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雙馬樹脂及其復(fù)合材料微波固化工藝與性能研究

發(fā)布時(shí)間:2018-12-25 19:21
【摘要】:本文以微波固化技術(shù)在雙馬樹脂基復(fù)合材料領(lǐng)域的應(yīng)用為背景開展工藝及性能基礎(chǔ)性研究。經(jīng)體系篩選與優(yōu)化,得到適合微波固化的雙馬樹脂體系;通過研究樹脂的微波固化特性,成功制備得到力學(xué)性能較好的耐高溫雙馬樹脂澆注體與復(fù)合材料,為微波固化技術(shù)在雙馬樹脂基復(fù)合材料領(lǐng)域的應(yīng)用提供理論與實(shí)踐指導(dǎo)。本文研究包括:(1)為得到適宜微波固化的雙馬樹脂,結(jié)合工程適用性并以樹脂的微波固化效率為目標(biāo),通過正交試驗(yàn)法研究樹脂配方工藝參數(shù)對(duì)樹脂微波固化效率的影響,得到最優(yōu)配方工藝為:BDM/DABPA摩爾比0.8:1,BDM與DABPA在135°C下預(yù)聚60min,DCP用量為BDM/DABPA總質(zhì)量的1.5 wt%;并得到各參數(shù)對(duì)微波固化效率影響強(qiáng)弱依次為:預(yù)聚時(shí)間、DCP用量、BDM/DABPA用量比。其主要原因?yàn)?預(yù)聚時(shí)間延長(zhǎng)使樹脂放熱峰更加尖銳、反應(yīng)更快,同時(shí)預(yù)聚生成的中間體可能具有更高的反應(yīng)活性;DCP用量增加,產(chǎn)生更多自由基加速反應(yīng);BDM與DABPA在微波下反應(yīng)性接近。另外,通過改變微波工藝參數(shù),研究樹脂的微波固化工藝特性,結(jié)果表明:微波功率需要達(dá)到一定的閾值(450W)才能使樹脂開始交聯(lián)固化;且隨反應(yīng)進(jìn)行,固化速率先增加后降低。(2)為對(duì)比樹脂微波固化與熱固化性能,制備澆注體并研究其玻璃化轉(zhuǎn)變溫度、彎曲以及拉伸性能,結(jié)果表明:微波固化可以大幅度地縮短工藝時(shí)間,比熱固化縮短87%;微波固化能保持樹脂的耐熱性,微波固化后玻璃化溫度為261.92°C,熱固化后為259.85°C;微波固化使樹脂模量略有增加,強(qiáng)度輕微降低,微波固化物彎曲模量和拉伸模量提高4.8%與2.3%,彎曲強(qiáng)度和拉伸強(qiáng)度降低7.2%與4.1%。強(qiáng)度降低的主要原因是微波固化功率大、反應(yīng)速度快、交聯(lián)度更高,導(dǎo)致固化物模量、脆性增大。(3)為對(duì)比復(fù)合材料微波固化與熱固化性能,通過自行搭建滾筒纏繞系統(tǒng)獲得預(yù)浸料并制備雙馬/玻纖層合板,研究其含膠量、彎曲、拉伸以及短梁剪切性能,結(jié)果表明:在大幅度縮短固化時(shí)間的同時(shí),微波固化使復(fù)合材料模量增加、強(qiáng)度降低。微波固化[0/90]3s層合板彎曲強(qiáng)度和拉伸強(qiáng)度降低7.7%與6.0%,拉伸模量提高7.6%;[0]6s層合板短梁剪切強(qiáng)度降低10%。其主要原因?yàn)?微波固化得到的脆性基體使模量增加,但它難以阻止裂紋擴(kuò)展并導(dǎo)致強(qiáng)度降低。
[Abstract]:Based on the application of microwave curing technology in the field of bismaleic resin matrix composites, the basic research of technology and properties is carried out in this paper. The bismalone resin system suitable for microwave curing was obtained by screening and optimizing the system. By studying the microwave curing characteristics of the resin, the high temperature resistant bismaleic resin casting body and composites were successfully prepared, which provided theoretical and practical guidance for the application of microwave curing technology in the field of bismaleic resin matrix composites. The main contents of this paper are as follows: (1) in order to obtain bismaleic resin suitable for microwave curing, combined with engineering applicability and aiming at the microwave curing efficiency of resin, the effects of resin formulation parameters on microwave curing efficiency were studied by orthogonal test. The optimum formulation was obtained as follows: the molar ratio of BDM/DABPA to DABPA was 0.8: 1g / min and the amount of prepolymerized 60min DCP was 1.5 wt%; at 135 擄C with the total mass of BDM/DABPA. The effects of different parameters on microwave curing efficiency were obtained as follows: prepolymerization time, DCP dosage and BDM/DABPA dosage ratio. The main reasons are as follows: prolonged prepolymerization time makes the exothermic peak of resin sharper and the reaction faster, and the intermediate formed by prepolymerization may have higher reaction activity, and the amount of DCP increases, and more free radical accelerates the reaction. The reactivity of BDM and DABPA is similar under microwave. In addition, the microwave curing characteristics of the resin were studied by changing the microwave technological parameters. The results showed that the microwave power needed to reach a certain threshold (450 W) to make the resin begin crosslinking and curing. With the reaction, the curing rate increased first and then decreased. (2) compared with the properties of microwave curing and thermal curing of resin, the casting materials were prepared and their glass transition temperature, bending and tensile properties were studied. The results show that microwave curing can greatly shorten the processing time and specific heat curing can shorten 87%. The heat resistance of the resin can be maintained by microwave curing. The glass transition temperature is 261.92 擄C after microwave curing and 259.85 擄C after heat curing. Microwave curing slightly increased the modulus of resin and slightly decreased its strength. The flexural modulus and tensile modulus of microwave cured compounds increased by 4.8% and 2.3%, and the flexural strength and tensile strength decreased by 7.2% and 4.1% respectively. The main reasons for the decrease of strength are that the microwave curing power is high, the reaction rate is fast, and the crosslinking degree is higher, which leads to the consolidation modulus and brittleness increase. (3) comparing the properties of microwave curing and thermal curing of composites, The prepreg was prepared by self-built drum winding system, and the adhesive content, bending, tensile and shear properties of the short beam were studied. The results showed that the curing time was greatly shortened while the curing time was greatly shortened. Microwave curing increases the modulus and decreases the strength of the composite. The bending strength and tensile strength of [0 / 90] 3 s laminates were decreased by 7. 7% and 6. 0%, the tensile modulus increased by 7. 6%, and the shear strength of [0] 6 s laminated short beams decreased by 10%. The main reason is that the brittle matrix obtained by microwave curing increases the modulus, but it is difficult to prevent the crack growth and lead to the decrease of the strength.
【學(xué)位授予單位】:南京航空航天大學(xué)
【學(xué)位級(jí)別】:碩士
【學(xué)位授予年份】:2015
【分類號(hào)】:TB33;TQ320.1

【參考文獻(xiàn)】

相關(guān)期刊論文 前1條

1 李敏,張佐光,仲偉虹,潘貽珊;聚酰亞胺樹脂研究與應(yīng)用進(jìn)展[J];復(fù)合材料學(xué)報(bào);2000年04期

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本文編號(hào):2391530

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