不同粗化前處理和硅烷自組裝膜處理對ABS樹脂表面化學鍍銅影響的研究
發(fā)布時間：2018-08-11 13:44
【摘要】：ABS是一種重要的工程材料,金屬化的ABS樹脂在保持耐熱性、易加工性等塑料特性的同時,兼具金屬的導電性、導磁性等優(yōu)點,表面金屬化的ABS塑料制品機械強度高、耐腐蝕、壽命長,從而進一步擴大了其應用領域,例如在電子行業(yè)、電器配件等行業(yè)。基底表面的粗化處理是決定化學鍍銅層和基底結合力的主要因素,粗化后形成最佳的粗糙度,才能保證后續(xù)程序的正常進行,所以本研究通過對比拋光劑打磨粗化處理、堿混合液粗化處理和電暈放電粗化處理三種處理方式來確定最佳的粗化處理方式。另外,硅烷類自組裝膜的修飾作用,可以很大程度上促進化學鍍銅的沉積,并通過化學鍵或者配位鍵和鍍銅層連接,增大鍍銅層的粘結力,本研究對比APTES,MPTMS,TES硅烷膜的鍍銅效果,確定最佳的自組裝薄膜。借助接觸角儀,SEM,XRD,電化學工作站和鹽水浸泡實驗、劃格實驗等實驗儀器和方法對化學鍍銅層進行表征和研究,得出以下結論:(1)與堿液粗化處理和打磨粗化處理相比,電暈放電粗化處理可以更有有效地活化ABS樹脂表面,增加ABS樹脂表面的粗糙度,使其表面潤濕性提高,接觸角值降低至46.3°;(2)經電暈放電粗化處理的ABS樹脂表面可以成功的組裝TES自組裝薄膜。電暈處理后的孔狀腔體結構和TES自組裝薄膜中的硫原子與銅的強化學配位作用,使得化學鍍銅層和ABS樹脂基底牢固結合,有很強的粘結力,且化學鍍銅層平整光亮,均勻致密,有明亮的銅色。(3)TES自組裝薄膜修飾的ABS樹脂表面的化學鍍銅的沉積速度最快,銅膜厚度最大,MPTMS次之,APTES自組裝薄膜修飾的ABS樹脂表面的化學鍍銅鍍速最慢,厚度最薄。(4)掃描電鏡圖顯示,TES自組裝薄膜修飾的ABS表面化學鍍銅的顆粒的密度非常大,顆粒的直徑很小,而且顆粒相互連接,基本上沒有明顯的裂痕和縫隙存在,而且顆粒基本完全覆蓋了樹脂的表面,總體來看,鍍銅層致密均一連續(xù),品質很好;MPTMS次之,APTES自組裝薄膜修飾的ABS樹脂表面化學鍍銅,其表面的鍍銅顆�；径际欠稚⑶覇为毚嬖诘�,顆粒比較稀疏,顆粒之間的縫隙比較大,粒徑較大,覆蓋的范圍也比較有限。(5)粘結力試驗表明,三種自組裝薄膜修飾后化學鍍銅層和基底之間的粘結力都很強,符合工業(yè)設計的要求。(6)XRD圖譜顯示,三種不同自組裝薄膜修飾后的化學鍍銅層,其微觀結構的晶型均呈現比較強的Cu(111)傾向,TES自組裝薄膜修飾的化學鍍銅層的電子遷移阻抗性能最好。
[Abstract]:ABS is an important engineering material. The metallized ABS resin not only keeps the properties of plastics such as heat resistance and processability, but also has the advantages of metal conductivity and magnetic conductivity. The surface metallized ABS plastic products have high mechanical strength and corrosion resistance. Long life, thus further expanding its applications, such as electronics, electrical accessories and other industries. The coarsening treatment of substrate surface is the main factor that determines the binding force of electroless copper plating layer and substrate, and the best roughness can be formed after coarsening to ensure the normal proceeding of the follow-up procedure. The coarsening treatment of alkali mixture and corona discharge were used to determine the best coarsening method. In addition, the modification of silane self-assembled films can greatly promote the deposition of electroless copper plating, and increase the adhesion of copper coating by chemical bond or coordination bond to copper coating. In this study, the copper plating effect of APTES / MPTMS320TES silane film was compared. Determine the best self-assembly film. The electroless copper plating layer was characterized and studied by means of contact angle instrument (SEMX XRD), electrochemical workstation and brine immersion experiment, and grid test. The following conclusions were obtained: (1) compared with alkali solution coarsening and grinding roughening, Corona discharge roughening can activate the surface of ABS resin more effectively, increase the surface roughness of ABS resin, and improve the wettability of ABS resin surface. The contact angle was reduced to 46.3 擄. (2) TES self-assembled films could be successfully assembled on the surface of ABS resin treated by corona discharge coarsening. After corona treatment, the pore cavity structure and the enhanced coordination of sulfur atoms in TES self-assembled thin films make the electroless copper plating layer and the ABS resin substrate firmly bonded, and the electroless copper plating layer is smooth, bright and uniform. (3) Electroless copper deposition was the fastest on the surface of ABS resin modified by TES self-assembled film, and the lowest was on the surface of ABS resin modified by TES self-assembled film, followed by the largest thickness of copper film. (4) scanning electron microscopy showed that the particles of electroless copper plating on the surface of ABS modified by tes self-assembled thin film were very dense, the diameter of the particles was very small, and the particles were connected with each other, and there were basically no obvious cracks and cracks. On the whole, the copper-plated layer is compact and uniform, and the quality is very good. The surface of ABS resin modified by APTES self-assembled film is chemically coated with copper. The copper-plated particles on the surface are dispersed and exist alone, the particles are relatively sparse, the gap between the particles is larger, the particle size is larger, and the coverage range is relatively limited. (5) the adhesion test shows that, The adhesion between the electroless copper coating and the substrate is very strong after the modification of the three self-assembled films, which conforms to the requirements of industrial design. (6) the XRD spectra show that the three kinds of self-assembled films are modified by electroless copper plating. The electroless copper coating modified by TES self-assembled thin films has the best electron migration impedance (EMI).
