本文選題：乙酸鹽 + 銅電沉積　； 參考：《Transactions of Nonferrous Metals Society of China》2017年06期

【摘要】：在傳統(tǒng)硫酸沉積銅中甲烷磺酸是一種可選擇的電解液。從環(huán)境友好的乙酸基電解液中電沉積銅,該電解液由乙酸銅、乙酸鈉、甲烷磺酸組成。采用維生素、糖精和4-氨基-3-羥基-1-磺酸作為沉積電解液的添加劑,利用法拉第定律計算陰極電流效率,并使用Haring-Blum電池確定溶液中的金屬分布比。這些添加劑影響了沉積銅薄膜的表面形貌,采用SEM和XRD手段分析其晶粒尺寸。XRD譜表明電沉積銅是多晶面心立方體結構。采用Debye-Scherrer公式計算薄膜的晶粒大小。晶體尺寸表明含電解液添加劑沉積得到的產物具有最小的晶粒尺寸。織構系數(shù)分析表明,所有的銅沉積膜都是多晶結構,晶體擇優(yōu)取向并平行于表面。添加劑導致了均勻的無針孔表面形貌和晶粒細化。
[Abstract]:Methane sulfonic acid is an optional electrolyte in traditional copper deposition with sulfuric acid. Copper was electrodeposited from an environmentally friendly acetic acid electrolyte consisting of copper acetate, sodium acetate and methane sulfonic acid. Vitamin, saccharin and 4-amino-3-hydroxy-1-sulfonic acid were used as additives for deposition electrolyte. The cathodic current efficiency was calculated by Faraday's law, and the metal distribution ratio in solution was determined by Haring-Blum battery. These additives affect the surface morphology of the deposited copper thin films. The grain size. XRD spectra show that the electrodeposition of copper is a polycrystalline cubic structure. Debye-Scherrer formula was used to calculate the grain size of the films. The crystal size indicates that the product deposited with electrolyte additive has the smallest grain size. Texture coefficient analysis shows that all copper films are polycrystalline with preferred orientation and parallel to the surface. The additive resulted in uniform pinhole free surface morphology and grain refinement.
【作者單位】： Electroplating
【分類號】：TB383.1;TF811

【相似文獻】

相關期刊論文 前10條

1 關鋒;高夏南;朱明昌;劉蕾;高恩君;;電解液添加劑苯基丙二酸對電池持續(xù)放電時間影響的研究[J];當代化工;2011年01期

2 張春麗;葉學海;任春燕;付春明;于曉微;;氟代碳酸乙烯酯用作電解液添加劑的研究[J];廣州化工;2013年08期

3 成夙;俞澤民;;解決聚合物鋰離子電池氣脹現(xiàn)象的新方法[J];化學工程師;2006年06期

4 熊琳強;張英杰;董鵬;楊瑞明;夏書標;;鋰離子電池電解液防過充添加劑研究進展[J];化工進展;2011年06期

5 高軍;張焱;施利勇;史鵬飛;莊大高;張棟;;LiFePO_4電池電解液體系研究進展[J];材料導報;2011年23期

6 李連成;葉學海;李星s，

本文編號：2075368