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具有隔離結(jié)構(gòu)絕緣導(dǎo)熱復(fù)合材料性能的研究

發(fā)布時間:2018-11-15 08:01
【摘要】:以通用級聚苯乙烯(GPPS),超高相對分子質(zhì)量聚乙烯(UHMWPE)為基底樹脂,苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS)溶液為膠黏劑,六方氮化硼(BN)為導(dǎo)熱填料,通過膠黏劑法制備具有隔離結(jié)構(gòu)的絕緣導(dǎo)熱復(fù)合材料。研究了BN的尺寸和用量對具有隔離結(jié)構(gòu)絕緣導(dǎo)熱復(fù)合材料微觀結(jié)構(gòu)、導(dǎo)熱性能、導(dǎo)熱通道及BN取向的影響。結(jié)果表明:BN的添加對復(fù)合材料導(dǎo)熱性能的提升十分明顯。在BN質(zhì)量分?jǐn)?shù)為40%時,隔離結(jié)構(gòu)BN(10μm)/GPPS復(fù)合材料的導(dǎo)熱系數(shù)為2.0 W/(m·K)是添加BN(1μm)/GPPS復(fù)合材料導(dǎo)熱系數(shù)的4.2倍。此外,BN/UHMWPE/GPPS與BN/EG/GPPS復(fù)合材料對基底樹脂導(dǎo)熱性能有著更加優(yōu)異的提升。
[Abstract]:The superhigh molecular weight polyethylene (UHMWPE) of general grade polystyrene (GPPS),) was used as the base resin, the (SEBS) solution of styrene-butene-styrene block copolymer as the adhesive, and the hexagonal boron nitride (BN) as the thermal conductive filler. Insulation thermal conductive composites with isolated structure were prepared by adhesive method. The effects of the size and amount of BN on the microstructure, thermal conductivity, thermal conduction channel and BN orientation of insulating thermal conductive composites with isolated structure were studied. The results show that the thermal conductivity of composites is improved obviously by adding BN. When the mass fraction of BN is 40, the thermal conductivity of isolated BN (10 渭 m) / GPPS composites is 2. 0 W / (m K), which is 4.2 times that of BN (1 渭 m) / GPPS composites. In addition, BN/UHMWPE/GPPS and BN/EG/GPPS composites have more excellent thermal conductivity.
【作者單位】: 四川大學(xué)高分子科學(xué)與工程學(xué)院;
【分類號】:TB332
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本文編號:2332678

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