【學位授予單位】：西北農林科技大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TQ325.2;TB306
本文編號：2177162
[Abstract]:ABS is an important engineering material. The metallized ABS resin not only keeps the properties of plastics such as heat resistance and processability, but also has the advantages of metal conductivity and magnetic conductivity. The surface metallized ABS plastic products have high mechanical strength and corrosion resistance. Long life, thus further expanding its applications, such as electronics, electrical accessories and other industries. The coarsening treatment of substrate surface is the main factor that determines the binding force of electroless copper plating layer and substrate, and the best roughness can be formed after coarsening to ensure the normal proceeding of the follow-up procedure. The coarsening treatment of alkali mixture and corona discharge were used to determine the best coarsening method. In addition, the modification of silane self-assembled films can greatly promote the deposition of electroless copper plating, and increase the adhesion of copper coating by chemical bond or coordination bond to copper coating. In this study, the copper plating effect of APTES / MPTMS320TES silane film was compared. Determine the best self-assembly film. The electroless copper plating layer was characterized and studied by means of contact angle instrument (SEMX XRD), electrochemical workstation and brine immersion experiment, and grid test. The following conclusions were obtained: (1) compared with alkali solution coarsening and grinding roughening, Corona discharge roughening can activate the surface of ABS resin more effectively, increase the surface roughness of ABS resin, and improve the wettability of ABS resin surface. The contact angle was reduced to 46.3 擄. (2) TES self-assembled films could be successfully assembled on the surface of ABS resin treated by corona discharge coarsening. After corona treatment, the pore cavity structure and the enhanced coordination of sulfur atoms in TES self-assembled thin films make the electroless copper plating layer and the ABS resin substrate firmly bonded, and the electroless copper plating layer is smooth, bright and uniform. (3) Electroless copper deposition was the fastest on the surface of ABS resin modified by TES self-assembled film, and the lowest was on the surface of ABS resin modified by TES self-assembled film, followed by the largest thickness of copper film. (4) scanning electron microscopy showed that the particles of electroless copper plating on the surface of ABS modified by tes self-assembled thin film were very dense, the diameter of the particles was very small, and the particles were connected with each other, and there were basically no obvious cracks and cracks. On the whole, the copper-plated layer is compact and uniform, and the quality is very good. The surface of ABS resin modified by APTES self-assembled film is chemically coated with copper. The copper-plated particles on the surface are dispersed and exist alone, the particles are relatively sparse, the gap between the particles is larger, the particle size is larger, and the coverage range is relatively limited. (5) the adhesion test shows that, The adhesion between the electroless copper coating and the substrate is very strong after the modification of the three self-assembled films, which conforms to the requirements of industrial design. (6) the XRD spectra show that the three kinds of self-assembled films are modified by electroless copper plating. The electroless copper coating modified by TES self-assembled thin films has the best electron migration impedance (EMI).
【學位授予單位】：西北農林科技大學
【學位級別】：碩士
【學位授予年份】：2015
【分類號】：TQ325.2;TB306
【共引文獻】
相關期刊論文 前6條
1 匡新謀;鄭長征;楊紅智;蘇敏茹;吉長友;;ABS塑料化學鍍銅工藝的研究[J];西安工程大學學報;2009年01期
2 汪超;程海斌;;空心微球表面化學鍍Ni/Fe-Ni薄膜及其磁性能[J];中國粉體工業(yè);2011年04期
3 王芳;王靜;張海寧;王丹;李彥妮;;雜環(huán)硅烷自組裝膜改性的聚丙烯表面鍍銅研究[J];現代化工;2012年06期
4 楊瓊;陳世榮;汪浩;曹權根;王恒義;謝金平;范小玲;;銀活化液在PCB化學鍍銅的研究[J];印制電路信息;2013年S1期
5 王新海;張永軍;;石英玻璃的微小斜孔加工技術研究[J];新技術新工藝;2013年12期
6 張念椿;劉彬云;;納米鈀材料的制備及其在PCB化學鍍銅中的應用[J];印制電路信息;2014年05期
，本文編號：2177162
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