of modification: first, the epoxy functional group (Al2O3-KH560) was introduced by coupling agent treatment. The modified particles were grafted with low molecular polyamide to introduce amino functional group (Al2O3-PA650). The modified filler was characterized by IR and TG. Epoxy resin filled with untreated Al2O3 particles, Al2O3-KH560 particles and Al2O3-PA650 particles with different surface characteristics was used to prepare thermal conductivity composites. The thermal conductivity, mechanical properties and morphology of the composites were studied by means of thermal conductivity instrument, thermogravimetric analyzer, scanning electron microscope and universal specimen machine. The results show that the dispersion of Al2O3-PA650 particles in epoxy resin is the best. The thermal conductivity of the three composites increases with the increase of filler content. The thermal conductivity and mechanical properties of Al2O3-PA650/ epoxy resin composites are the best when the filling amount is equal. In addition, the thermal conductivity and mechanical properties of the composites were greatly improved by adding trace graphene oxide and Al2O3-PA650 particles. When 1 wt%GO and 30 wt%Al2O3-PA650 were used, the thermal conductivity of the composite was 0.61W / mK, which was 157mm higher than that of pure epoxy resin (0.237 W/mK). Based on the surface modification of thermal conductive filler, the thermal conductivity and mechanical properties of epoxy resin laminates reinforced by carbon fiber cloth and metacronal fabric were studied. The effects of different Al2O3-PA650 fillers on the comprehensive properties of two kinds of fiber cloth reinforced epoxy resin laminates were studied systematically. The results show that the longitudinal and transverse thermal conductivity of the two fiber cloth reinforced epoxy resin laminates increase first and then decrease with the increase of alumina filler content. When the amount of Al2O3-PA650 was 30 wt%, the difference of longitudinal thermal conductivity between the two laminates was 1.05 W/mK and 0.61 W / mK, respectively. The mechanical properties of carbon fiber reinforced epoxy laminates are better than that of metacrylonitrile reinforced epoxy laminates.
【學位授予單位】:哈爾濱工業(yè)大學
【學位級別】:碩士
【學位授予年份】:2015
【分類號】:TB332
【參考文獻】
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